JPS61133316A - Heat treatment device - Google Patents

Heat treatment device

Info

Publication number
JPS61133316A
JPS61133316A JP25358484A JP25358484A JPS61133316A JP S61133316 A JPS61133316 A JP S61133316A JP 25358484 A JP25358484 A JP 25358484A JP 25358484 A JP25358484 A JP 25358484A JP S61133316 A JPS61133316 A JP S61133316A
Authority
JP
Japan
Prior art keywords
hot air
gas
work
heat treatment
temp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25358484A
Other languages
Japanese (ja)
Inventor
Munenori Ishimi
宗憲 石見
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokuda Seisakusho Co Ltd
Original Assignee
Tokuda Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuda Seisakusho Co Ltd filed Critical Tokuda Seisakusho Co Ltd
Priority to JP25358484A priority Critical patent/JPS61133316A/en
Publication of JPS61133316A publication Critical patent/JPS61133316A/en
Pending legal-status Critical Current

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  • Heat Treatment Of Articles (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

PURPOSE:To increase hot air temp. and to treat quickly a work which is subjected to plasma etching by cooling a waste gas contg. a reactive gas with a low temp. gas in the stage of removing the reactive gas adsorbed to the work by hot air blowing and the heating by a heating plate. CONSTITUTION:The reactive gas such as Cl is adsorbed on the surface of the work 9 such as Al member which is subjected to the plasma etching treatment in a process for production of an IC, etc. and therefore the work is imposed on the heating plate 2 in a heating device 1, by which the work is heated; at the same time, the work 9 is heated by the hot air from nozzles 5 of a hot air generator 3 having a heater 4 to remove the reactive gas. The waste gas contains the high-temp. and corrosive Cl, etc. and therefore said gas corrodes quickly a discharge pipe 7 and subsequent installations. Part of cold air which is a source for hot air is fed to the generator 3 and is supplied in the state of the low temp. to the pipe 7 through a branch pipe 8 to cool the high-temp. waste gas in order to prevent the above-mentioned corrosion, by which the increase of the hot air temp. from the nozzles 5 is made possible and the treating capacity of the device is improved.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はプラズマエツチング処理を行なったワークのエ
ツチング処理ガスの付着、吸着等によるエツチング処理
後のワークへの影響を取り除くための熱処理装置にか1
す、特にアルミニウムのエツチング後の後処理用として
の熱処理装置に関する。
[Detailed Description of the Invention] [Field of Industrial Application] The present invention is applied to a heat treatment apparatus for removing the influence of the etching gas on the workpiece after the plasma etching process due to adhesion, adsorption, etc. of the workpiece. 1
In particular, the present invention relates to a heat treatment apparatus for post-treatment of aluminum after etching.

〔従来技術とその問題点〕[Prior art and its problems]

近年、[Cと呼ばれる集積回路の製造プロセスでは、I
Cの高集積度化、高速度化に伴ない、素子の微細加工が
強く要求されている。このため、アンダーカットのない
垂直なエツチング形状が達成できる反応性イオンエツチ
ング方法が採用されている。例えば電極配線材料として
多く用いられているアルミニウムをエツチングする場合
には塩素系ガスが用いられ、反応容器内にワークを導入
し減圧状態のこの反応ガス雰囲気中のグロー放電を発生
させ、ワークの被エツチング材料と反応ガスとの反応を
促進させ、被エツチング材料を揮発性化合物にすること
でエツチングを進行させている。
In recent years, in the manufacturing process of integrated circuits called [C],
With the increase in the degree of integration and speed of C, there is a strong demand for microfabrication of elements. For this reason, a reactive ion etching method is used that can achieve a vertical etched profile without undercuts. For example, when etching aluminum, which is often used as an electrode wiring material, a chlorine-based gas is used.The workpiece is introduced into a reaction vessel and a glow discharge is generated in the reaction gas atmosphere under reduced pressure. Etching progresses by promoting the reaction between the etching material and the reactive gas and converting the material to be etched into a volatile compound.

このエツチング処理が終了し、ワークを反応室より大気
中に取り出す場合、ワークには反応に用いられたガス成
分が付着、吸着しており、大気中の水蒸気等と反応し、
ワークの残すべき被エツチング材料で形成された配線パ
ターン等との反応を開始し、配線の断線や短絡が発生す
る。
When this etching process is completed and the workpiece is taken out from the reaction chamber into the atmosphere, the gas components used in the reaction are attached to and adsorbed on the workpiece, and react with water vapor etc. in the atmosphere.
The workpiece starts to react with the wiring pattern formed of the material to be etched, resulting in disconnection or short-circuiting of the wiring.

このため、エツチング処理慢心ちにワークに付着した反
応ガス成分を除去する必要が生じ、その方法とし−(熱
風の吹き付け、加熱等が糧めて有効であり、例えば乾燥
した空気、N2等のガスを発熱体に接触させて加熱し、
ワークに吹き付けることによって、ワークには付着した
反応ガス成分を除去している。
For this reason, it becomes necessary to remove the reactive gas components that adhere to the workpiece during the etching process. is heated by contacting it with a heating element,
By spraying onto the workpiece, reactive gas components adhering to the workpiece are removed.

ところが、ここで発生した熱風およびワークから離脱し
た反応ガス成分は、そのま)大気中に放出すると熱によ
る周辺機器の破損、誤動作、反応ガス成分による腐蝕、
および人体への悪影響が発生するため、密閉された経路
で熱風が大気に放出されないようにして反応ガス処理装
置に導かねばならない。さらに離脱した反応ガス成分が
、再吸着する前にすみやかに排気されるよう排気口は減
圧状態を緒持している。
However, if the hot air generated here and the reactive gas components separated from the workpiece are directly released into the atmosphere, they may cause damage to peripheral equipment due to the heat, malfunction, corrosion due to the reactive gas components,
In addition, the hot air must be guided to the reaction gas processing device in a sealed path to prevent it from being released into the atmosphere, since this may have an adverse effect on the human body. Further, the exhaust port is kept in a reduced pressure state so that the released reaction gas components can be quickly exhausted before being re-adsorbed.

しかして一般には、この排気口および排気経路は反応ガ
ス成分による腐蝕を避けるため、有機材料が用いられて
おり、熱による変形、破損が発生ずる。このようなこと
から熱処理においては最適な温度にすることが難かしく
、したがって処理時間も必要以上にかけなければならな
い等の欠点が生じており、十分な熱処理が行なわれない
などの欠点があった。
Generally, however, organic materials are used for the exhaust port and the exhaust path in order to avoid corrosion due to reaction gas components, which may cause deformation or damage due to heat. For this reason, it is difficult to obtain the optimum temperature during heat treatment, resulting in disadvantages such as the need for longer treatment times than necessary, and disadvantages such as insufficient heat treatment.

(発明の目的) 本発明はこれに鑑み、熱処理装置内に導入される熱風そ
のもの)温度を下げるように、ケースと連結した排気通
路に熱処理用ガス供給系を連通せしめた熱処理装置を提
供することを目的としてなされたものである。
(Object of the Invention) In view of this, the present invention provides a heat treatment apparatus in which a heat treatment gas supply system is connected to an exhaust passage connected to a case so as to lower the temperature of the hot air itself introduced into the heat treatment apparatus. It was made for the purpose of

〔発明の概要〕[Summary of the invention]

上記目的を達成するため本発明においては、ケース内に
ワークの加熱板および熱風発生装置を有し、該ケースは
ケース内で加熱された気体をケー   シス外に排出す
る排出通路と連結されている熱処置装置において、該排
出通路と前記熱風発生装置に供給される熱処理用ガス供
給系とを管路により連結してなる熱処理装置を特徴とす
るものである。
In order to achieve the above object, the present invention includes a workpiece heating plate and a hot air generator in a case, and the case is connected to a discharge passage for discharging gas heated in the case to the outside of the case. The heat treatment apparatus is characterized in that the discharge passage and a heat treatment gas supply system supplied to the hot air generator are connected by a pipe line.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明を第1乃至第4図に示す実施例を参照して
説明する。本発明にかかる熱処理装置は、ケース1と、
ケース1内に設けられた加熱板2と、加熱板2上のワー
クを上方から加熱するための熱風発生装置本体3と、こ
の本体3に内蔵されるヒータ4と、この本体3から垂下
されたノズル5と、前記ケース1の外から熱風発生装置
本体3に対して供給される熱処理用ガス供給系としての
供給管路6と、ケース1と排気口とを連結する排気通路
7および排気通路7内に外方から連結したガス管路8な
どにより構成されている。
The present invention will be described below with reference to embodiments shown in FIGS. 1 to 4. The heat treatment apparatus according to the present invention includes a case 1,
A heating plate 2 provided in a case 1, a hot air generator body 3 for heating the workpiece on the heating plate 2 from above, a heater 4 built into this body 3, and a heater 4 hanging from this body 3. A nozzle 5, a supply pipe line 6 as a heat treatment gas supply system that is supplied from outside the case 1 to the hot air generator main body 3, and an exhaust passage 7 and an exhaust passage 7 that connect the case 1 and the exhaust port. It is constituted by a gas pipe line 8 etc. connected from the outside to the inside.

前記ケース1は熱処理装置の外壁で、熱絶縁の目的のた
め多層構造にしてあり、一部は水冷されている。
The case 1 is an outer wall of the heat treatment apparatus, and has a multilayer structure for the purpose of thermal insulation, and a portion thereof is water-cooled.

前記加熱板2は、ケース1内に搬送されてきたワークを
図示しない搬送ベルトを介して載置し、下面から加熱す
るようになっている。
The heating plate 2 is configured to place a workpiece transported into the case 1 via a transport belt (not shown) and heat it from the bottom surface.

加熱板2上のワークの上方には、加熱板2に対向して、
ワークを上方から加熱するための熱風発生装置が設けら
れており、ヒータ4を収容する本体3の下方には複数個
のノズル5が設けられている。
Above the workpiece on the heating plate 2, facing the heating plate 2,
A hot air generator for heating the workpiece from above is provided, and a plurality of nozzles 5 are provided below a main body 3 that accommodates a heater 4.

そして、ヒータ4が収容された本体3には熱処理用ガス
が供給管路6により供給されるようになっている。前記
供給管路6の他端は図示しない加圧されたガス源に接続
されている。
A heat treatment gas is supplied to the main body 3 in which the heater 4 is housed through a supply pipe line 6. The other end of the supply pipe 6 is connected to a pressurized gas source (not shown).

前記排気通路7は、ケース1の下部に連結されていて、
ケース1内で発生した排気ガスを排気通路7の先端に設
けられた排気口から排出して反応ガス処理装置へ導くよ
うになっている。
The exhaust passage 7 is connected to the lower part of the case 1,
Exhaust gas generated within the case 1 is discharged from an exhaust port provided at the tip of the exhaust passage 7 and guided to the reaction gas processing device.

また排気通路7内には前記熱風発生装置本体3に対して
供給される熱処理用ガスを導き、熱処叩済みのガスを冷
却するためのガス管路8が前記排気通路7の流入される
形で突出して設けられている。
Further, in the exhaust passage 7, there is a gas pipe line 8 for guiding the heat treatment gas supplied to the hot air generator main body 3 and for cooling the heat-treated gas, into which the exhaust passage 7 flows. It is set prominently.

つぎに作用について説明する。Next, the effect will be explained.

加熱板2上のワ7り9は、加圧ガス源より供給管路6を
経て熱風発生装置本体3内に供給されると、ヒータ4に
より加熱され、これにより加熱されたガスはノズル5よ
り噴出してワーク9に上方から吹きつける。ここでワー
ク9は同時に下方か−らは加熱板2により加熱され熱処
理が行なわれる。
When the gas 7 on the heating plate 2 is supplied from the pressurized gas source through the supply pipe 6 into the hot air generator main body 3, it is heated by the heater 4, and the heated gas is then passed through the nozzle 5. It squirts and blows onto the workpiece 9 from above. Here, the workpiece 9 is simultaneously heated by the heating plate 2 from below and subjected to heat treatment.

そしてワーク9から離脱した反応ガス成分は、減圧状態
の排気通路7を通って排気口から反応ガス処理装置へ導
かれる。
The reactive gas component separated from the workpiece 9 passes through the exhaust passage 7 under reduced pressure and is guided from the exhaust port to the reactive gas processing device.

排気通路7に導かれた熱風は、排気通路7内に突出した
ガス管路8からの低温のガスと混合される。そしてこの
場合、流量およびガスの種類が回じなため、はイ温度差
の /2の温度に下降して排気される。
The hot air guided into the exhaust passage 7 is mixed with low-temperature gas from a gas pipe 8 protruding into the exhaust passage 7. In this case, since the flow rate and the type of gas are the same, the temperature is lowered to 2/2 of the temperature difference A and is exhausted.

この結果、排気通路7は従来のように高温となることが
なくなり、現状の材質でも十分に使用できる。
As a result, the exhaust passage 7 does not become as hot as in the past, and the current material can be used satisfactorily.

以上の説明は、ガス源からの熱処理用ガスを排気通路に
導入するに際し、ガス源から直接導入する場合であるが
、第1図に示すように分岐管路8を用いて導入してもよ
い。
In the above explanation, when introducing the heat treatment gas from the gas source into the exhaust passage, it is directly introduced from the gas source, but it may also be introduced using a branch pipe 8 as shown in FIG. .

また、排気通路に連結されるガス管路の形状は任意でよ
いが、第2図の10で示1′ように排気道゛路の中心部
に下方に向は折り曲げて、排気方向と同一方向とするか
、第3図の11に示すように直角方向とするかが考えら
れるが、いずれにしても熱風や流山の妨げとならぬよう
にすることが望ましい。
Further, the shape of the gas pipe connected to the exhaust passage may be arbitrary, but it should be bent downward at the center of the exhaust passage as shown in 10 in Fig. 2, and in the same direction as the exhaust direction. It is conceivable to set it at a right angle or at right angles as shown in 11 in Fig. 3, but in either case, it is desirable that it does not interfere with hot air or flowing mountains.

さらに温度の緩和を良くするために第4図に示ずように
螺旋状のバイブ12の内側に多数の孔13を穿設し、こ
の孔13から低温ガスを噴出す方法は効果的である。
Furthermore, in order to improve the temperature relaxation, it is effective to drill a large number of holes 13 inside the spiral vibrator 12 as shown in FIG. 4, and to blow out low-temperature gas from the holes 13.

なお、熱風の流量を多く取りたい場合は、熱処理用ガス
の排気通路への導入を熱風発生装置への供給とは別系統
とし、熱風の比熱よりも大きな比熱をもつガスを排気通
路へ導入することによって、排気通路への導入流量が、
前記熱風発生装置への供給流mよりも少ない場合でも同
等の効果を挙げることができる。          
        ′〔発明の効果〕 以上説明したように本発明によれば、熱風を使用する熱
処理装置において、排気通路に熱処理用の低温ガスを流
入させて、装置から排気される熱処理済ガスを冷却する
ようにしたから、排気通路の温度上昇を防ぐことができ
、これにより熱風発生装置の熱風温度を必要な温度まで
高めることが可能となり、その結果、ワークの不良率の
減少および処理時間の短縮など優れた効果を奏すること
ができる。
In addition, if you want to increase the flow rate of hot air, introduce the heat treatment gas into the exhaust passage through a separate system from the supply to the hot air generator, and introduce a gas with a specific heat larger than the specific heat of the hot air into the exhaust passage. By this, the flow rate introduced into the exhaust passage becomes
The same effect can be obtained even when the flow is smaller than the flow m supplied to the hot air generator.
[Effects of the Invention] As explained above, according to the present invention, in a heat treatment apparatus using hot air, low-temperature gas for heat treatment is allowed to flow into the exhaust passage to cool the heat-treated gas exhausted from the apparatus. Because of this, it is possible to prevent the temperature rise in the exhaust passage, which makes it possible to raise the hot air temperature of the hot air generator to the required temperature.As a result, it has advantages such as reducing the defective rate of workpieces and shortening processing time. It is possible to achieve the following effects.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明にか・る熱処理装置の説明図、第2図乃
至第4図は本発明のガス管路の他の実施例の説明図であ
る。 1・・・ケース、2・・・加”熱板、3・・・熱風発生
装置本体、4・・・ヒータ、5・・・ノズル、6・・・
供給管路、7・・・排気通路、8・・・管路、9・・・
ワーク。 出願人代理人  猪  股    清 第1図 第2図
FIG. 1 is an explanatory diagram of a heat treatment apparatus according to the present invention, and FIGS. 2 to 4 are explanatory diagrams of other embodiments of the gas pipe line of the present invention. DESCRIPTION OF SYMBOLS 1... Case, 2... Heating plate, 3... Hot air generator main body, 4... Heater, 5... Nozzle, 6...
Supply pipe line, 7... Exhaust passage, 8... Pipe line, 9...
work. Applicant's agent Kiyoshi Inomata Figure 1 Figure 2

Claims (1)

【特許請求の範囲】 1、ケース内にワークの加熱板および熱風発生装置を有
し、該ケースはケース内で加熱された気体をケース外に
排出する排出通路と連結されている熱処理装置において
、該排出通路と前記熱風発生装置に供給される熱処理用
ガス供給系とを管路により連結してなる熱処理装置。 2、上記排出通路と前記熱風発生装置に供給される熱処
理用ガス供給系とを分岐管路により連結してなる特許請
求の範囲第1項記載の熱処理装置。
[Claims] 1. A heat treatment apparatus having a workpiece heating plate and a hot air generator in a case, the case being connected to a discharge passage for discharging gas heated in the case to the outside of the case, A heat treatment apparatus in which the discharge passage and a heat treatment gas supply system supplied to the hot air generator are connected by a pipe line. 2. The heat treatment apparatus according to claim 1, wherein the discharge passage and the heat treatment gas supply system supplied to the hot air generator are connected by a branch pipe.
JP25358484A 1984-11-30 1984-11-30 Heat treatment device Pending JPS61133316A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25358484A JPS61133316A (en) 1984-11-30 1984-11-30 Heat treatment device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25358484A JPS61133316A (en) 1984-11-30 1984-11-30 Heat treatment device

Publications (1)

Publication Number Publication Date
JPS61133316A true JPS61133316A (en) 1986-06-20

Family

ID=17253406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25358484A Pending JPS61133316A (en) 1984-11-30 1984-11-30 Heat treatment device

Country Status (1)

Country Link
JP (1) JPS61133316A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5976328A (en) * 1996-01-26 1999-11-02 Hitachi, Ltd. Pattern forming method using charged particle beam process and charged particle beam processing system

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5747876A (en) * 1980-09-03 1982-03-18 Toshiba Corp Plasma etching apparatus and method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5747876A (en) * 1980-09-03 1982-03-18 Toshiba Corp Plasma etching apparatus and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5976328A (en) * 1996-01-26 1999-11-02 Hitachi, Ltd. Pattern forming method using charged particle beam process and charged particle beam processing system
US6344115B1 (en) 1996-01-26 2002-02-05 Hitachi, Ltd. Pattern forming method using charged particle beam process and charged particle beam processing system

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