JPS61121750U - - Google Patents

Info

Publication number
JPS61121750U
JPS61121750U JP487485U JP487485U JPS61121750U JP S61121750 U JPS61121750 U JP S61121750U JP 487485 U JP487485 U JP 487485U JP 487485 U JP487485 U JP 487485U JP S61121750 U JPS61121750 U JP S61121750U
Authority
JP
Japan
Prior art keywords
circuit board
hybrid integrated
lead
integrated circuit
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP487485U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP487485U priority Critical patent/JPS61121750U/ja
Publication of JPS61121750U publication Critical patent/JPS61121750U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図aは本考案の一実施例の一つのリード部
を示す正面図、同図bは同図aのA―A断面図、
同図cは混成集積回路基板に取付けた側面図、第
2図a,bは従来の混成集積回路用リードフレー
ムのリード部の正面図と断面図、同図cは同図a
のリードを混成集積回路基板に取付けた状態を示
す側面図である。 1,2……1つのリード部、1a,2a……リ
ードの一端部、1b,2b……リードの先端部、
5……混成集積回路基板。
Fig. 1a is a front view showing one lead part of an embodiment of the present invention, Fig. 1b is a sectional view taken along line AA in Fig. 1a,
Figure 2c is a side view of the hybrid integrated circuit board installed, Figures 2a and b are front views and cross-sectional views of the lead portion of a conventional lead frame for hybrid integrated circuits, and Figure 2c is Figure 2a.
FIG. 3 is a side view showing a state in which the leads of the invention are attached to the hybrid integrated circuit board. 1, 2...one lead part, 1a, 2a...one end of the lead, 1b, 2b...the tip of the lead,
5... Hybrid integrated circuit board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 混成集積回路基板に取付ける一端部がクリツプ
形状で、プリント基板の穴に挿入する他端側が断
面円形であつて、さらにその先端部の端面は角の
ない丸み付けされているリードをもつことを特徴
とする混成集積回路用リードフレーム。
One end to be attached to the hybrid integrated circuit board is clip-shaped, the other end to be inserted into the hole in the printed circuit board has a circular cross section, and the lead has a rounded end face with no corners. Lead frame for hybrid integrated circuits.
JP487485U 1985-01-18 1985-01-18 Pending JPS61121750U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP487485U JPS61121750U (en) 1985-01-18 1985-01-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP487485U JPS61121750U (en) 1985-01-18 1985-01-18

Publications (1)

Publication Number Publication Date
JPS61121750U true JPS61121750U (en) 1986-07-31

Family

ID=30480866

Family Applications (1)

Application Number Title Priority Date Filing Date
JP487485U Pending JPS61121750U (en) 1985-01-18 1985-01-18

Country Status (1)

Country Link
JP (1) JPS61121750U (en)

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