JPS6114093A - Laser welding method - Google Patents

Laser welding method

Info

Publication number
JPS6114093A
JPS6114093A JP59132083A JP13208384A JPS6114093A JP S6114093 A JPS6114093 A JP S6114093A JP 59132083 A JP59132083 A JP 59132083A JP 13208384 A JP13208384 A JP 13208384A JP S6114093 A JPS6114093 A JP S6114093A
Authority
JP
Japan
Prior art keywords
welding
penetration
laser
recess
laser light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59132083A
Other languages
Japanese (ja)
Inventor
Mitsuhiro Nishio
光弘 西尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59132083A priority Critical patent/JPS6114093A/en
Publication of JPS6114093A publication Critical patent/JPS6114093A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462Nozzles; Features related to nozzles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20Bonding
    • B23K26/21Bonding by welding
    • B23K26/24Seam welding

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To execute stable laser welding and processing while assuring the formation of penetration beads and allowing the easy expansion of penetration by reflecting the laser light past the keyhole generated in a welding part in the stage of laser welding and heating adequately the rear of the weld zone. CONSTITUTION:The laser light past the keyhole generated in the welding part is reflected by a hollow curved surface 8 provided to the recess 7 of a backing strip and is irradiated on the rear surface in the weld zone of a welding member 3 in the stage of welding said member by the laser light emitted from a welding torch 1. The irradiated part is adequately heated, by which the formation of the penetration beads is assured and the penetration is easily expanded. The welding and processing are thus stabilized. An inert gas may be blown to the recess 7 to prevent the oxidation thereof and in some cases, the inert gas may be blown from the side face of the recess 7. The surface 8 may be made into an interchangeable type.

Description

【発明の詳細な説明】 〔発明の技術°分野〕 本発明はレーザ溶接方法に関する。[Detailed description of the invention] [Technology of invention ° field] The present invention relates to a laser welding method.

〔発明の技術的背景とその問題点〕[Technical background of the invention and its problems]

従来より溶接時の裏当て金として論付き銅板を使用する
ことは一般に行なわれておシ、レーザ溶接においても例
外ではなかったつしかし、これは通常の溶接の延長とし
て使用されているのでありキーホールよシ漏れるレーザ
ビームを積極的に裏波確保、溶込み拡大に利用するとい
う思想は全くなかった。
Conventionally, it has been common practice to use a copper plate as a backing metal during welding, and laser welding is no exception.However, this is used as an extension of normal welding, and keyhole There was no idea of actively using the leaking laser beam to secure back waves and expand penetration.

1パスで健全な貫通溶接を行なうには裏波の形成、確保
が必襞不可欠であるが、従来のレーザ溶接ではエネルギ
ー密度を上げるため、レーザパワーを上げる、溶接速′
度を下げる等の方法がとられていた。キニホールより漏
れるレーザビームKti−顧も払われずこれはむしろ冶
具を熱変形させる要因となっていた。
In order to perform sound penetration welding in one pass, it is essential to form and secure a back wave, but in conventional laser welding, in order to increase the energy density, it is necessary to increase the laser power and welding speed.
Measures were taken to lower the level. No attention was paid to the laser beam Kti leaking from the kinihole, which rather caused thermal deformation of the jig.

〔発明の目的〕[Purpose of the invention]

本発明は裏波形成の確保と溶は込み拡大に寄与するレー
ザ溶接方法を提供することを目的とする。
An object of the present invention is to provide a laser welding method that contributes to ensuring the formation of back waves and expanding the penetration.

〔発明の概要〕[Summary of the invention]

レーザ溶接時に溶接部に形成されるキーホールよシ漏れ
るレーザ光を溶接部に反射させるようKしたものである
It is designed so that the laser beam leaking through the keyhole formed in the welded part during laser welding is reflected back to the welded part.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明を第1図に示す一実施例により説明する。 The present invention will be explained below with reference to an embodiment shown in FIG.

図中において、(1)は溶接トーチでレーザ光(2)を
集束するレンズ(図示せず)が内股されている。f3)
 、 (4)は突き合わせ溶接される溶接部材で銅製の
裏当て板(5)と保持部材(6a) 、 (6b)とK
よシ突き合わせされている溶接部分を除く部分が拘束さ
れている。裏当て板(5)は上記溶接部分の裏面側忙対
向する部分が四部(7)に形成されこの凹部の底面は所
定の曲率をもちかつ上記裏面側に対して凹曲面(8)K
なりかつその面は高反射面に形成されている。凹曲面(
8)と上記溶接部分の裏面との離間距離線3〜5關にさ
れている。裏当て板(5)の一方の側面近傍には上記凹
部(力に向けて凹曲面(8)の黒化防止と溶接部分の裏
面側の酸化防止のために窒素ガス、その他の不活性ガス
を吹き付けるノズル(9)が設けられている。ここで、
上記溶接トーチ(1)と裏当て板(5)とは図示せぬ躯
動装置により相対的に矢印(4)で示す溶接部分に沿っ
て移動するように構成されている。
In the figure, (1) is a welding torch, and a lens (not shown) for focusing a laser beam (2) is placed inside the welding torch. f3)
, (4) are welding parts to be butt welded, including a copper backing plate (5), holding members (6a), (6b), and K.
The parts except the welded parts that are butted together are restrained. The backing plate (5) has four parts (7) that are opposite to the back side of the welded part, and the bottom of this recess has a predetermined curvature and a concave curved surface (8) K with respect to the back side.
and its surface is formed into a highly reflective surface. Concave curved surface (
8) and the back surface of the welded portion is set at 3 to 5 degrees. Near one side of the backing plate (5), nitrogen gas or other inert gas is injected into the recess (to prevent the concave curved surface (8) from blackening due to force and to prevent oxidation on the back side of the welded part). A spray nozzle (9) is provided, where:
The welding torch (1) and the backing plate (5) are configured to move relative to each other along a welding portion indicated by an arrow (4) by a sliding device (not shown).

以上の構成において、例えば溶接トーチ(1)を溶接部
分に沿って移動しつp、レーザ光(2)を照射すること
Kよシ、溶接部材(3) 、 (41の突き合わせ部に
溶接部時が形成される。この溶接部(11の形成過程に
おいて、キーホールが生じ、照射中のレーザ光(2)の
一部がこのキーホールよシ溶接部分の裏面側に漏れる。
In the above configuration, for example, the welding torch (1) is moved along the welding part and the laser beam (2) is irradiated to the butt part of the welding parts (3) and (41) when the welding part is being welded. is formed. In the process of forming this welded part (11), a keyhole is generated, and a part of the laser beam (2) being irradiated leaks through this keyhole to the back side of the welded part.

漏れたレーザ光は高反射面に形成されている凹曲面(8
)により反射されて溶接部分の裏面側を照射し同部分を
加熱する。なお、上記溶接加圧ではノズル(9)より不
活性ガスが常時噴出され上記の酸化および黒化をそれぞ
れ防止している。
The leaked laser beam passes through the concave curved surface (8) formed on the highly reflective surface.
) and irradiates the back side of the welded part, heating that part. In addition, during the welding pressurization, inert gas is constantly ejected from the nozzle (9) to prevent the above-mentioned oxidation and blackening.

ところで、上記実施例では裏当て板(5)の一部である
凹曲面(8)を反射面にしたが、これ忙限定されず、例
えば第3図に示すように曲面状の反射鏡α1を交換可能
に凹部(7)K設けるようKしてもよ−。
By the way, in the above embodiment, the concave curved surface (8) which is a part of the backing plate (5) is used as a reflective surface, but this is not limited to this. For example, as shown in FIG. It is also possible to provide a recess (7) K so that it can be replaced.

また、不活性ガスの供給については第4図に示すように
、凹部(7)の内側面から噴出させるように多数の噴出
孔(11)を設けて供給するよう忙してもよ込、さらに
凹部(7)の底面のみ反射面とせず、@面も反射面とす
れば、側面に入射レーザ光の活用の増大が図れる。第5
図は溶接部材H、f13を角溶接する実施例を示すもの
で、溶接部の裏側に対向する部分を曲面状に切欠した支
持部材aaを配設し溶接するようにしたものである。こ
の実施例では上記切欠した部分が反射面に形成されて−
て、溶接時に上記実施例と同様不活性ガスが供給される
01′なお、裏当て板(5)および支持部材(141は
昇温するため、水冷その他の冷却手段が付加されるのが
好ましい。
Regarding the supply of inert gas, as shown in FIG. If only the bottom surface of (7) is made a reflective surface, and the @ surface is also made a reflective surface, the use of incident laser light on the side surface can be increased. Fifth
The figure shows an example in which welding members H and f13 are corner welded, in which a supporting member aa having a curved cutout is disposed on the opposite side of the welding part and welding is performed. In this embodiment, the cutout portion is formed on the reflective surface.
During welding, an inert gas is supplied as in the above embodiment.01' Note that since the temperature of the backing plate (5) and support member (141) increases, it is preferable to add water cooling or other cooling means.

〔発明の効果〕〔Effect of the invention〕

溶接時に溶接部より漏れたレーザ光を溶接部の裏側に照
射するようにしたので溶接部の裏側が適切に加熱され、
裏波形成が確保され、溶は込み拡大が容易となυ、安定
したレーザ溶接加工が行えるようになったり
During welding, the laser light leaking from the welded part is irradiated onto the back side of the welded part, so the back side of the welded part is heated appropriately.
Uranami formation is ensured, weld penetration is easy to expand, and stable laser welding can be performed.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例を説明するための構成図、第
2図は第1図の側面図、第3図乃至第5図は本発明の他
の実施例を説明するための斜視図である。 (1)・・・溶接トーチ、 (2)・・レーザ光、(3
) 、 (41・・・溶接部材、(5)・・・裏当て板
。 (6a) 、(6b)・・保持部材、(8)・・・凹曲
面、(9)・・ノズル。 代理人 弁理士  則 近 憲 佑 (ほか1名) 第 1 図 112図 第3図 第5図 114図
FIG. 1 is a configuration diagram for explaining one embodiment of the present invention, FIG. 2 is a side view of FIG. 1, and FIGS. 3 to 5 are perspective views for explaining other embodiments of the present invention. It is a diagram. (1)...Welding torch, (2)...Laser light, (3
), (41... Welding member, (5)... Backing plate. (6a), (6b)... Holding member, (8)... Concave curved surface, (9)... Nozzle. Agent. Patent Attorney Noriyuki Chika (and 1 other person) Figure 1 Figure 112 Figure 3 Figure 5 Figure 114

Claims (1)

【特許請求の範囲】[Claims] レーザ溶接方法において、レーザ溶接時に溶接部分に生
じたキーホールを通過したレーザ光を上記溶接部分の裏
面側へ反射せしめて溶接することを特徴とするレーザ溶
接方法。
A laser welding method characterized in that the laser beam that passes through a keyhole formed in a welded part during laser welding is reflected to the back side of the welded part to perform welding.
JP59132083A 1984-06-28 1984-06-28 Laser welding method Pending JPS6114093A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59132083A JPS6114093A (en) 1984-06-28 1984-06-28 Laser welding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59132083A JPS6114093A (en) 1984-06-28 1984-06-28 Laser welding method

Publications (1)

Publication Number Publication Date
JPS6114093A true JPS6114093A (en) 1986-01-22

Family

ID=15073100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59132083A Pending JPS6114093A (en) 1984-06-28 1984-06-28 Laser welding method

Country Status (1)

Country Link
JP (1) JPS6114093A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009034713A (en) * 2007-08-02 2009-02-19 Nippon Sharyo Seizo Kaisha Ltd Laser beam welding method
US7655881B2 (en) * 2001-06-15 2010-02-02 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation stage, laser irradiation optical system, laser irradiation apparatus, laser irradiation method, and method of manufacturing a semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7655881B2 (en) * 2001-06-15 2010-02-02 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation stage, laser irradiation optical system, laser irradiation apparatus, laser irradiation method, and method of manufacturing a semiconductor device
JP2009034713A (en) * 2007-08-02 2009-02-19 Nippon Sharyo Seizo Kaisha Ltd Laser beam welding method

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