JPS61144656U - - Google Patents
Info
- Publication number
- JPS61144656U JPS61144656U JP2882985U JP2882985U JPS61144656U JP S61144656 U JPS61144656 U JP S61144656U JP 2882985 U JP2882985 U JP 2882985U JP 2882985 U JP2882985 U JP 2882985U JP S61144656 U JPS61144656 U JP S61144656U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- lever
- component body
- forming
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2882985U JPS61144656U (es) | 1985-02-28 | 1985-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2882985U JPS61144656U (es) | 1985-02-28 | 1985-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61144656U true JPS61144656U (es) | 1986-09-06 |
Family
ID=30527075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2882985U Pending JPS61144656U (es) | 1985-02-28 | 1985-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61144656U (es) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5339460A (en) * | 1976-09-22 | 1978-04-11 | Hitachi Ltd | Device for bending lead wires into form |
| JPS59154053A (ja) * | 1983-02-22 | 1984-09-03 | Takeshi Amakawa | 半導体成形品におけるリ−ド折曲方法及び装置 |
-
1985
- 1985-02-28 JP JP2882985U patent/JPS61144656U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5339460A (en) * | 1976-09-22 | 1978-04-11 | Hitachi Ltd | Device for bending lead wires into form |
| JPS59154053A (ja) * | 1983-02-22 | 1984-09-03 | Takeshi Amakawa | 半導体成形品におけるリ−ド折曲方法及び装置 |