JPS6113249Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to an improvement of a die polishing device for wire drawing that polishes a die used in a wire drawing machine.

Conventionally, a die polishing machine shown in FIG. 1 has been used. That is, the die 1 is attached to a saucer 3 rotatably supported by a bearing 2,
The saucer 3 is pushed upward by a spring 5, and a pulley 4 is rotated by a roller 6.
It is coaxially placed and fixed. Above pulley 4
The contact surface with the roller 6 is formed in a tapered shape, and the tray 3 is formed to move up and down by the roller 6 and the spring 5.

The polishing needle 7 is supported by a bearing 8, and the chuck 1 is rotated by a drive source via a pulley 9.
0 and rotates.

The die 1 rotates in the direction of arrow a while reciprocating up and down by the pulley 4, and the polishing needle 7 is inserted into the hole of the die 1 and rotates in the direction of arrow b, which is the opposite direction to the rotation direction of the die 1. , the die 1 is to be polished.

However, in the above-mentioned conventional polishing device, the axes of the polishing needle and the die are aligned, so when the die is located at the uppermost position, the contact pressure between the die hole and the polishing needle is maximum, and the die is at the highest position. When located at the lower position, the contact pressure is minimum, and therefore the contact pressure during polishing is weak overall, resulting in a drawback that polishing takes a long time.

The present invention has been devised to eliminate the above-mentioned drawbacks, and one embodiment thereof will be described below with reference to the drawings.

As shown in FIG. 2, a ring 11 that loosely fits and holds the die 1 is placed on a table 12 so as to be movable, and the table 12 is rotatably supported by a bearing 2. The table 12 is rotated by the rollers 6 via the pulley 4 while being constantly pushed upward by the spring 5. Further, since the pulley 4 has a tapered surface that contacts the roller 6, the table 12 moves up and down in conjunction with the action of the spring 5.

A groove 13 is provided on the outer periphery of the ring 11, and a belt 15 is suspended between the ring 11 and a power transmission pulley 14 arranged opposite to the ring 11.

The power transmission pulley 14 is driven by a drive source (not shown). Further, as the belt 15, a stretchable material such as a rubber band or a rubber cord is used. Further, the polishing needle 7 is attached to and rotates on a chuck 10 which is supported by a bearing 8 and rotated via a pulley 9 by a drive source (not shown).

The operation of polishing a die using the die polishing apparatus described above will be explained with reference to FIG.

The die 1 is loosely fitted into the ring 11 placed on the table 12, and the table 12 or the polishing needle 7 is placed on the table 12.
When the tip of the polishing needle 7 is inserted into the hole of the die 1 by moving at least one of the holes, the ring 11 is constantly pulled in the direction of arrow e by the belt 15, so that the polishing needle 7 is inserted into a part of the die hole. be contacted.
The abrasive 16 is supplied between the abrasive needle 7 and the hole of the die 1, and the abrasive needle 7 is rotated in the direction of arrow c. The polishing needle 7 is rotated in the direction of the arrow d, which is the opposite direction to the rotation direction, and the polishing needle 7 uniformly polishes the entire circumferential surface of the die hole while always contacting a part of the die hole with a constant pressure.

Although the table 12 is rotated in the same direction as the rotation direction of the die 1, substantially the same polishing action can be performed without rotation.

As described above, the hole in the die 1 is polished into a desired shape by the rotation of the polishing needle 7 and the die 1 and the vertical movement of the table 12 due to the rotation of the roller 6.

In addition, in the above configuration, the rotation speed of the polishing needle 7 is
2000r.pm~4000r.pm, rotation of ring 11 is 10
Preferably, the rotations/minute to 20 rotations/minute and the vertical movement of the table 12 are preferably 2 times/second to 5 times/second.

Since the wire drawing die polishing device of the present invention has the above configuration, the die is constantly pressed against the polishing needle due to the elasticity of the belt, and the contact pressure between the die and the polishing needle is almost constant. Whereas traditional polishing used to take 70 minutes,
It was completed in 30 minutes and the polishing capacity increased by 1.7 to 2.5 times. Moreover, since it is extremely easy to handle, it has practical effects such as improved work efficiency.

[Brief explanation of the drawing]

Figure 1 is a front view showing a conventional die polishing device;
FIG. 2 is a front view of a wire drawing die polishing apparatus according to an embodiment of the present invention, and FIG. 3 is an enlarged sectional view showing a polishing state by the die polishing apparatus of the present invention. 1...Dice, 2,8...Bearing, 3...Saucer,
4,9,14...Pulley, 5...Spring,
6...roller, 7...polishing needle, 10...chuck, 11...ring, 12...table, 13...
...Groove, 15...Belt, 16...Abrasive.

Claims (1)

[Scope of utility model registration request] In a die polishing device equipped with a rotatably supported die polishing needle and a table for arranging the die, a ring having a groove on the outer periphery and loosely fitting the die is placed on the table; A wire drawing die polishing device comprising a stretchable belt suspended between a ring and a power transmission pulley placed opposite the ring.