JPS61144642U - - Google Patents
Info
- Publication number
- JPS61144642U JPS61144642U JP1985027841U JP2784185U JPS61144642U JP S61144642 U JPS61144642 U JP S61144642U JP 1985027841 U JP1985027841 U JP 1985027841U JP 2784185 U JP2784185 U JP 2784185U JP S61144642 U JPS61144642 U JP S61144642U
- Authority
- JP
- Japan
- Prior art keywords
- brazing material
- uniform
- thickness
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985027841U JPS61144642U (enExample) | 1985-02-27 | 1985-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985027841U JPS61144642U (enExample) | 1985-02-27 | 1985-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61144642U true JPS61144642U (enExample) | 1986-09-06 |
Family
ID=30525167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985027841U Pending JPS61144642U (enExample) | 1985-02-27 | 1985-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61144642U (enExample) |
-
1985
- 1985-02-27 JP JP1985027841U patent/JPS61144642U/ja active Pending