JPS61120439A - Sticking device for semiconductor wafer - Google Patents

Abstract

PURPOSE:To stick a wafer and tape uniformly without inclusion of bubbles, by pulling the tape in a 1 bow shape, sticking the apex of the tape to the center of the wafer, and then slowly sticking the outer part to the wafer. CONSTITUTION:A piece of tape 5 is held by a roller 7. The tape is pushed upward with a tape tensioning plate 3 and pulled in a bow shape. A wafer 2 is fixed to a wafer sucking part 1 and lowered. After an apex 5a of the tape and the center of the wafer is contacted, the line contact state is gradually expanded to the outer part. The tape tensioning plate 3 is lowered in synchronization with the decreasing pressure of the sucking part 1. When the sucking part 1 reaches the lowest point, the wafer 2 and the tape 5 are held and compressed between the sucking part 1 and a receiving table 6. Thus the sticking work is finished.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor wafer pasting device for pasting a semiconductor wafer onto a tape.

[Conventional technology]

Conventionally, in order to attach a semiconductor wafer to a tape, the semiconductor wafer is placed on the tape and pressed with a roller to attach it, or the end surface of the semiconductor wafer is pressed with a roller, and the tape and semiconductor wafer are brought into line contact in the longitudinal direction of the roller. It was pasted by a method such as keeping it intact and pasting it.

[Problem that the invention seeks to solve]

For this reason, there were problems such as air bubbles remaining in the tape and chips flying off during dicing.

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor wafer bonding apparatus that eliminates the above-mentioned drawbacks and performs uniform bonding without bubbles.

[Means for solving problems]

The present invention provides a semiconductor wafer attaching device for attaching a semiconductor wafer to a tape, which includes a wafer adsorption unit that adsorbs the semiconductor wafer and is movable up and down, and a tape tensioning plate that extends the tape for attaching the semiconductor wafer in an arcuate shape and is movable up and down. This is a semiconductor wafer bonding device characterized by the following features.

〔Example〕

Next, an embodiment of the present invention will be described.

FIG. 1 is a sectional view of one embodiment of the present invention, and FIG. 2 is a sectional view taken along the line AA in FIG. In the figure, reference numeral 1 denotes a wafer suction unit that suctions a semiconductor wafer 2 and is movable up and down. 3 is vertically movably supported by a pedestal 6 corresponding to the center of the wafer suction unit 1, and has a curved tip that is pushed up by a spring 4 and tensions the tape 5 in an arcuate shape;
It is a plate-shaped tape-covered plate having a width that is the same as or longer than the width of the tape. Reference numeral 6 denotes a pedestal for pressing and pasting the semiconductor wafer 2 and the tape. A roller 7 holds the tape 5 and feeds it.

In the embodiment, the tape 5 is first fed and held by the rows 27 at both ends. At this time, the lower surface of the tape 5 is pushed upward by the tape tensioning plate 3 and held in an arcuate state. Next, the semiconductor wafer 2 is sucked by the wafer suction section 1, and in this state, the wafer suction section 1 is lowered. When the wafer suction unit 1 descends, the apex of the tape 5 stretched in an arcuate shape by the tape tensioning plate 3 comes into contact with the center of the semiconductor wafer 2, and as the wafer suction unit 1 descends, the tape 5 is gradually drawn from the center of the semiconductor wafer 1. The paste υ with the tape on the left and right is enlarged in a line contact state. At this time, the tape tension plate 3 is lowered in synchronization with the lowering pressure of the wafer suction unit 1. When the wafer suction section 1 reaches the lower point, the semiconductor wafer 2 and the tape 5 are sandwiched between the wafer suction section 1 and the pedestal 6 and pressed against each other, and the wafer S2 is attached to the tape 5.

〔Effect of the invention〕

As explained above, the present invention stretches the tape in an arcuate shape, and first attaches the apex of the tape to the center of the semiconductor wafer.
By gradually applying the tape to the periphery of the semiconductor wafer, there are no air bubbles between the wafer and the tape.
It has the effect of being able to be applied uniformly without mixing.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing one embodiment of the present invention, and FIG.
It is an AA sectional view in a figure. 1... Wafer adsorption part, 2... Semiconductor wafer, 3...
・Tape tension plate, 4... spring, 5... tape,
6... pedestal, 7... roller

Claims (1)

[Claims] (1) A semiconductor wafer attachment device that attaches a semiconductor wafer to a tape has a wafer adsorption unit that adsorbs the semiconductor wafer and is movable up and down, and a tape tensioning plate that stretches the tape on which the semiconductor wafer is attached in an arcuate manner and is movable up and down. A semiconductor wafer bonding device characterized by comprising: