JPS61127671U - - Google Patents
Info
- Publication number
- JPS61127671U JPS61127671U JP1108085U JP1108085U JPS61127671U JP S61127671 U JPS61127671 U JP S61127671U JP 1108085 U JP1108085 U JP 1108085U JP 1108085 U JP1108085 U JP 1108085U JP S61127671 U JPS61127671 U JP S61127671U
- Authority
- JP
- Japan
- Prior art keywords
- resist layer
- circuit pattern
- solder resist
- excluding
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1108085U JPS61127671U (cs) | 1985-01-29 | 1985-01-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1108085U JPS61127671U (cs) | 1985-01-29 | 1985-01-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61127671U true JPS61127671U (cs) | 1986-08-11 |
Family
ID=30492862
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1108085U Pending JPS61127671U (cs) | 1985-01-29 | 1985-01-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61127671U (cs) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2010052942A1 (ja) * | 2008-11-06 | 2012-04-05 | イビデン株式会社 | 電子部品内蔵配線板及びその製造方法 |
-
1985
- 1985-01-29 JP JP1108085U patent/JPS61127671U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2010052942A1 (ja) * | 2008-11-06 | 2012-04-05 | イビデン株式会社 | 電子部品内蔵配線板及びその製造方法 |