JPS61144651U - - Google Patents
Info
- Publication number
- JPS61144651U JPS61144651U JP2775085U JP2775085U JPS61144651U JP S61144651 U JPS61144651 U JP S61144651U JP 2775085 U JP2775085 U JP 2775085U JP 2775085 U JP2775085 U JP 2775085U JP S61144651 U JPS61144651 U JP S61144651U
- Authority
- JP
- Japan
- Prior art keywords
- fin
- mounting plate
- annular portion
- fin mounting
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
図面は本考案に係る電気素子用放熱器の一実施
例を示し、第１図は分解斜視図、第２図は一部分
を切除した斜視図、第３図は一部分の断面図、第
４図は別の実施例を示す分解斜視図である。
図中１は金属製基板、２は発熱部品、３はフイ
ン取付板、４はフイン、５は環状部、６は切込溝
、７は通孔、８は管状体を示す。
The drawings show an embodiment of the heat sink for electric devices according to the present invention, in which FIG. 1 is an exploded perspective view, FIG. 2 is a partially cut away perspective view, FIG. 3 is a partially sectional view, and FIG. 4 is a partially cut away perspective view. FIG. 7 is an exploded perspective view showing another embodiment. In the figure, 1 is a metal substrate, 2 is a heat generating component, 3 is a fin mounting plate, 4 is a fin, 5 is an annular portion, 6 is a cut groove, 7 is a through hole, and 8 is a tubular body.
Claims (1)
付板を立設し、該フイン取付板に複数のフインを
設けた電子素子用放熱器において、上記フイン取
付板にはその長手方向に沿い環状部を形成すると
共に、複数の切込溝を所定間隔に形成し、上記フ
インにはフイン取付板の環状部に対応する位置に
通孔を穿設し、それぞれのフインを該通孔がフイ
ン取付板の環状部に合致する如く各切込溝に挿し
込み、固着してなる電気素子用放熱器。 (2) 各フインの通孔とフイン取付板の環状部と
に管状体を挿通し、該管状体を拡径したことを特
徴とする実用新案登録請求の範囲第(1)項記載の
電気素子用放熱器。[Scope of Claim for Utility Model Registration] (1) In a heat sink for an electronic device in which a fin mounting plate is provided upright on a metal substrate on which a heat generating component is mounted, and a plurality of fins are provided on the fin mounting plate, The fin has an annular portion along its longitudinal direction, and a plurality of cut grooves are formed at predetermined intervals, and through holes are bored in the fin at positions corresponding to the annular portion of the fin mounting plate. A heatsink for an electric element, which is formed by inserting the through holes into each cut groove so that the holes match the annular portion of the fin mounting plate, and fixing them. (2) The electric element according to claim (1) of the utility model registration claim, characterized in that a tubular body is inserted into the through hole of each fin and the annular portion of the fin mounting plate, and the diameter of the tubular body is expanded. Heatsink for use.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2775085U JPH0333072Y2 (en) | 1985-02-27 | 1985-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2775085U JPH0333072Y2 (en) | 1985-02-27 | 1985-02-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61144651U true JPS61144651U (en) | 1986-09-06 |
| JPH0333072Y2 JPH0333072Y2 (en) | 1991-07-12 |
Family
ID=30524988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2775085U Expired JPH0333072Y2 (en) | 1985-02-27 | 1985-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0333072Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0766336A (en) * | 1993-08-25 | 1995-03-10 | Nec Corp | Heat radiating fin |
-
1985
- 1985-02-27 JP JP2775085U patent/JPH0333072Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0766336A (en) * | 1993-08-25 | 1995-03-10 | Nec Corp | Heat radiating fin |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0333072Y2 (en) | 1991-07-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS61144651U (en) | ||
| JPH02166798A (en) | Heat radiation structure for communication equipment case | |
| JPS61144652U (en) | ||
| JPS61151393U (en) | ||
| JPS61192454U (en) | ||
| JPS61151394U (en) | ||
| JPH01154691U (en) | ||
| JPH0258364U (en) | ||
| JPS624190U (en) | ||
| JPS6183051U (en) | ||
| JPH02132993U (en) | ||
| JPH028148U (en) | ||
| JPS6452248U (en) | ||
| JPS6120057U (en) | Heat sink for semiconductor devices | |
| JPH0361386U (en) | ||
| JPH031444U (en) | ||
| JPS6176966U (en) | ||
| JPH0390449U (en) | ||
| JPS61131840U (en) | ||
| JPS6022841U (en) | radiator | |
| JPS63121451U (en) | ||
| JPS6359340U (en) | ||
| JPH0399484U (en) | ||
| JPH0179893U (en) | ||
| JPS61151165U (en) |