JPS61127437U - - Google Patents

Info

Publication number
JPS61127437U
JPS61127437U JP1288585U JP1288585U JPS61127437U JP S61127437 U JPS61127437 U JP S61127437U JP 1288585 U JP1288585 U JP 1288585U JP 1288585 U JP1288585 U JP 1288585U JP S61127437 U JPS61127437 U JP S61127437U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
pressure sensor
semiconductor pressure
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1288585U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1288585U priority Critical patent/JPS61127437U/ja
Publication of JPS61127437U publication Critical patent/JPS61127437U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案の一実施例による装置の断面
側面図、第2図はプリント基板、ホルダ、サポー
ト、半導体圧力センサの外観を示す斜視図である
。第3図は従来装置を示す断面側面図である。 1……プリント基板、2……半導体圧力センサ
、3……Oリング、4……ハウジング、5……サ
ポート、6……ホルダ。尚図中、同一符号は同一
又は相当部分を示す。
FIG. 1 is a sectional side view of a device according to an embodiment of the invention, and FIG. 2 is a perspective view showing the appearance of a printed circuit board, a holder, a support, and a semiconductor pressure sensor. FIG. 3 is a cross-sectional side view showing a conventional device. DESCRIPTION OF SYMBOLS 1... Printed circuit board, 2... Semiconductor pressure sensor, 3... O-ring, 4... Housing, 5... Support, 6... Holder. In the drawings, the same reference numerals indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】 プリント基板、半導体圧力センサ素子を内装す
るケース部材とこのケース底面に突設され、前記
プリント基板を貫通した圧力導入パイプと上記プ
リント基板の所定の位置に半田付されるリードと
を有する半導体圧力センサ、 前記半導体圧力センサの底面とプリント基板間
に、所定の間隙を保持させるスペーサ、及び前記
半導体圧力センサを前記プリント基板に対して固
定させるサポートを備えた事を特徴とする圧力検
出装置。
[Claims for Utility Model Registration] A printed circuit board, a case member housing a semiconductor pressure sensor element, a pressure introduction pipe protruding from the bottom of the case and penetrating the printed circuit board, and a pressure introduction pipe soldered to a predetermined position on the printed circuit board. A semiconductor pressure sensor having a lead that includes a lead, a spacer for maintaining a predetermined gap between the bottom surface of the semiconductor pressure sensor and a printed circuit board, and a support for fixing the semiconductor pressure sensor to the printed circuit board. pressure detection device.
JP1288585U 1985-01-29 1985-01-29 Pending JPS61127437U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1288585U JPS61127437U (en) 1985-01-29 1985-01-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1288585U JPS61127437U (en) 1985-01-29 1985-01-29

Publications (1)

Publication Number Publication Date
JPS61127437U true JPS61127437U (en) 1986-08-09

Family

ID=30496373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1288585U Pending JPS61127437U (en) 1985-01-29 1985-01-29

Country Status (1)

Country Link
JP (1) JPS61127437U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56111441A (en) * 1980-02-08 1981-09-03 Hitachi Ltd Semiconductor pressure transducer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56111441A (en) * 1980-02-08 1981-09-03 Hitachi Ltd Semiconductor pressure transducer

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