JPS61144640U - - Google Patents
Info
- Publication number
- JPS61144640U JPS61144640U JP2877785U JP2877785U JPS61144640U JP S61144640 U JPS61144640 U JP S61144640U JP 2877785 U JP2877785 U JP 2877785U JP 2877785 U JP2877785 U JP 2877785U JP S61144640 U JPS61144640 U JP S61144640U
- Authority
- JP
- Japan
- Prior art keywords
- section
- magazine
- lead frame
- bonding
- stored
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2877785U JPS61144640U (ar) | 1985-02-28 | 1985-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2877785U JPS61144640U (ar) | 1985-02-28 | 1985-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61144640U true JPS61144640U (ar) | 1986-09-06 |
Family
ID=30526975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2877785U Pending JPS61144640U (ar) | 1985-02-28 | 1985-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61144640U (ar) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013031049A1 (ja) * | 2011-08-30 | 2013-03-07 | パナソニック株式会社 | 液剤塗布装置及び液剤塗布方法 |
| WO2013031048A1 (ja) * | 2011-08-30 | 2013-03-07 | パナソニック株式会社 | 液剤塗布装置及び液剤塗布方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5352066A (en) * | 1976-10-22 | 1978-05-12 | Hitachi Ltd | Bonding unit |
-
1985
- 1985-02-28 JP JP2877785U patent/JPS61144640U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5352066A (en) * | 1976-10-22 | 1978-05-12 | Hitachi Ltd | Bonding unit |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013031049A1 (ja) * | 2011-08-30 | 2013-03-07 | パナソニック株式会社 | 液剤塗布装置及び液剤塗布方法 |
| WO2013031048A1 (ja) * | 2011-08-30 | 2013-03-07 | パナソニック株式会社 | 液剤塗布装置及び液剤塗布方法 |