JPH0432760Y2 - - Google Patents

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a mounting structure for a semiconductor device, and in particular to a semiconductor device that enables accurate and reliable alignment of the semiconductor device in the vertical and horizontal directions. Regarding the implementation structure.

In recent years, there has been a strong tendency for electronic devices to become smaller and more highly integrated.As a result, the electronic components mounted, especially large-scale integrated circuits (hereinafter referred to as semiconductor devices), have become more highly integrated. There is a strong demand for the development of mounting technology for accurately and reliably mounting semiconductor devices.

[Conventional technology]

FIG. 5 is a side cross-sectional view for explaining a conventional semiconductor device mounting structure, b is a side sectional view thereof, and FIG. 6 is a diagram showing the assembly process of a conventional semiconductor device mounting structure. FIG. 2 is a side cross-sectional view of a main part for explanation.

The semiconductor device 1 containing a high-density circuit is cooled by dissipating internal heat to the outside. That is, a circuit chip is housed inside the upper base 11, lead terminals 12 connected to this circuit chip are led out to the outside side of the upper base 11, and a heat transfer terminal for mounting the semiconductor device 1 is provided below. A screw 13 is drilled. This semiconductor device 1
is attached to the main part of the device via heat transfer screws 13 to transfer and radiate heat to the device. Housing top surface 2 of housing 2
1 is mounted with a circuit board 3 having a circuit pattern (not shown) electrically connected to the lead terminals 12 of the semiconductor device 1, and the circuit board 3 is pressed around the circumference by a frame metal fitting 27. The top surface of the casing 2
Fixed to 1. In the figure, 26 is a rubber piece placed between the housing surface 21 and the circuit board 3 as a cushioning material.

A wall 24 is formed between the upper surface recess 22 and the lower surface recess 23 of the housing 2, and a mounting bracket 4 for horizontally positioning the semiconductor device 1 is loosely fitted into a part of this wall 24 and is rotatable. A recessed hole 28 is formed to fit into the. Further, in the bottom surface of the recessed hole 28, arc-shaped elongated holes 29 that open over at least 90 degrees are bored in pairs.

The mounting bracket 4 includes a base 41 that is rotatably formed within the recessed hole 28 and a columnar part 42 that projects upward from the base 41, and a screw hole 43 is provided in the center of the base 41. When the heat transfer screw 13 of the semiconductor device 1 is screwed into the screw hole 43 and the screw seat 14 comes into close contact with the top surface of the columnar part 42 on the mounting bracket 4 side, the semiconductor device 1 is mounted on the mounting bracket 4. That means that. On the circuit board 3 side, there is a hole 3 having a sufficient size so that the screw seat 14 and the upper base 11 do not come into contact with the board 3.
1' is provided. Further, at least four screw holes 44 corresponding to the arc-shaped elongated holes 29 provided on the side of the housing 2 are bored in the base 41 at equal intervals. In the figure, 25 is a hole provided in the center of the base 41.

When attaching the semiconductor device 1 to the mounting bracket 4, as shown in FIG.
Attach the mounting bracket 4 to the mounting bracket 4, place the board 3 on it, and then insert the heat transfer screw 13 of the semiconductor device 1 into the screw hole 43 of the mounting bracket 4 by passing through the hole 31' of the board 3. Screw in and install. Finally, the box-shaped driver 51 is fitted onto the upper base 11 of the semiconductor device 1 and tightened with a predetermined rotational force (torque) to fix the semiconductor device 1 to the mounting bracket 4.

The reason why the semiconductor device 1 is fixed to the mounting bracket 4 using a fastening tool such as the screwdriver 51 is to prevent the semiconductor device 1 from causing a "positional shift phenomenon" during the process.

When the mounting of the semiconductor device 1 is completed, the mounting bracket 4 is removed from the assembly jig 5, and this mounting bracket 4 is then attached to the casing 2. At this time, first, the mounting bracket 4 is inserted into the recessed hole 28 provided on the side of the housing 2, and then the circuit board 3 is fixed to the housing 2.
Finally, the positional deviation of the semiconductor device 1 in the rotational direction is corrected using the elongated hole 29, and the tightening screws 45 are installed with each lead terminal 12 positioned on the circuit pattern (not shown) on the circuit board 3 side. Metal fittings 4
The mounting bracket 4 is fixed to the housing 2 by screwing into the screw hole 44 provided on the side.

Since the four screw holes 44 provided on the mounting bracket 4 side are open over at least 90 degrees to the elongated hole 29, any pair of screw holes 44 are always connected to the elongated hole 29. I'll take a look from there. Then, by screwing the tightening screws 45 into the pair of screw holes 44 seen through the elongated hole 29 and tightening them, the semiconductor device 1 is mounted on the casing 2 via the mounting fittings 4.

[The problem that the idea attempts to solve]

As is clear from the above description, conventionally the semiconductor device 1 is mounted by screwing the heat transfer screw 13 into the screw hole 43 on the mounting bracket 4 side until the screw seat 14 comes into close contact with the columnar part 14 of the mounting bracket 4. It was fixed to mounting bracket 4.

However, in this conventional method, the upper surface position of the columnar part 42 of the mounting bracket 4 and the screw seat 14 of the semiconductor device 1 are
If there is even a slight dimensional variation in the position of the bottom surface of the semiconductor device 1, the lead terminals 12 of the semiconductor device 1 and the circuit board 3 may not make good contact [see Figures 5a and 6 = In these cases, the semiconductor device 1 There is a gap between the lead terminal 12 and the circuit board 3],
Or conversely, a situation may occur in which the degree of contact between them is too strong and the lead terminals 12 are damaged.

The present invention has a structure in which a set screw that is screwed into a screw hole for mounting a semiconductor device from the direction opposite to the semiconductor device is attached, and the vertical position of the semiconductor device is controlled by this set screw. There is no risk of vertical (vertical) misalignment between the lead terminals of the semiconductor device and the circuit board 3.

[Means to solve the problem]

The mounting structure of the semiconductor device according to the present invention is as shown in FIGS. 1, 2, 3, and 4.
By being screwed from the opposite side of the semiconductor device 1 into a mounting bracket 6 that is rotatably arranged at the semiconductor device mounting position in the mounting bracket 6 and a screw hole 63 provided at the rotation center of the mounting bracket 6. a set screw 7 for controlling the vertical position of the semiconductor device 1;
The threaded hole 63 on the mounting bracket 6 side is inserted through the arc-shaped elongated hole 29 for rotation angle control provided on the housing 2 side.
and a tightening screw 65 that fixes the mounting bracket 6 to the housing 2 by being screwed into the housing.
A heat transfer screw 13 is inserted into the screw hole 63 of the mounting bracket 6.
At the point when the lead terminals 12 of the semiconductor device 1 mounted by screwing in contact the circuit board 3 disposed between the mounting bracket 6 and the semiconductor device 1, the setscrew 7 is inserted into the heat transfer screw 13. The structure is such that vertical positioning of the semiconductor device 1 is performed by bringing them into contact with each other.

[Effect]

The set screw 7 locks (fixes) the semiconductor device 1 to the mounting bracket 6 by being screwed into the screw hole 63 of the mounting bracket 6 from the opposite direction to the semiconductor device 1.
do. This utilizes the phenomenon (locking phenomenon) in which the heat transfer screw 13 on the semiconductor device 1 side and the set screw 7 come into contact within the screw hole 63 and lock each other from moving.

Therefore, when the heat transfer screw 13 of the semiconductor device 1 is screwed into the screw hole 63 on the mounting bracket 6 side and the lead terminal 12 comes into contact with the circuit board 3, this operation is temporarily discontinued. Next, screw the set screw 7 into the screw hole 63 from the opposite direction to lock the heat transfer screw 13, and the semiconductor device 1 will be attached to the mounting bracket 6 with each lead terminal 12 in contact with the circuit board 3. Fixed.

The semiconductor device mounting structure according to the present invention allows vertical positioning of the semiconductor device 1 to be
The structure is characterized by the provision of the set screw 7, which can be installed regardless of the shape and dimensions of the mounting bracket 6.

〔Example〕

The mounting structure of a semiconductor device according to the present invention will be described in detail below with reference to the drawings.

1 to 4 are diagrams for explaining one embodiment of the mounting structure of a semiconductor device according to the present invention, in which FIG. 1 is a plan view of the main part, and FIG. 2 is a side sectional view of the main part. , FIG. 3 is an enlarged sectional view of a main part, and FIG. 4 is an enlarged view of FIG. 2 taken in the direction of the arrows. The same parts as in FIGS. 5 and 6 are designated by the same reference numerals. In addition,
In the description of the mounting structure of this semiconductor device, the description of parts that overlap with the conventional one will be omitted.

As shown in FIGS. 1 to 4, the semiconductor device mounting structure according to the present invention is arranged rotatably at the semiconductor device mounting position within the casing 2, thereby determining the horizontal positioning of the semiconductor device 1. The semiconductor device 1 is inserted into a screw hole 63 provided at the center of rotation of the mounting bracket 6 which operates as a means.
a set screw 7 that operates as a vertical positioning means for the semiconductor device 1 by being screwed in from the opposite direction to the heat transfer screw 13 provided on the side;
The threaded hole 64 on the mounting bracket 6 side is inserted through the arc-shaped elongated hole 29 for rotation angle control provided on the housing 2 side.
This mounting bracket 6, on which the semiconductor device 1 is mounted by screwing into the mounting bracket 6, is constituted by a tightening screw 65 that is fixed to the housing 2, and a heat transfer hole 63 is formed in the screw hole 63 of the mounting bracket 6. A circuit board 3 on which a lead terminal 12 of a semiconductor device 1 mounted by screwing a screw 13 is arranged between the mounting bracket 6 and the semiconductor device 1.
The set screw 7 is brought into contact with the heat transfer screw 13 when the heat transfer screw 13 is brought into contact with the heat transfer screw 13 in the best condition, thereby positioning the semiconductor device 1 in the vertical direction.

The mounting bracket 6 that characterizes the present invention includes a base 61 that is configured to be rotatable by loosely fitting into the recess 28 (see FIG. 5a) provided on the side of the housing 2;
A columnar portion 62 that projects upward from this base portion 61;
a columnar part 62' protruding downward from the same base part 61;
It is constituted by a screw hole 63 provided to penetrate through these central portions.

Another member that characterizes the present invention is a set screw 7 that can be screwed into the screw hole 63 of the mounting bracket 6. This set screw 7 is attached to the semiconductor device 1.
When the vertical positioning of the heat transfer screw 13 of the semiconductor device 1 is completed, it is screwed into the screw hole 63 to lock (fix) the heat transfer screw 13 of the semiconductor device 1 to the mounting bracket 6. In this manner, the set screw 7 controls the vertical position of the semiconductor device 1 by coming into contact with the heat transfer screw 13 provided on the semiconductor device 1 side within the screw hole 63.

The operation of the mounting bracket 6 and the set screw 7, which characterize the present invention, will be described below in accordance with the mounting process of the semiconductor device 1.

The mounting bracket 6 is rotatably inserted into the recessed hole 28 (see FIG. 5a) provided on the housing 2 side.

The circuit board 3 is positioned on this mounting bracket 6. This is then fixed to the housing 2 with a frame fitting 27 via a rubber piece 26.

The semiconductor device 1 is mounted on the mounting bracket 6 by passing through the hole 31' of the circuit board 3 (see FIG. 5a). This work is performed by screwing the heat transfer screw 13 provided on the semiconductor device 1 side into the screw hole 63 of the mounting bracket 6, and then attaching the lead terminal 12 of the semiconductor device 1 to the circuit board 3 side in the best condition. This is an operation of contacting a circuit pattern (not shown). This operation moves the semiconductor device 1 in the vertical direction to adjust the relative position between the lead terminals 12 and the circuit board 3.
This is called the vertical positioning operation. Although the method for mounting the semiconductor device 1 is not specified, for example, the semiconductor device 1 may be fixed and a tool may be attached to the parallel chamfered portion 66 on the side of the mounting bracket 6 to rotate the mounting bracket 6;
This is one of the methods of fixing the mounting bracket 6 and rotating the semiconductor device 1 using a box-type driver 51 (see FIG. 6).

Through the above operations, the heat transfer screws 13 of the semiconductor device 1 are inserted into the screw holes 63 on the mounting bracket 6 side, and the lead terminals 12 and the circuit board 3 provided on the semiconductor device 1 side are in the best condition. At the time of contact, the vertical positioning operation of the semiconductor device 1 is temporarily terminated.

When the vertical positioning operation of the semiconductor device 1 is completed, the setscrew 7 is inserted into the heat transfer screw 1.
This screw hole 63 is inserted from the direction opposite to the screwing direction of step 3.
The heat transfer screw 13 of the semiconductor device 1 is brought into contact with the heat transfer screw 13 of the semiconductor device 1. By this operation, the semiconductor device 1 is fixed to the mounting bracket 6 in a state in which the vertical positioning is completed (in a state in which the lead terminals 12 and the circuit board 3 are in optimal contact with each other). Note that when vertically positioning the semiconductor device, either the semiconductor device 1 or the mounting bracket 6 must be rotated, so there is no misalignment between the lead terminals 12 of the semiconductor device 1 and the circuit pattern of the circuit board 3. This may occur.

Therefore, the mounting bracket 6 is rotated to align the lead terminals 12 of the semiconductor device 1 and the circuit board 3, thereby correcting the positional deviation between the lead terminals 12 and the circuit board 3. Note that since the horizontal positioning of the semiconductor device 1 is performed with the semiconductor device 1 fixed to the mounting bracket 6 (the vertical positioning of the semiconductor device 1 has been completed in advance), the circuit board 3 and the lead terminals 1
This operation does not change the degree of contact with 2.

When the vertical and horizontal positioning operations are completed, a tightening screw 65 is screwed into the screw hole 64 provided on the mounting bracket 6 side to fix the mounting bracket 6 to the housing 2. By performing this operation, the vertical and horizontal positional deviations of the semiconductor device 1 are corrected and the semiconductor device 1 is positioned at the normal position.

The mounting structure of the semiconductor device according to the present invention adjusts the horizontal position of the semiconductor device 1 while maintaining the vertical position of the semiconductor device 1. For example, as shown in FIG. lead terminal 12 does not contact the circuit board 3,
Or conversely, failures such as breakage due to too strong contact of the lead terminals 12 with the circuit board 3 are accurately prevented.

[Effect of idea]

As is clear from the above explanation, the mounting structure of the semiconductor device according to the present invention is a method of adjusting the horizontal position of the semiconductor device while maintaining the vertical position of the semiconductor device, which improves work efficiency. It also greatly contributes to improving quality.

[Brief explanation of drawings]

1 to 4 are diagrams for explaining an embodiment of a mounting structure of a semiconductor device according to the present invention,
Fig. 1 is a plan view of the main part, Fig. 2 is a side sectional view of the main part, Fig. 3 is an enlarged sectional view of the main part, Fig. 4 is an enlarged view taken in the direction of the arrow in Fig. 2, and Fig. 5 is a conventional semiconductor device. FIG. 6 is a side cross-sectional view for explaining the mounting structure of a conventional semiconductor device; FIG. 6 is a side cross-sectional view for explaining the assembly process of the conventional semiconductor device mounting structure. In the figure, 1 is a semiconductor device, 2 is a housing, 3 is a circuit board, 4 and 6 are mounting brackets, 7 is a set screw, 11 is an upper base, 12 is a lead terminal, 13 is a heat transfer screw,
14 is a screw seat, 21 is the upper surface of the housing, 22 is a recess on the upper surface, 23 is a recess on the lower surface, 24 is a wall, 25 is a hole, 26
is a rubber piece, 27 is a frame metal fitting, 28 is a recessed hole, 29 is an arcuate long hole, 41 and 61 are bases, 42 is a columnar part,
43, 44, 63, 64 are screw holes, 45, 65 are tightening screws, 62 is a columnar part projecting above the base,
Reference numeral 62' indicates a columnar portion projecting downward from the base, and reference numeral 66 indicates a parallel chamfered portion.

Claims (1)

[Claims for Utility Model Registration] In the mounting structure of the semiconductor device 1, which is equipped with a heat transfer screw 13 that also serves as a mounting screw on one surface of the upper substrate 11, the semiconductor device is rotated at the mounting position of the semiconductor device in the casing 2. a mounting bracket 6 which acts as a horizontal positioning means for the semiconductor device 1 by being arranged so that it can
and a set screw that operates as vertical positioning means for the semiconductor device 1 by being screwed into the screw hole 63 provided at the center of rotation of the mounting bracket 6 from the opposite direction to the heat transfer screw 13. 7, and the mounting bracket 6 is screwed into the screw hole 64 on the mounting bracket 6 side through the arc-shaped elongated hole 29 for rotation angle control provided on the housing 2 side. a screw hole 6 provided in the center of the mounting bracket 6;
The lead terminal 12 of the semiconductor device 1 mounted by screwing the heat transfer screw 13 into the mounting bracket 6
The semiconductor device 1 is positioned in the vertical direction by bringing the setscrew 7 into contact with the heat transfer screw 13 when it contacts the circuit board 3 disposed between the semiconductor device 1 and the semiconductor device 1. Mounting structure of semiconductor devices.