JPS61146960U - - Google Patents

Info

Publication number
JPS61146960U
JPS61146960U JP1985030581U JP3058185U JPS61146960U JP S61146960 U JPS61146960 U JP S61146960U JP 1985030581 U JP1985030581 U JP 1985030581U JP 3058185 U JP3058185 U JP 3058185U JP S61146960 U JPS61146960 U JP S61146960U
Authority
JP
Japan
Prior art keywords
integrated circuit
heat sink
fixed
chip
circuit chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985030581U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985030581U priority Critical patent/JPS61146960U/ja
Publication of JPS61146960U publication Critical patent/JPS61146960U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1985030581U 1985-03-04 1985-03-04 Pending JPS61146960U (OSRAM)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985030581U JPS61146960U (OSRAM) 1985-03-04 1985-03-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985030581U JPS61146960U (OSRAM) 1985-03-04 1985-03-04

Publications (1)

Publication Number Publication Date
JPS61146960U true JPS61146960U (OSRAM) 1986-09-10

Family

ID=30530408

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985030581U Pending JPS61146960U (OSRAM) 1985-03-04 1985-03-04

Country Status (1)

Country Link
JP (1) JPS61146960U (OSRAM)

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