JPS61133650A - Semiconductor lead frame - Google Patents
Semiconductor lead frameInfo
- Publication number
- JPS61133650A JPS61133650A JP25519584A JP25519584A JPS61133650A JP S61133650 A JPS61133650 A JP S61133650A JP 25519584 A JP25519584 A JP 25519584A JP 25519584 A JP25519584 A JP 25519584A JP S61133650 A JPS61133650 A JP S61133650A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- bed
- inner lead
- lead frame
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は、半導体装置の製造に用いられる樹脂封止型の
半導体リードフレームの改良に関する口
〔発明の技術的背景及びその問題点〕
半導体装置の製造過程に於いて、素子が形成された半導
体チップは、第2図のような半導体リードフレーム1ノ
のベッド部12に固着され、その電極とインナーリード
13との間がボンディングワイヤにより接続された後、
一点鎖線で示すようにモールド樹脂14によシ封止がな
される。Detailed Description of the Invention [Technical Field of the Invention] The present invention relates to improvements in resin-sealed semiconductor lead frames used in the manufacture of semiconductor devices [Technical background of the invention and problems thereof] During the manufacturing process, the semiconductor chip on which the element was formed was fixed to the bed part 12 of the semiconductor lead frame 1 as shown in FIG. 2, and its electrodes and inner leads 13 were connected by bonding wires. rear,
Sealing is performed by mold resin 14 as shown by the dashed line.
ところで、最近のリードフレーム、特にメモリ関係のリ
ードフレームは、メモリ素子が大型化するに伴いそのベ
ッド部12が大きくなる傾向にある。Incidentally, in recent lead frames, particularly memory-related lead frames, the bed portion 12 tends to become larger as the memory element becomes larger.
そのため、従来のリードフレーム11に於いて、特にベ
ッド部12の長辺部に対向するインナーリード13h、
13h・・・にあっては、モールド樹脂14の端面Aよ
りインナーリード13a。Therefore, in the conventional lead frame 11, especially the inner leads 13h facing the long sides of the bed portion 12,
13h..., the inner lead 13a is from the end surface A of the molded resin 14.
13h・・・の各先端部15までの距離(図に於いてL
で示す)75に非常に短くなる。すなわち、インナーリ
ード13h、13a・・・自体の長さが短くなり、その
ためモールド樹脂14との密着面積を大きくとれないと
いう欠点があった。13h... Distance to each tip 15 (L in the figure)
(shown by ) becomes very short to 75. That is, the length of the inner leads 13h, 13a, . . . themselves becomes short, and therefore, there is a drawback that a large area of contact with the mold resin 14 cannot be secured.
このようにモールド樹脂14との密着面積を大きくとれ
ないと、アウターリード16のダム部17の切断工程、
あるいは曲げ工程等に於いて発生する引張力により、イ
ンナーリード13a813、a・・・がぐらついたり、
さらには抜けてしまうことがある。If a large area of contact with the mold resin 14 cannot be obtained in this way, the process of cutting the dam part 17 of the outer lead 16
Or, the inner leads 13a813, a... may become loose due to tensile force generated during the bending process, etc.
It may even fall out.
本発明は上記実情に鑑みてなされたもので、その目的は
、アウターリードの切断工程等において引張力が発生し
た場合でも、インナーリードのぐらつき、抜けが生じる
ことのない半導体リードフレームを提供することにある
。The present invention has been made in view of the above-mentioned circumstances, and its purpose is to provide a semiconductor lead frame in which inner leads do not wobble or come off even when tensile force is generated during the cutting process of outer leads. It is in.
本発明は、ベッド部に半導体チップが固着され、かつ同
チップの電極とインナーリード部との間のがンディング
配線がなされた後樹脂封止される半導体リードフレーム
に於いて、前記インナーリードのうち引張力に弱い箇所
のインナーリードの、前記ベッド部との対向部に拡幅部
を設け、かつこの拡幅部の前記デンディングに寄4しな
い部分を当該リード面に対して略直角に折曲げ形成する
もので、この折曲部によりリード引張力に対する抵抗力
を増加させるものである。The present invention provides a semiconductor lead frame in which a semiconductor chip is fixed to a bed portion, and after bonding wiring between an electrode of the chip and an inner lead portion is sealed with a resin, one of the inner leads is sealed with a resin. A widened portion is provided at a portion of the inner lead facing the bed portion that is vulnerable to tensile force, and a portion of this widened portion that does not come close to the dending is bent approximately at right angles to the lead surface. This bent portion increases the resistance to the lead tensile force.
以下、図面を参照して本発明の一実施例を説明する。第
1図に於込て、2ノは吊シビン部22に支持されたベッ
ド部であり、このベッド部2ノの周囲に複数のインナー
リード23,23・・・の各先端部が対向配置されてい
る。これらインナーリード23のうち、ベッド部21の
長辺部に対向するインナーリード23a、23aの各先
端部には、拡幅部24が設けられている。Hereinafter, one embodiment of the present invention will be described with reference to the drawings. In Fig. 1, reference numeral 2 is a bed section supported by a hanging shim section 22, and the tips of a plurality of inner leads 23, 23, . . . are disposed facing each other around the bed section 2. ing. Among these inner leads 23, widened portions 24 are provided at the tip portions of each of the inner leads 23a, 23a facing the long side portions of the bed portion 21.
この拡幅部24のボンディングに寄与しない反ベッド側
端面は、リード面に対して直角に折曲げ形成されておシ
折曲片25.25・・・となっている。これら折曲片2
5.25・・・は、マウント工程の前の当該リードフレ
ームの搬送工程の途中に於いて形成してもよく、あるい
はリードフレーム自体のプレス成形の際に同時に形成し
てもよい。The end surface of the widened portion 24 on the side opposite to the bed, which does not contribute to bonding, is bent at right angles to the lead surface to form bent pieces 25, 25, . . . . These folded pieces 2
5.25... may be formed during the transportation process of the lead frame before the mounting process, or may be formed simultaneously during press molding of the lead frame itself.
このように本発明のリードフレームに於いては、インナ
ーリード23a、23h・・・にその抜は方向に対して
直角に折曲片25.25・・・が設けられているので、
モールド樹脂26との接着面積が広くなり、そのため引
張りに対する抵抗力が大きくなる。従って、モールド樹
脂26によシ封止した後、ダム部27の切断工程や、ア
ウターリード28.28・・・の曲げ工程等に於いて引
張力が生じた場合でも、インナーリード2B、23・・
・のぐらつきや抜けの発生が低減される。As described above, in the lead frame of the present invention, since the inner leads 23a, 23h... are provided with bent pieces 25, 25... at right angles to the direction of removal,
The adhesive area with the mold resin 26 becomes larger, and therefore the resistance to tension becomes larger. Therefore, even if tensile force is generated during the cutting process of the dam part 27 or the bending process of the outer leads 28, 28, etc. after sealing with the mold resin 26, the inner leads 2B, 23, etc.・
・The occurrence of wobble and slippage is reduced.
以上のように本発明によれば、インナーリードとモー伶
ド樹脂との密着力が大きくなるので、ダム部の切断工程
等に於いて引張力が生じても、インナーリードの抜けや
ぐらつきの発生を防止することができ、製品の歩留夛を
向上させることが可能となる。As described above, according to the present invention, the adhesion between the inner lead and the mode resin is increased, so even if tensile force is generated during the cutting process of the dam part, the inner lead does not come off or wobble. This makes it possible to improve product yield.
第1図は本発明の一実施例に係る半導体IJ−ドフレー
ムの構成を示す斜視図、第2図は従来の半導体リードフ
レームの構成を示す斜視図である。
21・・・ベッド部、23.23a・・・インナーリー
ド、24・・・拡幅部、25・・・折曲片、26・・・
モールド樹脂。
出願人代理人 弁理士 鈴 江 武 彦6一FIG. 1 is a perspective view showing the structure of a semiconductor lead frame according to an embodiment of the present invention, and FIG. 2 is a perspective view showing the structure of a conventional semiconductor lead frame. 21... Bed part, 23. 23a... Inner lead, 24... Widening part, 25... Bending piece, 26...
mold resin. Applicant's agent Patent attorney Takehiko Suzue 61
Claims (1)
電極とインナーリード部との間のボンディング配線がな
された後樹脂封止される半導体リードフレームに於いて
、前記インナーリードのうち引張力に弱い箇所のインナ
ーリードの、前記ベッド部との対向部に拡幅部を設け、
かつこの拡幅部の前記ボンディングに寄与しない部分を
当該リード面に対して略直角に折曲げ形成したことを特
徴とする半導体リードフレーム。In a semiconductor lead frame in which a semiconductor chip is fixed to a bed part, bonding wiring is made between the electrode of the chip and the inner lead part, and then resin-sealed, a part of the inner lead that is weak against tensile force A widened part is provided in a part of the inner lead facing the bed part,
A semiconductor lead frame characterized in that a portion of the widened portion that does not contribute to the bonding is bent substantially at right angles to the lead surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25519584A JPS61133650A (en) | 1984-12-03 | 1984-12-03 | Semiconductor lead frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25519584A JPS61133650A (en) | 1984-12-03 | 1984-12-03 | Semiconductor lead frame |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61133650A true JPS61133650A (en) | 1986-06-20 |
Family
ID=17275347
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25519584A Pending JPS61133650A (en) | 1984-12-03 | 1984-12-03 | Semiconductor lead frame |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61133650A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6390161A (en) * | 1986-10-02 | 1988-04-21 | Nec Kyushu Ltd | Semiconductor device |
KR20030093774A (en) * | 2002-06-05 | 2003-12-11 | 광전자 주식회사 | Lead Frame, Manufacturing Process of Chip Scale Package Using The Same |
-
1984
- 1984-12-03 JP JP25519584A patent/JPS61133650A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6390161A (en) * | 1986-10-02 | 1988-04-21 | Nec Kyushu Ltd | Semiconductor device |
KR20030093774A (en) * | 2002-06-05 | 2003-12-11 | 광전자 주식회사 | Lead Frame, Manufacturing Process of Chip Scale Package Using The Same |
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