JPS61140574U - - Google Patents

Info

Publication number

JPS61140574U

JPS61140574U JP2284685U JP2284685U JPS61140574U JP S61140574 U JPS61140574 U JP S61140574U JP 2284685 U JP2284685 U JP 2284685U JP 2284685 U JP2284685 U JP 2284685U JP S61140574 U JPS61140574 U JP S61140574U

Authority

JP

Japan

Prior art keywords

hybrid integrated

integrated circuit

metal film

package

circuit device

Prior art date

1985-02-20

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000002184 metal Substances 0.000 claims description 3
• 239000000758 substrate Substances 0.000 claims description 2
• 229920003002 synthetic resin Polymers 0.000 claims 1
• 239000000057 synthetic resin Substances 0.000 claims 1
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
• 239000004020 conductor Substances 0.000 description 1
• 238000004806 packaging method and process Methods 0.000 description 1

Cited By (1)