JPS6113942U - Semiconductor device mounting structure - Google Patents
Semiconductor device mounting structureInfo
- Publication number
- JPS6113942U JPS6113942U JP9791984U JP9791984U JPS6113942U JP S6113942 U JPS6113942 U JP S6113942U JP 9791984 U JP9791984 U JP 9791984U JP 9791984 U JP9791984 U JP 9791984U JP S6113942 U JPS6113942 U JP S6113942U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- mounting structure
- screw
- device mounting
- heat transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図〜第４図は、本考案に係る半導体装置の実装構造
の一実施例を説明するための第１図は要部平面図、第２
図は要部側断面図、第３図は要部拡大断面図、第４図は
第２図の矢視拡大図、第５図は、従来の半導体装置の実
装構造を説明するためのａは側断面図、ｂは矢視図、第
６図は、従来の半導体装置の実装構造の組み立て工程を
説明するための要部側断面図である。
図中、１は半導体装置、２は筐体、３は基板、４，６は
取付金具、７は止めね腰 １１は上部基体、１２はリー
ド端子、１３は伝熱用ねじ、１４はねじ座、２１は筐体
上面、２２は上面凹部、２３は下面凹部、２４は壁、２
５は孔、２６はゴム片、２７は枠金具、２８は凹孔、２
９は円弧状の長孔、４１．６１は基部、４２は柱状部、
４３，−４４，６３，６４はねじ孔、４５，６５は締付
ねじ、６２は上方に突出刷る柱状部、６２′は下方に突
出する柱状部、６６は平行な面取部、をそれぞれ示す。1 to 4 are for explaining one embodiment of the mounting structure of a semiconductor device according to the present invention.
3 is an enlarged sectional view of the essential part, FIG. 4 is an enlarged view taken in the direction of arrows in FIG. 2, and FIG. FIG. 6 is a side sectional view of a main part for explaining an assembly process of a conventional semiconductor device mounting structure. In the figure, 1 is a semiconductor device, 2 is a housing, 3 is a substrate, 4 and 6 are mounting brackets, 7 is a retainer, 11 is an upper base, 12 is a lead terminal, 13 is a heat transfer screw, and 14 is a screw seat. , 21 is the upper surface of the housing, 22 is the upper recess, 23 is the lower recess, 24 is the wall, 2
5 is a hole, 26 is a rubber piece, 27 is a frame fitting, 28 is a recessed hole, 2
9 is an arc-shaped long hole, 41.61 is a base, 42 is a columnar part,
43, -44, 63, 64 are screw holes, 45, 65 are tightening screws, 62 is a columnar part that projects upward, 62' is a columnar part that projects downward, and 66 is a parallel chamfered part, respectively. .
Claims (1)
実装構造を、前記伝熱用ねじを螺入固定するねじ孔を形
成し、該ねじ孔を形成した部分を両面に突出せしめた取
付金具の、該突出部の一方に平行な面取りを形成すると
ともに、前記伝熱用・ねじの先端部を螺圧する止めねじ
を付設したことを特徴とする半導体装置の実装構造。A mounting structure for a semiconductor device having a heat transfer screw formed on the lower surface of a base part is provided with a screw hole into which the heat transfer screw is screwed and fixed, and the portion in which the screw hole is formed is made to protrude from both sides. A mounting structure for a semiconductor device, characterized in that a parallel chamfer is formed on one of the protrusions of the mounting bracket, and a set screw is attached for threading the tip of the heat transfer screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9791984U JPS6113942U (en) | 1984-06-28 | 1984-06-28 | Semiconductor device mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9791984U JPS6113942U (en) | 1984-06-28 | 1984-06-28 | Semiconductor device mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6113942U true JPS6113942U (en) | 1986-01-27 |
| JPH0432760Y2 JPH0432760Y2 (en) | 1992-08-06 |
Family
ID=30657476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9791984U Granted JPS6113942U (en) | 1984-06-28 | 1984-06-28 | Semiconductor device mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6113942U (en) |
-
1984
- 1984-06-28 JP JP9791984U patent/JPS6113942U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0432760Y2 (en) | 1992-08-06 |
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