JPS61127437U - - Google Patents
Info
- Publication number
- JPS61127437U JPS61127437U JP1288585U JP1288585U JPS61127437U JP S61127437 U JPS61127437 U JP S61127437U JP 1288585 U JP1288585 U JP 1288585U JP 1288585 U JP1288585 U JP 1288585U JP S61127437 U JPS61127437 U JP S61127437U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- pressure sensor
- semiconductor pressure
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 claims 1
Landscapes
- Measuring Fluid Pressure (AREA)
Description
第1図はこの考案の一実施例による装置の断面
側面図、第2図はプリント基板、ホルダ、サポー
ト、半導体圧力センサの外観を示す斜視図である
。第3図は従来装置を示す断面側面図である。
1……プリント基板、2……半導体圧力センサ
、3……Oリング、4……ハウジング、5……サ
ポート、6……ホルダ。尚図中、同一符号は同一
又は相当部分を示す。
FIG. 1 is a sectional side view of a device according to an embodiment of the invention, and FIG. 2 is a perspective view showing the appearance of a printed circuit board, a holder, a support, and a semiconductor pressure sensor. FIG. 3 is a cross-sectional side view showing a conventional device. DESCRIPTION OF SYMBOLS 1... Printed circuit board, 2... Semiconductor pressure sensor, 3... O-ring, 4... Housing, 5... Support, 6... Holder. In the drawings, the same reference numerals indicate the same or corresponding parts.
Claims (1)
るケース部材とこのケース底面に突設され、前記
プリント基板を貫通した圧力導入パイプと上記プ
リント基板の所定の位置に半田付されるリードと
を有する半導体圧力センサ、 前記半導体圧力センサの底面とプリント基板間
に、所定の間隙を保持させるスペーサ、及び前記
半導体圧力センサを前記プリント基板に対して固
定させるサポートを備えた事を特徴とする圧力検
出装置。[Claims for Utility Model Registration] A printed circuit board, a case member housing a semiconductor pressure sensor element, a pressure introduction pipe protruding from the bottom of the case and penetrating the printed circuit board, and a pressure introduction pipe soldered to a predetermined position on the printed circuit board. A semiconductor pressure sensor having a lead that includes a lead, a spacer for maintaining a predetermined gap between the bottom surface of the semiconductor pressure sensor and a printed circuit board, and a support for fixing the semiconductor pressure sensor to the printed circuit board. pressure detection device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1288585U JPS61127437U (en) | 1985-01-29 | 1985-01-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1288585U JPS61127437U (en) | 1985-01-29 | 1985-01-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61127437U true JPS61127437U (en) | 1986-08-09 |
Family
ID=30496373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1288585U Pending JPS61127437U (en) | 1985-01-29 | 1985-01-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61127437U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56111441A (en) * | 1980-02-08 | 1981-09-03 | Hitachi Ltd | Semiconductor pressure transducer |
-
1985
- 1985-01-29 JP JP1288585U patent/JPS61127437U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56111441A (en) * | 1980-02-08 | 1981-09-03 | Hitachi Ltd | Semiconductor pressure transducer |
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