JPS61143580A - Partial chemical plating method of non-metallic member - Google Patents

Abstract

PURPOSE:To simplify a plating stage and to obtain a pecision pattern having excellent adhesive strength by sticking a catalytic metallic compd. to the surface of a non-metallic member then irradiating a laser abeam to the partical platiang part to reduce said compd. then subjecting the surface to chemical platiang by the conventional practice after washing. CONSTITUTION:The catalyatic metallic compd. is stuck on the surface of the non-metallic member 1 such as Al2O3 substrate and thereafter the laser beam 3 is irradiated to the partial platiang part 2 on the surface of the above- mentioned member 1 to heat locally the platiang part 2 and to reduce the catalytic metallic compd. The catalytic metallic compd. except in the platiang part is then washed away and the surface is subjected to the chemical plating in accordance with the conventional practice, by which the surface of the non-metallic member 1 is subjected to the partial platiang of the desired part. The compd. of Pd, Pt. Ag or Cu,or example, PdCl2, PtBr4, AgNO3, CuSO4, etc., are more preferably used for the catalytic metallic compd.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method for partial chemical plating of non-metallic members, and in particular, to economical partial chemical plating of precise patterns with excellent adhesive strength on the surface of non-metallic members. It is something to do.

[Conventional technology]

Generally, Cu, Ni, 3n, and ALI are used on the surface of nonmetallic materials such as plastics and ceramics.

A chemical plating method in which a metal such as AQ is deposited electrolessly to form a metal film is widely used for the purpose of metallizing. Particularly in the field of electronics, electrodes and circuits of electronic components that are partially plated only on desired parts are used. In order to perform such partial plating, the surface of the non-metallic member is etched to make it a rough surface, and then S
n salt is attached as a sensitizing agent and co-catalyst, and Pd
After adsorbing the salt, chemical plating is applied to the entire surface, and then the plated metal other than the desired areas is removed by etching or the like. In some cases, after etching the surface to make it rough, a paste-like catalyst is printed and coated on the desired plating pattern, and then chemical plating is carried out.

[Problem that the invention seeks to solve]

All of the above partial plating methods not only have poor adhesive strength and plating speed, but also involve complicated processes and are uneconomical, which is a major obstacle to the industrial use of partial chemical plating. In other words, in general, Sn"1 salt is attached as a sensitizing agent or co-catalyst, and Pb j!! is adsorbed onto it. This results in a state in which about 100 Pd particles are mechanically attached, and the catalytic effect is lost. Not only is it insufficient, but it also lacks adhesive strength.

To improve this, plating nuclei are generated on the catalyst.

Attempts have been made to disperse Pd powder in advance in printed circuit boards, etc., from the point of growth.
Unable to obtain sufficient adhesion and plating speed. Such defects become more noticeable in partial chemical plating of precision patterns.

[Means for solving problems]

In view of this, after various studies, the present invention has developed a partial chemical plating method that can economically form a precise pattern of partial plating with excellent adhesive strength on a desired part of the surface of a non-metallic member. After attaching a catalytic metal compound to the surface of a non-metallic member, the partially plated part of the surface is irradiated with a laser beam to reduce the catalytic metal compound in the partially plated part by heating, and then the catalytic metal compound other than the partially plated part is cleaned. This method is characterized by performing chemical plating after removal.

That is, in the present invention, after a catalytic metal compound is attached to the surface of a non-metallic member, the partially plated portion (2) on the surface of the non-metallic member (1) is irradiated with a laser beam 11 (3) as shown in FIG. By heating the partially plated part (2) locally,
The catalytic metal compound in the plated portion (2) is reduced. Next, after washing and removing the catalytic metal compound other than the partially plated part (2), chemical plating is performed according to a conventional method.
1) Partial plating of desired pattern on the surface of )! It is something that I do.

As shown in the figure, the laser beam (3) is emitted from the laser light source (4) and passes through an optical system such as a reflecting mirror (5) and a condensing lens (6) to the non-metallic member (1). Irradiate the surface. The laser beam is usually in the form of a spot with a diameter of several tens of microns or less, and when a larger pattern is to be irradiated, the laser beam or a nonmetallic member is scanned. The laser beam is usually in the form of a spot with a diameter of several tens of microns or less, and when a larger pattern is to be irradiated, the laser beam or a nonmetallic member is scanned.

Further, as shown in FIG. 2, there are spot-shaped plated portions (2>, (2')) which are intermittent on the surface of the non-metallic member (1).

(2″), scan the nonmetallic member (1) or the laser beam in the vertical or horizontal direction to irradiate the plated part (2) with the laser beam, and then irradiate the plated part (2) with the laser beam. The nonmetallic member (1) or the laser beam may be scanned at intervals, the laser beam may be applied to the plated portion (2'), and this may be repeated.Such scanning can be easily automated. Although the power density of the laser beam is not necessarily constant depending on the type of catalytic metal compound and the material of the non-metallic member, it is generally about 102 to 106 W/ci, and as a laser light source, a medium to high output of 0.1 W or more is used. A
A laser such as r gas, YAG (Nd) solid, CO gas, etc. is used.

As a catalytic metal compound, Pd C! z, Pd(N
Os )z , Pd (NH3)2 , Pd SO+
Pd (NOx)z, Cu (HCOO)z
, Cu(NH3)4C,ez, Cu804,
AgF.

Ag SO+, Ag NO3, A! II 1. A
oCN.

Pt C1, Kz Pt (CN)+, Pt Br
+, etc., and adheres to the surface of non-metallic members as a solution of water, alcohol, ether, etc. or as a solid powder.

After laser beam irradiation, water, alcohol, or the like is used to completely remove and recover the catalytic metal compound in areas other than the partially plated area. To further ensure perfection, lightly etch using acid or the like. After that, Cu, Ni, Sn, Ao,
Salt J-M base agents such as Au, such as formalin, formic acid, N
a Hz POz.

It is chemically plated to the desired thickness by immersing it in a mixed solution with dimethylamine borane, etc.

[For production]

By irradiating the laser beam, the partially plated part of the nonmetallic member and the catalytic metal compound on the plated part are locally heated to a high temperature, and the compound undergoes thermal decomposition and is reduced to metal particles, and at the same time, the nonmetallic part and the metal Since at least one of the particles melts and mixes, the nonmetallic member and the metal particles are firmly adhered.

That is, all of the above catalytic metal compounds are thermally decomposed at 100 to 1000°C, resulting in pd, Pt, A! J and the like are simply reduced, and Cu is a reducing gas generated when the compound is decomposed, for example, in the case of Cu(HCOO)z, CO and H2 effectively act on the reaction with the nonmetallic member.

Furthermore, it is possible to mix a reducing substance such as an alcohol, an amine, or an aldehyde with the catalytic metal compound, or to irradiate it with a laser beam in an atmosphere of Hz or CO, thereby making it possible to further improve the adhesive strength. In addition, since the laser beam irradiation is instantaneous and sufficient for less than 1 second in most cases, for example 0.01 to 0.5 seconds, crystal growth of the reduced metal particles is difficult to occur, and they are formed in fine particles at a high density. do. Therefore, the catalytic activity can be increased, and the plating speed and plating adhesion in chemical plating can be greatly improved.

Example (1) After cleaning a 2-inch wide AfzO3 (96%) substrate with a synthetic detergent, it was immersed in an aqueous solution of 2% Pd Cfz and 15% alcohol for 1 minute to adhere Pd C, eZ. Dry. This was run at a speed of 7.5 s/sin, and a 7W YAG (Nd) solid-state laser beam was focused on the substrate using a quartz lens, and the substrate was shifted by 0.025 m+ in the width direction for each run. After repeating the laser beam irradiation three times, rare HCJ! Wash for 1 minute using an aqueous solution (80℃) to remove pdC,e< attached to areas other than the laser beam irradiation area, then wash with water, and then wash with water using a chemical Cu plating solution ELC-H bath (60℃ ) for 3 hours to form a Cu circuit with a width of 1 m and a thickness of 12 μm on the substrate. In order to test the adhesive strength, the substrate was bent and broken, the Cu circuit was beaded, and compared with a conventional product.

In the conventional product, the above substrate is immersed in an aqueous HF (45%) solution for 3 minutes to roughen the surface, then washed with water, and then
(5%) aqueous solution, and then immersed in an aqueous solution containing 2% PdCJ2z and 15% alcohol for 1 minute. This was immersed in the same Cu plating solution as in Example (1) for 3 hours to plate the entire surface with Cu (plating thickness: 10 μm), washed with water, dried, and formed a liquid resist film according to a conventional method. A circuit with a width of 0.11n11 was exposed and processed by F.
e The Cu plating other than the circuit part was removed using a Cf3 solution, and then the resist film on the circuit part was removed.

In the case of the plating method according to the present invention, the Cu circuit was broken, whereas in the case of the conventional product, the Cu circuit was AJI! It was peeled off from the zO3 substrate. As described above, it can be seen that the method of the present invention not only has a much simpler plating process than the conventional method, but also has superior adhesion.

Example (2) The same process as in Example (1) was carried out except that a Pt solution (ptl, 5%) dissolved in aqua regia was used instead of Pd C, ez, and the output of the laser beam was 6W.

As a result, the thickness of the Cu circuit was 10μ, and the thickness of the Cu circuit was 10μ.
No peeling of the circuit was observed.

Example (3) In Example (1), AgN was used instead of Pd C,ez.
0! The same treatment was performed using a solution (A Oi, s%) and setting the output of the laser beam to 4W. As a result, the thickness of the Cu circuit was 9 μm, and no peeling of the Cu circuit due to bending and breakage was observed.

Example (4) In Example (1), Cu (
The same process was carried out using a HCOO)z solution (3% Cu) and a laser beam output of 6W.

As a result, the thickness of the Cu circuit was 8μ, and the thickness of the Cu circuit was
No peeling of the u circuit was observed.

〔Effect of the invention〕

As described above, according to the present invention, not only is the plating process simplified and economical, but also the plating speed is high, plating with strong adhesive strength can be obtained, and high-precision plating can be performed in any desired pattern. It has significant industrial effects such as:

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram showing the laser beam irradiation process of the present invention, and FIG. 2 is an explanatory diagram of the laser beam irradiation of intermittent spot-shaped plated parts according to the present invention. 1. Non-metallic member 20 partially plated portion 3. Laser beam 4. Laser light source 5, reflecting mirror 6. Condensing lens Fig. 1 Fig. 2

Claims (2)

[Claims] (1) After attaching a catalytic metal compound to the surface of a non-metallic member, the partially plated part on the surface is irradiated with a laser beam to thermally decompose the catalytic metal compound in the partially plated part, and then the catalytic metal compound other than the partially plated part is heated. A partial chemical plating method for non-metallic parts, characterized by performing chemical plating after washing and removing compounds. (2) Pd, Pt, Ag or Cu as a catalytic metal compound
A partial chemical plating method for non-metallic members according to claim 1 using a catalyst compound of