JPS61140533U - - Google Patents
Info
- Publication number
- JPS61140533U JPS61140533U JP1985023997U JP2399785U JPS61140533U JP S61140533 U JPS61140533 U JP S61140533U JP 1985023997 U JP1985023997 U JP 1985023997U JP 2399785 U JP2399785 U JP 2399785U JP S61140533 U JPS61140533 U JP S61140533U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- conductor layer
- layer formed
- conductor
- back surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims 4
- 239000000919 ceramic Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985023997U JPS61140533U (US06265458-20010724-C00056.png) | 1985-02-21 | 1985-02-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985023997U JPS61140533U (US06265458-20010724-C00056.png) | 1985-02-21 | 1985-02-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61140533U true JPS61140533U (US06265458-20010724-C00056.png) | 1986-08-30 |
Family
ID=30517742
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985023997U Pending JPS61140533U (US06265458-20010724-C00056.png) | 1985-02-21 | 1985-02-21 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61140533U (US06265458-20010724-C00056.png) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5010564A (US06265458-20010724-C00056.png) * | 1973-05-25 | 1975-02-03 | ||
JPS5028769A (US06265458-20010724-C00056.png) * | 1973-07-13 | 1975-03-24 |
-
1985
- 1985-02-21 JP JP1985023997U patent/JPS61140533U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5010564A (US06265458-20010724-C00056.png) * | 1973-05-25 | 1975-02-03 | ||
JPS5028769A (US06265458-20010724-C00056.png) * | 1973-07-13 | 1975-03-24 |