JPS61131870U - - Google Patents
Info
- Publication number
- JPS61131870U JPS61131870U JP1985014777U JP1477785U JPS61131870U JP S61131870 U JPS61131870 U JP S61131870U JP 1985014777 U JP1985014777 U JP 1985014777U JP 1477785 U JP1477785 U JP 1477785U JP S61131870 U JPS61131870 U JP S61131870U
- Authority
- JP
- Japan
- Prior art keywords
- die pad
- die
- component mounting
- conductive adhesive
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
-
- H10W72/07251—
-
- H10W72/07353—
-
- H10W72/20—
-
- H10W72/334—
-
- H10W72/884—
-
- H10W72/931—
-
- H10W90/734—
-
- H10W90/754—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985014777U JPS61131870U (OSRAM) | 1985-02-05 | 1985-02-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985014777U JPS61131870U (OSRAM) | 1985-02-05 | 1985-02-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61131870U true JPS61131870U (OSRAM) | 1986-08-18 |
Family
ID=30500013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985014777U Pending JPS61131870U (OSRAM) | 1985-02-05 | 1985-02-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61131870U (OSRAM) |
-
1985
- 1985-02-05 JP JP1985014777U patent/JPS61131870U/ja active Pending
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