JPS61137905U - - Google Patents
Info
- Publication number
- JPS61137905U JPS61137905U JP2056485U JP2056485U JPS61137905U JP S61137905 U JPS61137905 U JP S61137905U JP 2056485 U JP2056485 U JP 2056485U JP 2056485 U JP2056485 U JP 2056485U JP S61137905 U JPS61137905 U JP S61137905U
- Authority
- JP
- Japan
- Prior art keywords
- container
- hole
- optical fiber
- optical semiconductor
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000013307 optical fiber Substances 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Description
第１図は本考案の一実施例の光半導体装置の断
面を示す図、第２図及び第３図は本考案の他の実
施例を示す断面図、第４図及び第５図は従来技術
を示す図である。 １２…ステム、１３…貫通孔、１４…光フアイ
バ、１５…光半導体素子、１７…キヤツプ、１８
…容器。
面を示す図、第２図及び第３図は本考案の他の実
施例を示す断面図、第４図及び第５図は従来技術
を示す図である。 １２…ステム、１３…貫通孔、１４…光フアイ
バ、１５…光半導体素子、１７…キヤツプ、１８
…容器。
Claims (1)
- 貫通孔を有する容器と、前記貫通孔に挿入され
て前記容器に気密に固定された光フアイバと、該
光フアイバの一端面を覆うように前記容器の内壁
に固定された光半導体素子とを備えた光半導体装
置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2056485U JPS61137905U (ja) | 1985-02-18 | 1985-02-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2056485U JPS61137905U (ja) | 1985-02-18 | 1985-02-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61137905U true JPS61137905U (ja) | 1986-08-27 |
Family
ID=30511171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2056485U Pending JPS61137905U (ja) | 1985-02-18 | 1985-02-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61137905U (ja) |
-
1985
- 1985-02-18 JP JP2056485U patent/JPS61137905U/ja active Pending