JPS61131870U - - Google Patents

Info

Publication number
JPS61131870U
JPS61131870U JP1985014777U JP1477785U JPS61131870U JP S61131870 U JPS61131870 U JP S61131870U JP 1985014777 U JP1985014777 U JP 1985014777U JP 1477785 U JP1477785 U JP 1477785U JP S61131870 U JPS61131870 U JP S61131870U
Authority
JP
Japan
Prior art keywords
die pad
die
component mounting
conductive adhesive
mounting structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985014777U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985014777U priority Critical patent/JPS61131870U/ja
Publication of JPS61131870U publication Critical patent/JPS61131870U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/30
    • H10W72/07251
    • H10W72/07353
    • H10W72/20
    • H10W72/334
    • H10W72/884
    • H10W72/931
    • H10W90/734
    • H10W90/754

Landscapes

  • Die Bonding (AREA)
JP1985014777U 1985-02-05 1985-02-05 Pending JPS61131870U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985014777U JPS61131870U (cg-RX-API-DMAC10.html) 1985-02-05 1985-02-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985014777U JPS61131870U (cg-RX-API-DMAC10.html) 1985-02-05 1985-02-05

Publications (1)

Publication Number Publication Date
JPS61131870U true JPS61131870U (cg-RX-API-DMAC10.html) 1986-08-18

Family

ID=30500013

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985014777U Pending JPS61131870U (cg-RX-API-DMAC10.html) 1985-02-05 1985-02-05

Country Status (1)

Country Link
JP (1) JPS61131870U (cg-RX-API-DMAC10.html)

Similar Documents

Publication Publication Date Title
JPS61131870U (cg-RX-API-DMAC10.html)
JPS63182570U (cg-RX-API-DMAC10.html)
JPH01139449U (cg-RX-API-DMAC10.html)
JPS62134254U (cg-RX-API-DMAC10.html)
JPS6232550U (cg-RX-API-DMAC10.html)
JPH0184460U (cg-RX-API-DMAC10.html)
JPS6338368U (cg-RX-API-DMAC10.html)
JPS6192064U (cg-RX-API-DMAC10.html)
JPS58193656U (ja) セラミツク配線基板
JPS63182572U (cg-RX-API-DMAC10.html)
JPS59107139U (ja) 回路基板のicチップ実装構造
JPH0286174U (cg-RX-API-DMAC10.html)
JPS63201369U (cg-RX-API-DMAC10.html)
JPS63100875U (cg-RX-API-DMAC10.html)
JPS60111064U (ja) ハイブリツドic用回路基板
JPS58191661U (ja) プリント板
JPH0341934U (cg-RX-API-DMAC10.html)
JPS63105354U (cg-RX-API-DMAC10.html)
JPH0320463U (cg-RX-API-DMAC10.html)
JPH01129874U (cg-RX-API-DMAC10.html)
JPS63132476U (cg-RX-API-DMAC10.html)
JPS6079771U (ja) 多層配線基板
JPS60125765U (ja) 印刷配線板
JPS5846473U (ja) 印刷配線パタ−ン
JPH01166565U (cg-RX-API-DMAC10.html)