JPS6112569U - Conductive paste supply device - Google Patents

Conductive paste supply device

Info

Publication number
JPS6112569U
JPS6112569U JP9637484U JP9637484U JPS6112569U JP S6112569 U JPS6112569 U JP S6112569U JP 9637484 U JP9637484 U JP 9637484U JP 9637484 U JP9637484 U JP 9637484U JP S6112569 U JPS6112569 U JP S6112569U
Authority
JP
Japan
Prior art keywords
conductive paste
supply device
paste
paste supply
cylindrical body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9637484U
Other languages
Japanese (ja)
Other versions
JPH022546Y2 (en
Inventor
武則 山下
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP9637484U priority Critical patent/JPS6112569U/en
Publication of JPS6112569U publication Critical patent/JPS6112569U/en
Application granted granted Critical
Publication of JPH022546Y2 publication Critical patent/JPH022546Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図及び第２図は本考案の一実施例を示す要部側断面
図及びＡ−Ａ線に沿う断面図、第３図は第２図のＢ−Ｂ
線に沿う断面図、第４図は第１図装置の筒状体部分拡大
斜視図、第５図は第１図装置の動作時の部分拡大断面図
、第６図及び第７図は第５図の状態で定量供給された導
電ペーストの平面図及びＣ−Ｃ線に沿う断面図、第８図
は第６図の導電ペーストの半導体ペレットマウント時の
平面図である。 第９図は従来の導電ペースト供給装置の要部側断面図、
第１０図及び第１１図は第９図装置で供給された導電ペ
ーストへの半導体ペレットマウントを説明するための側
断面図及び半導体ペレット平面図である。 １・・・・・・シリンジ、１′・・・・・・ノズル、２
ｔ ２’２“・・・・・・導電ペースト、４・・・・
・・ペースト吐出口、８・・・・・・筒状体、９・・・
・・・下端面、１０・・・・・・ペーストガイド溝。1 and 2 are a side sectional view of the main part and a sectional view taken along the line A-A of an embodiment of the present invention, and FIG. 3 is a sectional view taken along the line BB of FIG.
4 is an enlarged perspective view of a portion of the cylindrical body of the device shown in FIG. 1, FIG. 5 is a partially enlarged sectional view of the device shown in FIG. 1 during operation, and FIGS. FIG. 8 is a plan view and a sectional view taken along the line C--C of the conductive paste supplied in quantity in the state shown in the figure, and FIG. 8 is a plan view of the conductive paste shown in FIG. 6 when mounted on a semiconductor pellet. FIG. 9 is a side sectional view of the main part of a conventional conductive paste supply device,
FIGS. 10 and 11 are a side sectional view and a plan view of the semiconductor pellet for explaining mounting of the semiconductor pellet onto the conductive paste supplied by the apparatus shown in FIG. 9. 1...Syringe, 1'...Nozzle, 2
t 2'2"... Conductive paste, 4...
... Paste discharge port, 8 ... Cylindrical body, 9 ...
...Lower end surface, 10...Paste guide groove.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 導電ペーストを吐出するシリンジの下端部に、当該シリ
ンジ下端のペースト吐出口を中心にした下端面及びこの
下端面に前記ペースト吐出口を中心とした星形で底が傾
斜して延びるペーストガイド溝を有する筒状体を取付け
たことを特徴とする導電ペースト供給装置。A lower end of a syringe for discharging conductive paste is provided with a lower end surface centered on the paste ejection port at the lower end of the syringe, and a paste guide groove extending in a star shape with an inclined bottom on the lower end surface centered on the paste ejection port. 1. A conductive paste supply device, characterized in that a cylindrical body having a cylindrical body is attached thereto.
JP9637484U 1984-06-26 1984-06-26 Conductive paste supply device Granted JPS6112569U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9637484U JPS6112569U (en) 1984-06-26 1984-06-26 Conductive paste supply device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9637484U JPS6112569U (en) 1984-06-26 1984-06-26 Conductive paste supply device

Publications (2)

Publication Number Publication Date
JPS6112569U true JPS6112569U (en) 1986-01-24
JPH022546Y2 JPH022546Y2 (en) 1990-01-22

Family

ID=30655819

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9637484U Granted JPS6112569U (en) 1984-06-26 1984-06-26 Conductive paste supply device

Country Status (1)

Country Link
JP (1) JPS6112569U (en)

Also Published As

Publication number Publication date
JPH022546Y2 (en) 1990-01-22

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