JPS61140560U - - Google Patents

Info

Publication number

JPS61140560U

JPS61140560U JP2456385U JP2456385U JPS61140560U JP S61140560 U JPS61140560 U JP S61140560U JP 2456385 U JP2456385 U JP 2456385U JP 2456385 U JP2456385 U JP 2456385U JP S61140560 U JPS61140560 U JP S61140560U

Authority

JP

Japan

Prior art keywords

chip

bonding

flexible substrate

light receiving

receiving element

Prior art date

1985-02-21

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 6
• 239000000758 substrate Substances 0.000 claims description 6
• 239000000853 adhesive Substances 0.000 claims description 2
• 230000001070 adhesive effect Effects 0.000 claims description 2
• PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
• 239000010931 gold Substances 0.000 description 1
• 229910052737 gold Inorganic materials 0.000 description 1