JPS61121762U - - Google Patents

Info

Publication number
JPS61121762U
JPS61121762U JP1985004451U JP445185U JPS61121762U JP S61121762 U JPS61121762 U JP S61121762U JP 1985004451 U JP1985004451 U JP 1985004451U JP 445185 U JP445185 U JP 445185U JP S61121762 U JPS61121762 U JP S61121762U
Authority
JP
Japan
Prior art keywords
zener diode
resistor
incorporating
built
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985004451U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985004451U priority Critical patent/JPS61121762U/ja
Publication of JPS61121762U publication Critical patent/JPS61121762U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/541Dispositions of bond wires
    • H10W72/547Dispositions of multiple bond wires
    • H10W72/5473Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Details Of Resistors (AREA)
JP1985004451U 1985-01-17 1985-01-17 Pending JPS61121762U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985004451U JPS61121762U (enExample) 1985-01-17 1985-01-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985004451U JPS61121762U (enExample) 1985-01-17 1985-01-17

Publications (1)

Publication Number Publication Date
JPS61121762U true JPS61121762U (enExample) 1986-07-31

Family

ID=30480038

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985004451U Pending JPS61121762U (enExample) 1985-01-17 1985-01-17

Country Status (1)

Country Link
JP (1) JPS61121762U (enExample)

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