JPS61144640U - - Google Patents

Info

Publication number
JPS61144640U
JPS61144640U JP2877785U JP2877785U JPS61144640U JP S61144640 U JPS61144640 U JP S61144640U JP 2877785 U JP2877785 U JP 2877785U JP 2877785 U JP2877785 U JP 2877785U JP S61144640 U JPS61144640 U JP S61144640U
Authority
JP
Japan
Prior art keywords
section
magazine
lead frame
bonding
stored
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2877785U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2877785U priority Critical patent/JPS61144640U/ja
Publication of JPS61144640U publication Critical patent/JPS61144640U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案をダイボンデイング装置に適用
した材料供給装置の一実施例の側面を示す図、第
２図は供給部の側面を示す図である。 １……架台、２……フレーム搬送部、３……ダ
イボンデイング部、４……供給部、５……エレベ
ータ装置、６……エレベータ、７１……ダイボン
デイング前のリードフレーム、７２……ダイボン
デイング済のリードフレーム、８……排出部、９
……エレベータ装置、１０……エレベータ、１１
……駆動ローラ、１２……従動ローラ、１３……
搬送ベルト、１４……移送ケース、１５……ハン
ガ。 FIG. 1 is a side view of an embodiment of a material supply device in which the present invention is applied to a die bonding device, and FIG. 2 is a side view of a supply section. DESCRIPTION OF SYMBOLS 1... Frame, 2... Frame conveyance part, 3... Die bonding part, 4... Supply part, 5... Elevator device, 6... Elevator, 7 1 ... Lead frame before die bonding, 7 2 ... ...Die bonded lead frame, 8...Discharge section, 9
...Elevator equipment, 10...Elevator, 11
... Drive roller, 12 ... Followed roller, 13 ...
Transport belt, 14...Transfer case, 15...Hanger.

Claims (1)

【実用新案登録請求の範囲】 供給部に着脱自在にセツトしたマガジンからリ
ードフレームをボンデイング部に給送し、ボンデ
イング終了後の上記リードフレームを排出部に着
脱自在にセツトしたマガジンに収納させるように
した半導体装置製造における材料供給装置におい
て、 上記供給部において空となつた上記マガジンを
上記排出部に移送させる移送手段を具備し、該移
送手段により移送したマガジンに上記ボンデイン
グ終了後のリードフレームが収納されるように構
成したことを特徴とする材料供給装置。[Scope of Claim for Utility Model Registration] A lead frame is fed to a bonding section from a magazine detachably set in a supply section, and the lead frame after bonding is stored in a magazine detachably set in a discharge section. A material supply device for semiconductor device manufacturing, comprising a transfer means for transferring the empty magazine in the supply section to the discharge section, and the lead frame after the bonding is stored in the magazine transferred by the transfer means. A material supply device characterized in that it is configured to
JP2877785U 1985-02-28 1985-02-28 Pending JPS61144640U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2877785U JPS61144640U (en) 1985-02-28 1985-02-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2877785U JPS61144640U (en) 1985-02-28 1985-02-28

Publications (1)

Publication Number Publication Date
JPS61144640U true JPS61144640U (en) 1986-09-06

Family

ID=30526975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2877785U Pending JPS61144640U (en) 1985-02-28 1985-02-28

Country Status (1)

Country Link
JP (1) JPS61144640U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013031049A1 (en) * 2011-08-30 2013-03-07 パナソニック株式会社 Liquid-application device and liquid-application method
WO2013031048A1 (en) * 2011-08-30 2013-03-07 パナソニック株式会社 Liquid-application device and liquid-application method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5352066A (en) * 1976-10-22 1978-05-12 Hitachi Ltd Bonding unit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5352066A (en) * 1976-10-22 1978-05-12 Hitachi Ltd Bonding unit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013031049A1 (en) * 2011-08-30 2013-03-07 パナソニック株式会社 Liquid-application device and liquid-application method
WO2013031048A1 (en) * 2011-08-30 2013-03-07 パナソニック株式会社 Liquid-application device and liquid-application method

Similar Documents

Publication Publication Date Title
JPS61144640U (en)
JPS643752U (en)
JPS64516U (en)
JPS6356119U (en)
JPS646039U (en)
JPS5924325U (en) Bag adhesive press device
JPS64545U (en)
JPS62150419U (en)
JPS6390614U (en)
JPH0196448U (en)
JPS6027681U (en) Noodle strip rolling supply device
JPS6348723U (en)
JPS6341018U (en)
JPS63194842U (en)
JPS6180721U (en)
JPS62127334U (en)
JPS641849U (en)
JPS6234426U (en)
JPH034127U (en)
JPH03130235U (en)
JPS63170040U (en)
JPS5967206U (en) Regulating device for veneer veneer
JPS5949437U (en) material feeding device
JPH03126259U (en)
JPS6220017U (en)