JPS61142729A - Delta type capacitor and manufacture thereof - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] (Industrial application field) The present invention relates to a Δ-type capacitor and a method for manufacturing the same.

(Prior Art) In order to protect equipment from noise, Δ-type capacitors are used in which capacitors are connected in a Δ-type.

As a capacitor element that constitutes this Δ type capacitor,
Conventionally, for example, metallized plastic film capacitor elements, metallized paper capacitor elements, etc. have been used.

(Problems to be Solved by the Invention) Therefore, they usually have the drawbacks of low heat resistance and low reliability.

An object of the present invention is to provide a Δ-type capacitor and a method for manufacturing the same that can improve the reliability by improving the above-mentioned drawbacks.

(Technical Means for Solving the Problems) In order to achieve the above object, the present invention provides a Δ-type capacitor in which capacitor elements are connected in a Δ-type. The present invention provides a Δ-type capacitor characterized by having a ceramic capacitor element on which an electrode and a second electrode are formed and a common electrode formed on the other surface, and a capacitor element other than the ceramic capacitor element.

In order to achieve the above object, the present invention also provides a first electrode and a second electrode that are insulated and separated from each other on one surface of a ceramic substrate.
a step of forming a common electrode on the other surface and providing a hole penetrating the common electrode to form a ceramic capacitor element; a step of connecting each first lead, second lead, and third lead provided on the lead frame; and a step of connecting another capacitor element between the first lead and the second lead after the step. In the method for manufacturing a Δ-type capacitor, an end of a ceramic substrate is held between the protrusions of a first lead and a second lead having two protrusions in the middle, and the protrusions are connected to a first electrode and a 21st electrode. The present invention also provides a method for manufacturing a Δ-type capacitor, which includes the step of inserting a third lead having a protrusion 1111 in the middle into the hole and connecting the protrusion to the third electrode.

(Function) As described above, in the present invention, since a ceramic capacitor element is used as a part of the capacitor element and wires are connected in a Δ shape, heat resistance is improved and reliability is increased. In addition, since the first lead, second lead, and third lead provided on the lead frame are connected together to the ceramic substrate, each
Easy to connect leads.

(Example> Embodiments of the present invention will be described below based on the drawings.

First, as shown in FIG. 1, a flat ceramic substrate 1 is coated with a metal such as silver, silver palladium, platinum, nickel, copper, zinc, etc., and a first electrode 2 is formed by printing, vapor deposition or plating.
A second electrode 3 and a common electrode 4 are formed. R-shaped depressions 5 and 6 are provided at the ends of the ceramic substrate 1, and the first electrode 2 and the second electrode 3 are provided so as to be insulated from each other, bypassing the ends at predetermined intervals g5 and 6. Further, a hole 7 is provided in the center of the ceramic substrate 1, passing through only the common electrode 4 and not passing through the first electrode 2 and the second electrode 3.

Next, leads are connected to this ceramic substrate 1. That is, a lead frame 8 made of metal such as aluminum as shown in FIG. 2 is used. This lead frame 8 has a bar 9 to a first lead 10 . The second lead 11 and the third lead 12 are pulled out. In particular, the first lead 10 and the second lead 11 are longer than the third lead 12, and each has two protrusions 10-1 and 10-2 facing toward the third lead 12.
11-1 and 11-2 are provided with a WIJ distance equal to the thickness of the ceramic substrate 1 from each other. and the first
The protrusions 10-1 and 11-1 provided at the tips of the lead 10 and the second lead 11 are tapered. Further, the third lead 12 has protrusions 10-2 and 11-.
A protrusion 12-1 is provided at the same height as 2. That is, in order to attach the leads to the ceramic substrate 1 after electrode formation, the first lead 10 and the second lead 11 are passed through the recesses 5 and 6, and between the protrusion 10-1 and the protrusion 10-2 and between the protrusion 1.
The ceramic substrate 1 is sandwiched between the ceramic substrate 1-1 and the protrusion 11-2, and the protrusion 10-1 is connected to the first electrode 2 and the protrusion 11-1 is connected to the second electrode 3. At the same time, the third lead 12 is inserted into the hole 7 and the protrusion 12-1 is connected to the common electrode 4.

After connecting the leads to the ceramic substrate 1, each lead 10, 11 and 12 is cut from the base of the bar 9, and the first lead 10
A fully bent film capacitor element 13 is connected between the first lead 11 and the second lead 11 by soldering or the like.

After connecting the metallized film capacitor element 13, the exterior is formed by resin dipping or by sealing with resin after being housed in a resin case.

That is, according to the above embodiment, since the ceramic substrate 1 is used as a part of the Δ type capacitor, reliability against thermal deterioration and the like is increased. Also, as terminals of the ceramic substrate 1, a first lead 10, a second lead 11, and a third lead 1 are integrally drawn out from the bar 9, as shown in FIG.
Since the ceramic substrate 1 is held between the first lead 10 and the second lead 11, the terminal connection work can be easily performed.

Note that a ceramic substrate without holes is used, and the third
A lead having an L-shaped tip may be used as the lead, which reduces the number of man-hours.

(Effects of the Invention) As described above, according to the present invention, a highly reliable and easy-to-manufacture Δ-type capacitor and its manufacturing method can be obtained.

[Brief explanation of drawings]

Figure 1 is a plan view of the ceramic substrate, Figure 2 is a front sectional view of the ceramic substrate in Figure 1 with leads connected to it,
FIG. 3 shows a front sectional view of the state in which the leads are connected to the metallized film capacitor element. 1...-Ceramic substrate, 2...1'th Fi pole, 3
...Second electrode, 4...Common electrode, 7...Hole,
10...1st lead, 11...2nd lead, 1
2...Third lead, 10-1.10-2.11-1.11-2゜12-1・
...Protrusion, 13...Metalized film capacitor element. Patent applicant: Hitachi Capacitor Co., Ltd. (Figure 1, Figure 3, 1f)

Claims (2)

[Claims] (1) In a △-shaped capacitor in which capacitor elements are connected in a △-shape, a first electrode and a second electrode that are insulated and separated from each other are formed on one side of a ceramic substrate, and a common electrode is formed on the other side. , and a capacitor element other than the ceramic capacitor element. (2) forming a first electrode and a second electrode that are insulated and separated from each other on one surface of the ceramic substrate and forming a common electrode on the other surface to form a ceramic capacitor element;
After the step, a step of connecting the first lead, the second lead, and the third lead provided on the lead frame to the first electrode, the second electrode, and the common electrode; In the method for manufacturing a Δ-shaped capacitor, the first lead and the second lead have two protrusions in the middle.
△ characterized by performing a step of sandwiching the end of the ceramic substrate by the protrusion of the lead, connecting the protrusion to the first electrode and the second electrode, and connecting the third lead to the third electrode. Method of manufacturing capacitors.