JPS61127644U - - Google Patents
Info
- Publication number
- JPS61127644U JPS61127644U JP1156085U JP1156085U JPS61127644U JP S61127644 U JPS61127644 U JP S61127644U JP 1156085 U JP1156085 U JP 1156085U JP 1156085 U JP1156085 U JP 1156085U JP S61127644 U JPS61127644 U JP S61127644U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealed
- semiconductor chip
- semiconductor device
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims 2
- 229920000647 polyepoxide Polymers 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000005266 casting Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1156085U JPS61127644U (zh) | 1985-01-30 | 1985-01-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1156085U JPS61127644U (zh) | 1985-01-30 | 1985-01-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61127644U true JPS61127644U (zh) | 1986-08-11 |
Family
ID=30493793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1156085U Pending JPS61127644U (zh) | 1985-01-30 | 1985-01-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61127644U (zh) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5790967A (en) * | 1980-11-27 | 1982-06-05 | Nec Corp | Semiconductor device sealed with resin |
-
1985
- 1985-01-30 JP JP1156085U patent/JPS61127644U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5790967A (en) * | 1980-11-27 | 1982-06-05 | Nec Corp | Semiconductor device sealed with resin |