JPS61133531A - Impregnated cathode - Google Patents

Impregnated cathode

Info

Publication number
JPS61133531A
JPS61133531A JP59253354A JP25335484A JPS61133531A JP S61133531 A JPS61133531 A JP S61133531A JP 59253354 A JP59253354 A JP 59253354A JP 25335484 A JP25335484 A JP 25335484A JP S61133531 A JPS61133531 A JP S61133531A
Authority
JP
Japan
Prior art keywords
cathode
impregnated
thermal evaporation
electron emitting
wax material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59253354A
Other languages
Japanese (ja)
Inventor
Katsuhisa Honma
克久 本間
Toru Yakabe
矢壁 徹
Toshiharu Higuchi
敏春 樋口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59253354A priority Critical patent/JPS61133531A/en
Publication of JPS61133531A publication Critical patent/JPS61133531A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J1/00Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
    • H01J1/02Main electrodes
    • H01J1/13Solid thermionic cathodes
    • H01J1/20Cathodes heated indirectly by an electric current; Cathodes heated by electron or ion bombardment
    • H01J1/28Dispenser-type cathodes, e.g. L-cathode

Landscapes

  • Solid Thermionic Cathode (AREA)

Abstract

PURPOSE:To obtain good emission life characteristic through preventing unnecessary thermal evaporation of electron radiating material from the faces except the electron radiating face of a cathode body by fixing wax material to the cathode body by means of laser weld after temporarily sintering it to the cathode body in the reducing atmosphere. CONSTITUTION:The wax material molten in trichlene is applied to the side face of a cathode body 1 by using a writing brush. Subsequently, temporary sintering of the wax material is finished by heating it to the temperature, 1,200 deg.C in the reducing atmosphere. Subsequently, a laser beam is radiated to the side face and back face of the cathoide body 1 the times respectively, a wax material film 11 is formed by fixing the wax material to the cathode body 1 and therefore, the impregnated cathode 20 is formed. Thereby, the thermal evaporation of the impregnated cathode 20 is caused from only the front of the cathode body 1 when the cathode is operated, resultautly the thermal evaporation amount of the electron radiating material can be reduced to about one third of the normal level.

Description

【発明の詳細な説明】 し発明の技術分野〕 本発明は含浸型陰極の改良(1関するものである。[Detailed description of the invention] Technical field of invention] The present invention relates to improvements in impregnated cathodes (1).

〔発明の技術的背景とその問題点〕[Technical background of the invention and its problems]

従来の含浸型陰極構体の一例全第31により説明する。 An example of a conventional impregnated cathode structure will be explained using No. 31.

即ち、粒形が3乃至10μmのタングステン(w)粉末
を圧縮成形したのち還元雰囲気中で焼結して得らtた多
孔質体CBaO、CaO、A7203等からなる電子放
射物質暑高温の還元性雰囲気中で溶融含浸させて得られ
た陰極基体(1)は肉厚25μm のタンタル板をプレ
ス成形して得らtたカップ(2)内に接合材(4)を介
して抵抗溶接され含浸型陰極(10)を構成している。
That is, an electron-emitting material consisting of a porous body CBaO, CaO, A7203, etc., obtained by compression molding tungsten (w) powder with a grain size of 3 to 10 μm and then sintering in a reducing atmosphere. The cathode substrate (1) obtained by melting and impregnating in an atmosphere is resistance welded into a cup (2) obtained by press-forming a tantalum plate with a thickness of 25 μm via a bonding material (4) to form an impregnated mold. It constitutes a cathode (10).

この陰極基体(1)の寸法は例えば外径1.5諺厚さ0
.53翼である。
The dimensions of this cathode substrate (1) are, for example, outer diameter 1.5 and thickness 0.
.. It has 53 wings.

この含浸型陰極(l■は肉厚25μmのタンタル板を加
工して製作された陰極スリーブ(3)の頂部に嵌入され
、溶接点(7)でレーザ光により陰極スリーブ(3)、
カップ(2)及び陰極基体(1)は溶接されている。
This impregnated cathode (l) is fitted into the top of the cathode sleeve (3) made by processing a tantalum plate with a wall thickness of 25 μm, and the cathode sleeve (3) is welded by laser light at the welding point (7).
The cup (2) and the cathode substrate (1) are welded.

上述したカップ(2)を使用する主目的は陰極基体(1
)から熱蒸発によって飛散する物質が陰極スリーブ(3
)中に装着される図示しないヒータに付看するのを防止
するためである。
The main purpose of using the cup (2) described above is to use the cathode substrate (1).
) from the cathode sleeve (3) due to thermal evaporation.
) This is to prevent attention to the heater (not shown) installed in the inside.

上述した陰極スリーブ(3)の底部近傍と、肉厚0、、
L25mのFe−Ni−Co  合金板をプレス成形し
て製作された陰極ホルダー(6)の肩部(61)間には
肉厚Q、Q5mm、幅0,7s11のタンタル製リボン
から形成したストラップ(5)が陰極スリーブ(3)と
は溶接点(8)、ホルダー(6)の肩部とは溶接点(9
)で溶接固定され、含浸型陰極構体を完成する。
Near the bottom of the above-mentioned cathode sleeve (3) and with a wall thickness of 0,
Between the shoulders (61) of the cathode holder (6) manufactured by press-forming a Fe-Ni-Co alloy plate with a length of 25 m, there is a strap (made of tantalum ribbon with a wall thickness of Q, Q5 mm and a width of 0.7 s11). 5) is connected to the cathode sleeve (3) at the welding point (8), and the shoulder of the holder (6) is connected to the welding point (9).
) to complete the impregnated cathode structure.

しかしながら、上述したカップ(2)を使用する構造の
場合、陰極基体(1)の側面とカップ(2)の内側面と
の間隙は0.01 mfi程度の隙間があくことは避け
られない。従って電子放射面以外の方向にあるヒータな
どへの電子放射物質の付着は防ぐことが出来るが、陰極
基体(1)の側面や裏面からの電子放射物質の無効蒸発
はカップ(2)をかぶせない場合とほとんど変わらない
。また接合材(4)ン介して抵抗溶接の際、発生する熱
によって陰極基体(1)内の電子放射物質がかなり滲み
出してくるということもあり、この点でも電子放射物質
が無効消費される。
However, in the case of the structure using the cup (2) described above, it is inevitable that there is a gap of about 0.01 mfi between the side surface of the cathode substrate (1) and the inner surface of the cup (2). Therefore, it is possible to prevent the electron emitting material from adhering to the heater, etc. in a direction other than the electron emitting surface, but the cup (2) cannot be used to prevent the ineffective evaporation of the electron emitting material from the sides and back surface of the cathode substrate (1). It's almost the same as the case. Furthermore, during resistance welding through the bonding material (4), the heat generated causes a considerable amount of electron emitting material in the cathode substrate (1) to ooze out, and in this respect, the electron emitting material is also ineffectively consumed. .

また、接合材(4)によるろう付温度が高いために電子
放射物質を含浸する前にろう付けを行なわなければなら
ない。接合材(4)としてMo−Ru材を使用する場合
を例にとると、先ず水素炉中でろう付する時の温度が約
2000℃とかなり高く、この高温のため多孔質体の不
所望な焼結や変形を生じることになる。
Furthermore, since the brazing temperature of the bonding material (4) is high, brazing must be performed before impregnating the electron emitting material. Taking the case of using Mo-Ru material as the bonding material (4), first, the temperature during brazing in a hydrogen furnace is quite high at approximately 2000°C, and this high temperature may cause undesirable damage to the porous body. Sintering and deformation will occur.

また近年開発さ2″L直性能を有すると云わする5C2
0,が含まわた焼結温度の低い多孔質体については、こ
の方法を用いることができない。さらに接合材(4)が
多孔質体内部へしみ込む深さが不均一であり、また場合
【二よっては数10μmのオーダーまで深くしみ込むこ
ともある。従ってろう付は後C二含浸される電子放射物
質の量が減少し、これも含浸型陰極の寿命を短くする原
因となっている。
In addition, the recently developed 5C2 is said to have 2"L straight performance.
This method cannot be used for porous bodies that contain 0, and have a low cotton sintering temperature. Furthermore, the depth at which the bonding material (4) penetrates into the inside of the porous body is uneven, and in some cases, it may penetrate as deep as several tens of micrometers. Therefore, after brazing, the amount of electron emitting material that is impregnated with C2 is reduced, which also causes a shortening of the life of the impregnated cathode.

〔発明の目的〕[Purpose of the invention]

本発明は上述した諸点に鑑みてなされたものであり、陰
極基体の電子放射面以外の面からの電子放射物質の不要
な熱蒸発を防止し、良好なエミッションライフ特性を有
する含浸型陰極を提供することを目的としている。
The present invention has been made in view of the above-mentioned points, and provides an impregnated cathode that prevents unnecessary thermal evaporation of an electron emitting substance from a surface other than the electron emitting surface of a cathode substrate and has good emission life characteristics. It is intended to.

〔発明の概要〕[Summary of the invention]

即ち、本発明は少なくともWを含む多孔質体に電子放射
物質が含浸されてなる陰極基体の電子放射面を除く全面
または一部を覆うように電子放射物質の熱蒸発を防止し
得る熱蒸発防止部が設けられてなる含浸型陰極において
、前記熱蒸発防止部を形成するろう材あるいはこのろう
材と高融点金属箔等の部材とを還元性雰囲気中で約12
00℃で陰極基体に仮焼結させた後レーザ溶接(二より
陰極基体に固着されていることを特徴とする含浸型陰極
である。
That is, the present invention provides a thermal evaporation prevention method capable of preventing thermal evaporation of the electron emitting material by covering the whole or part of the cathode substrate, which is formed by impregnating the electron emitting material into a porous body containing at least W, except for the electron emitting surface. In the impregnated cathode, the brazing material forming the heat evaporation preventing section or the brazing material and a member such as a high melting point metal foil are heated in a reducing atmosphere for about 12 hours.
It is an impregnated cathode characterized by being temporarily sintered on the cathode base at 00°C and then fixed to the cathode base by laser welding (two screws).

すなわち、本発明においては陰極基体を従来行なわれて
いるろう付のように高温域まで温度を上げる必要がない
こと、及びレーザービームの強度やスポットサイズさら
(−は溶接点の位置や数を任意にすることによって熱蒸
発防止部の固着状態をコントロールできるようにしてい
る。
In other words, in the present invention, there is no need to raise the temperature of the cathode substrate to a high temperature range unlike in conventional brazing, and the intensity of the laser beam, the spot size, and (- means the position and number of welding points can be adjusted arbitrarily). This makes it possible to control the adhesion state of the heat evaporation prevention part.

〔発明の実施例〕[Embodiments of the invention]

次に本発明の含浸型陰極を具備する含浸型陰極構体を第
1図により説明する。
Next, an impregnated cathode structure including an impregnated cathode of the present invention will be explained with reference to FIG.

即ち、粒形が3乃至10μmのタングステン粒末を圧縮
成形したのち、還元雰囲気中で焼結して得られた多孔質
体にB aO、CaO、AA!203等からなる放射物
質を高温の還元性雰囲気中で溶融含浸させて陰極基体m
を作る。この陰極基体(1)の寸法は例えば外形1.5
M、厚さ0.5器である。
That is, after compression molding tungsten particles having a grain size of 3 to 10 μm, BaO, CaO, AA! The cathode substrate m is melted and impregnated with a radioactive substance such as 203 in a high-temperature reducing atmosphere.
make. The dimensions of this cathode substrate (1) are, for example, an outer diameter of 1.5
M, thickness 0.5 mm.

次に約60%Mo −40%Ruにポリスチロール、フ
タルル酸ジオクチルを混合し、ロール機でねり上げたろ
う材ヲトリクレンで溶かして、陰極基体(1)の側面に
筆を用いて塗布する。
Next, polystyrene and dioctyl phthalate are mixed with about 60% Mo - 40% Ru, melted with a brazing filler metal Wotriclean rolled up on a roll machine, and applied to the side surface of the cathode substrate (1) using a brush.

次C二還元雰囲気中で1200℃ 5分間加熱し、ろう
材の仮り焼結が完了する。この仮り焼結のままではろう
材と陰極基体(1)との結合は不完全であるので次にレ
ーザービームを用いて陰極基体(1)にろう材の一部を
シンターして固着させる。
Temporary sintering of the brazing filler metal is completed by heating at 1200° C. for 5 minutes in a C2 reducing atmosphere. Since the bonding between the brazing material and the cathode substrate (1) is incomplete if this temporary sintering remains, a portion of the brazing material is then sintered and fixed to the cathode substrate (1) using a laser beam.

本実施例で用いたレーザーはYAGレーザーのパルスタ
イプであり、パルス幅2m5ec、繰り返L 周波10
 pps 、エネルギー5ジユール/パルス、ビーム径
0.7aφで陰極基体(1)の裏面及び側面に七ねそれ
10回照射し、ろう材の陰極基体(1)への固着を終了
してろう材膜圓を形成し、含浸型陰極(20)を完成す
る。
The laser used in this example is a pulse type YAG laser, with a pulse width of 2 m5ec and a repetition rate of L and a frequency of 10.
pps, energy 5 joules/pulse, beam diameter 0.7aφ, the back and side surfaces of the cathode substrate (1) are irradiated 7 times and 10 times to complete the adhesion of the brazing material to the cathode substrate (1) and form a brazing material film. A circle is formed to complete the impregnated cathode (20).

このレーザーの発振条件、光学系等はそれぞれ製作した
陰極基体(10)や使用するろう材C二よって選択でき
る。
The oscillation conditions, optical system, etc. of this laser can be selected depending on the cathode substrate (10) produced and the brazing material C2 used.

この含浸型陰極(2■は肉厚25μmのタンタル板を加
工して製作さした陰極スリーブ(121の頂部に1代入
さし溶接溶接点(7)でレーザ光により陰極スリーブ(
3)、ろう材膜OD及び陰極基体(1)は溶接される。
This impregnated cathode (2) is a cathode sleeve (121) manufactured by processing a tantalum plate with a wall thickness of 25 μm, and is inserted into the top of the welding point (7).
3) The brazing material film OD and the cathode substrate (1) are welded.

この陰極スリーブ(3ンの底部近傍と、肉厚0.125
nのFe−N1−co合金板をプレス成形して製作され
た陰極ホルダー(6)の肩部間には肉厚0.05ii、
幅0.7器のタンタル製リボンから形成したストラップ
(5)が陰極スリーブとは溶接点(8)、肩部とは溶接
点(9)で溶接固定され含浸型陰極構体を完成する。
This cathode sleeve (near the bottom of 3 mm and wall thickness 0.125 mm)
There is a wall thickness of 0.05ii between the shoulders of the cathode holder (6) manufactured by press-forming an Fe-N1-co alloy plate of n.
A strap (5) formed from a tantalum ribbon with a width of 0.7 mm is welded and fixed to the cathode sleeve at a welding point (8) and to the shoulder at a welding point (9) to complete an impregnated cathode structure.

上述した含浸型陰極f20) (二おいては、1200
℃と従来より極めて低い温度で仮り焼結出来るので成子
放射物質が含浸済みの陰極基体(1)へのろう付けも可
能となる。また電子放射物質の陰極動作時g二おける熱
蒸発は、はぼ陰極基体(1)の前面からのみと考えられ
る。従って従来例に比較し電子放射物質の熱蒸発匿は約
l/3(二低減される。
The above-mentioned impregnated cathode f20) (for the second case, 1200
Since it can be temporarily sintered at a temperature much lower than that of the conventional method, such as 0.degree. C., it is also possible to braze the cathode substrate (1) impregnated with a seiton emissive material. It is also considered that thermal evaporation of the electron emitting material during cathode operation occurs only from the front surface of the cathode substrate (1). Therefore, compared to the conventional example, the thermal evaporation of the electron emitting material is reduced by about 1/3 (2).

実際に実施例と従来例の含浸型陰極のエミッション特性
を試験した結果、第2図に示すようC二実施例では曲線
01)(二示すようf二時間に対するエミッションの変
化は少ないが、従来例では曲fJ +221に示すよう
C1時間C二対するエミッションの変化が多くなった。
As a result of actually testing the emission characteristics of the impregnated cathode of the embodiment and the conventional example, as shown in Fig. 2, in the C2 embodiment, the change in emission with respect to time is small (curve 01) (as shown in Fig. 2), but in the conventional example As shown in the song fJ +221, there was a large change in emissions from time C1 to time C2.

この第2図で縦軸はIIQQ  ′Cb(br igb
tnessTemperature )での無電界のエ
ミッションをとり、陰極ローディングがl A/dとな
っている。
In this figure 2, the vertical axis is IIQQ 'Cb (br igb
Emissions without an electric field are taken at tnessTemperature), and the cathode loading is 1 A/d.

第2図かられかるようにエミッションの減衰速度は従来
例の1/2以下であり、従って実施例の含浸型陰&が従
来例よりも2倍以上の寿命を有すると云える。
As can be seen from FIG. 2, the decay rate of emissions is less than half of that of the conventional example, and therefore it can be said that the impregnated type negative & of the embodiment has a life more than twice that of the conventional example.

上述した実施例では、電子放射物質の熱蒸発防止にろう
制を用いたが、これに限定されるものではなく、ろう材
を介して高融点金属箔や薄板などの部組をろう付けする
ことも可能である。
In the above-mentioned embodiment, a brazing system was used to prevent thermal evaporation of the electron emitting material, but the present invention is not limited to this, and it is also possible to braze parts such as high-melting point metal foils or thin plates through a brazing material. is also possible.

また従来例に比較し焼結温度が低いのン利用して5C2
03入りの多孔質体を使用しても変形や縮みがなく、ま
たろう材のもぐり込みが少ない利点もある。更に陰石基
体の部分的なろう付けC二も応用でき、かつ、ろう付は
状態のコントロールも容易である利点もある。
Also, taking advantage of the lower sintering temperature compared to the conventional example, 5C2
Even if a porous body containing 03 is used, there is no deformation or shrinkage, and there is also the advantage that there is little penetration of the brazing filler metal. Furthermore, partial brazing C2 of the underground stone base can also be applied, and brazing has the advantage that the condition can be easily controlled.

〔発明の効果〕〔Effect of the invention〕

上述のように本発明によれば電子放射物質の熱蒸発社が
少なく、ライフの長い含浸型陰極を提供することができ
る。
As described above, according to the present invention, it is possible to provide an impregnated cathode with a long life and less thermal evaporation of the electron emitting material.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の含浸型陰極の一実施例を装着した含浸
型陰極構体の一部切欠斜視図、第2図は実施例と従来例
とのエミッションを対比して示ス曲線図、第3図は従来
の含浸型陰極を装着した含浸陰極構体一部切欠斜視図で
ある。 l・・・陰極基体     3・・・陰極スリーブ5・
・・ストラップ    6・・・陰極ホルダー11・・
・ろう材膜
FIG. 1 is a partially cutaway perspective view of an impregnated cathode structure equipped with an embodiment of the impregnated cathode of the present invention, FIG. 2 is a curve diagram comparing the emissions of the embodiment and a conventional example, and FIG. FIG. 3 is a partially cutaway perspective view of an impregnated cathode structure equipped with a conventional impregnated cathode. l... Cathode base 3... Cathode sleeve 5.
...Strap 6...Cathode holder 11...
・Brazing material film

Claims (1)

【特許請求の範囲】[Claims] 少なくともWを含む粉末を焼結して得られた多孔質体に
電子放射物質が含浸されてなる陰極基体の電子放射面を
除く全面または一部を覆うように前記電子放射物質の熱
蒸発を防止し得る熱蒸発防止部が設けられてなる含浸型
陰極において、前記熱蒸発防止部を形成するろう材ある
いは前記ろう材と高融点金属箔等の部材がレーザ溶接に
より前記陰極基体に固着されていることを特徴とする含
浸型陰極。
Thermal evaporation of the electron emitting material is prevented by covering the whole or part of the cathode substrate except for the electron emitting surface, which is formed by impregnating an electron emitting material into a porous body obtained by sintering a powder containing at least W. In the impregnated cathode provided with a heat evaporation prevention section, the brazing material forming the heat evaporation prevention section or a member such as the brazing material and high melting point metal foil is fixed to the cathode base by laser welding. An impregnated cathode characterized by:
JP59253354A 1984-11-30 1984-11-30 Impregnated cathode Pending JPS61133531A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59253354A JPS61133531A (en) 1984-11-30 1984-11-30 Impregnated cathode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59253354A JPS61133531A (en) 1984-11-30 1984-11-30 Impregnated cathode

Publications (1)

Publication Number Publication Date
JPS61133531A true JPS61133531A (en) 1986-06-20

Family

ID=17250164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59253354A Pending JPS61133531A (en) 1984-11-30 1984-11-30 Impregnated cathode

Country Status (1)

Country Link
JP (1) JPS61133531A (en)

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