JPS61125049U - - Google Patents

Info

Publication number
JPS61125049U
JPS61125049U JP1985008996U JP899685U JPS61125049U JP S61125049 U JPS61125049 U JP S61125049U JP 1985008996 U JP1985008996 U JP 1985008996U JP 899685 U JP899685 U JP 899685U JP S61125049 U JPS61125049 U JP S61125049U
Authority
JP
Japan
Prior art keywords
arm
swinging
bonding
bonding arm
cam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985008996U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0230838Y2 (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985008996U priority Critical patent/JPH0230838Y2/ja
Publication of JPS61125049U publication Critical patent/JPS61125049U/ja
Application granted granted Critical
Publication of JPH0230838Y2 publication Critical patent/JPH0230838Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1985008996U 1985-01-25 1985-01-25 Expired JPH0230838Y2 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985008996U JPH0230838Y2 (zh) 1985-01-25 1985-01-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985008996U JPH0230838Y2 (zh) 1985-01-25 1985-01-25

Publications (2)

Publication Number Publication Date
JPS61125049U true JPS61125049U (zh) 1986-08-06
JPH0230838Y2 JPH0230838Y2 (zh) 1990-08-20

Family

ID=30488794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985008996U Expired JPH0230838Y2 (zh) 1985-01-25 1985-01-25

Country Status (1)

Country Link
JP (1) JPH0230838Y2 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63136334U (zh) * 1987-02-28 1988-09-07

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63136334U (zh) * 1987-02-28 1988-09-07

Also Published As

Publication number Publication date
JPH0230838Y2 (zh) 1990-08-20

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