JPS61146790U - - Google Patents
Info
- Publication number
- JPS61146790U JPS61146790U JP1814986U JP1814986U JPS61146790U JP S61146790 U JPS61146790 U JP S61146790U JP 1814986 U JP1814986 U JP 1814986U JP 1814986 U JP1814986 U JP 1814986U JP S61146790 U JPS61146790 U JP S61146790U
- Authority
- JP
- Japan
- Prior art keywords
- bellows
- bottom plate
- capillary tube
- solder
- bellows bottom
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Details Of Measuring And Other Instruments (AREA)
- Diaphragms And Bellows (AREA)
Description
第１図はベローズ装置の一例を示した外観図、
第２図はキヤピラリー管の鍔部作成の一例を示す
説明断面図、第３図は本考案によるキヤピラリー
管とベローズ底板の接合を示す説明断面図、第４
図は本考案による、キヤピラリー管とベローズ底
板、並びにベローズとベローズ底板の半田付の状
態を示す断面図である。
１……キヤピラリー管、２……感温部、３……
ベローズ、４……ベローズ底板、７，８……鍔、
９……半田。
Figure 1 is an external view showing an example of a bellows device;
Fig. 2 is an explanatory cross-sectional view showing an example of making the flange of a capillary tube, Fig. 3 is an explanatory cross-sectional view showing the joining of the capillary tube and the bellows bottom plate according to the present invention, and Fig. 4
The figure is a cross-sectional view showing the capillary tube and the bellows bottom plate, as well as the soldering state of the bellows and the bellows bottom plate, according to the present invention. 1... Capillary tube, 2... Temperature sensing part, 3...
Bellows, 4... bellows bottom plate, 7, 8... tsuba,
9...Solder.
Claims (1)
する二段の鍔の間にベローズ底板を挾持して上記
キヤピラリー管の一端を底板内に開口せしめ、ベ
ローズ底板内部に半田を置き、ベローズ底板の内
周面にベローズ端周面を接する如くベローズを置
設し、ベローズ底板外部から熱風加熱して半田を
融解し、キヤピラリー管とベローズ底板、並びに
ベローズとベローズ底板を同時に半田付して接着
してなることを特徴とするベローズ装置。 The bellows bottom plate is sandwiched between the two-stage brim formed on the capillary tube that passes through the bellows bottom plate, one end of the capillary tube is opened into the bottom plate, solder is placed inside the bellows bottom plate, and solder is applied to the inner peripheral surface of the bellows bottom plate. The bellows is installed so that the bellows ends are in contact with each other, the solder is melted by heating with hot air from the outside of the bellows bottom plate, and the capillary tube and the bellows bottom plate, as well as the bellows and the bellows bottom plate, are simultaneously soldered and bonded. bellows device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1814986U JPS61146790U (en) | 1986-02-13 | 1986-02-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1814986U JPS61146790U (en) | 1986-02-13 | 1986-02-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61146790U true JPS61146790U (en) | 1986-09-10 |
Family
ID=30506510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1814986U Pending JPS61146790U (en) | 1986-02-13 | 1986-02-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61146790U (en) |
-
1986
- 1986-02-13 JP JP1814986U patent/JPS61146790U/ja active Pending
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