JPS61119374A - Soldering device - Google Patents
Soldering deviceInfo
- Publication number
- JPS61119374A JPS61119374A JP24050384A JP24050384A JPS61119374A JP S61119374 A JPS61119374 A JP S61119374A JP 24050384 A JP24050384 A JP 24050384A JP 24050384 A JP24050384 A JP 24050384A JP S61119374 A JPS61119374 A JP S61119374A
- Authority
- JP
- Japan
- Prior art keywords
- soldering device
- heating
- heating chip
- soldering
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
- B23K3/0471—Heating appliances electric using resistance rod or bar, e.g. carbon silica
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明はフラット形ＩＣのはんだ付けに好適なはんだ付
け装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a soldering device suitable for soldering flat ICs.
一般にはんだ付け装置は発熱体と加熱チップを内蔵して
いて、加熱チップを発熱体で加熱し、加熱チップをはん
だ付け部材に押圧してはんだ付けするようになっている
。しかしＩＣなどのように多数のリードをはんだ付けす
るような場合には加熱チップに平坦な当接面を形成して
多数のリードを同時に被はんだ付け部である回路基板に
押圧して能率よく処理することが行なわれている。そし
て加熱チップは導体で形成され、これに直接電流を流し
、これＫより発熱させてはんだ付けをするようになって
いる。このため加熱チップは一端部から他端部へ電流を
通じるので１両端部間にはかなシの電圧降下による電位
差が生じ、これがＩＣに直接加わシ、シばしばＩＣ内部
に損傷を与えるという不都合があった。Generally, a soldering device has a built-in heating element and a heating chip, and the heating element heats the heating chip, and the heating chip is pressed against a soldering member to perform soldering. However, when soldering a large number of leads such as an IC, it is necessary to form a flat contact surface on the heating chip and simultaneously press the large number of leads against the circuit board to be soldered, thereby increasing the efficiency of soldering. things are being done. The heating chip is made of a conductor, and a current is passed directly through it to generate heat from the K, which is used for soldering. For this reason, since the heating chip passes current from one end to the other, a potential difference occurs between the two ends due to a short voltage drop, which is directly applied to the IC, often causing damage to the inside of the IC. There was an inconvenience.
本発明は上述の不都合を除去するためになされたもので
、加熱チップに直接通電発熱させても被はんだ付け部材
に何ら悪影響を与えることのなく能率よくはんだ付けの
できるはんだ付け装置を提供することを目的とする。The present invention has been made in order to eliminate the above-mentioned disadvantages, and it is an object of the present invention to provide a soldering device that can efficiently solder without having any adverse effect on the members to be soldered even when the heating chip is directly energized to generate heat. With the goal.
本発明は、加熱チップに直接通電して発熱させ。 The present invention generates heat by directly applying electricity to the heating chip.
平坦な当接面で押圧してはんだ付けするはんだ付け装置
において、当接面に耐熱性を有しかつ電気的絶縁性を有
する粉状部材または粒状部材を密集固着させたはんだ付
け装置である。This is a soldering device that performs soldering by pressing on a flat abutting surface, in which heat-resistant and electrically insulating powder or granular members are densely fixed to the abutting surface.
以下１本発明の詳細を第１図〜第４図に示す一実施例に
よシ説明する。なお本実施例は第５図に示す被はんだ付
け部材であるフラット形Ｉ（’ （１）を回路基板（２
）にはんだ付けする場合のもので、複数個のリード（３
）、・・・が両側に突設されている。The details of the present invention will be explained below with reference to an embodiment shown in FIGS. 1 to 4. In this example, the flat type I (' (1), which is the member to be soldered shown in Fig. 5), is replaced with a circuit board (2
) for soldering to multiple leads (3
), ... are provided protruding from both sides.
第１図は本実施例の要部（加熱チップ近傍）を示す正面
図で、加熱チップ本体（１υは断面角形の部材ｔ−Ｕ字
状に折曲して構成されていて、一般に使用されているモ
リブデン、タングステンやステンレス鋼のようなはんだ
付けが不可能で、かつ高い硬度と耐摩耗性を有する抵抗
材料からなっている。Fig. 1 is a front view showing the main part (near the heating chip) of this embodiment. It is made of resistive materials such as molybdenum, tungsten and stainless steel that cannot be soldered and have high hardness and wear resistance.
この加熱チップ本体ａυは図示しない本体に取付けられ
た給電端子αり、６階に締結されていて、矢印ｎ４）。This heating chip main body aυ is connected to a power supply terminal α attached to the main body (not shown), and is connected to the sixth floor (arrow n4).
輸のように電流が通るようになっている。また平坦な当
接面（旧およびその外周近傍には、ダイヤモンドやボラ
ゾンなどのような耐熱性、絶縁性を有する部材からなシ
粒径が１００ミフロンメータ〜４０ミクロンメーメの粉
状部材αηが電着により密集して固着されて加熱チップ
珀が構成されている。なおその他の部分は一般公知のも
のと同様なので詳細な説明は省略する。Electric current is allowed to flow through it like an import. In addition, on the flat contact surface (former and near its outer periphery, a powdery material αη with a grain size of 100 micrometers to 40 micrometers made of a heat-resistant, insulating material such as diamond or borazone is deposited by electrodeposition). The heating chips are tightly fixed together to form a heating chip.The other parts are the same as those generally known, so a detailed explanation will be omitted.
このような加熱チップαｌをもったはんだ付け装置の使
用態様につき説明する。回路基板（２）上に被はんだ付
け部材であるＩＣ（１）をそのリード（３）、・・・が
はんだ付けされるべき部位に位置するように載置する。The manner in which the soldering device having such a heating tip αl is used will be explained. An IC (1), which is a member to be soldered, is placed on a circuit board (2) so that its leads (3), . . . are located at the parts to be soldered.
次に加熱チップ本体（１１）の当接面（ＩＱを複数のリ
ード（３）、・・・の全上面に当接して押圧し、電流を
流す。これにより加熱チップ本体αυはそのジ為−ル熱
により高温と女夛、はんだが溶融する。十分達
、Ｍ羞した後、電流を断ち、押圧したｔ−ま冷却させ複
数個のリード（３）、・・・のけんだ付けを一回で完了
する。この間加熱チップ本体（１１）は電気的に絶縁性
を有し、かつ熱伝導のよいダイヤモンドの粉状部材を介
してリード（３）、・・・の加熱部位に接するのでＩＣ
（１）に直接電圧が印加されることはない。Next, the contact surface (IQ) of the heating chip body (11) is pressed against the entire upper surface of the plurality of leads (3), and a current is applied. The heat causes the high temperature, the solder, and the solder to melt.After reaching a sufficient temperature, the current is cut off, the pressed surface is cooled, and the multiple leads (3) are soldered once. During this time, the heating chip body (11) is in contact with the heated parts of the leads (3), etc. through a diamond powder member that is electrically insulating and has good thermal conductivity, so that the IC
No voltage is directly applied to (1).
以上詳述したように１本発明のはんだ付け装置唸、加熱
チップ本体の当接面に電気的絶縁性を有する粉状部材ま
たは粒状部材を密集して固着したので、被はんだ付け部
材に電圧が印加されることがないから被はんだ付け部材
を損傷させることなく能率よく仲んだ付けすることがで
きる。As described in detail above, in the soldering device according to the present invention, the electrically insulating powder or granular material is densely fixed to the contact surface of the heating chip body, so that voltage is applied to the soldering material. Since no voltage is applied, it is possible to efficiently solder the components to be soldered without damaging them.
第１図は本発明の一実施例の要部（加熱チップ）および
被はんだ付け部材を示す正面図、第２図は同じく側面図
、第３図は同じく要部（加熱チップ）のみ示す正面図、
第４図は同じく第３図の矢印Ａ方向から見た要部拡大側
面図、第５図は被はんだ付け部材（ＩＣ）の斜視図であ
る。
（ｌｅ・・・当接面
αη・・・粉状部材または粒状部材
（慢・・・加熱チップ
代理人 弁理士 則 近 憲 佑
（ほか１名）FIG. 1 is a front view showing a main part (heating chip) and a soldered member of an embodiment of the present invention, FIG. 2 is a side view, and FIG. 3 is a front view showing only the main part (heating chip). ,
FIG. 4 is an enlarged side view of the main part as seen from the direction of arrow A in FIG. 3, and FIG. 5 is a perspective view of the component to be soldered (IC). (le...Contact surface αη...Powdered member or granular member (Long...Representative for heated chips, patent attorney Noriyuki Chika (and 1 other person))
Claims (4)
に直接通電して発熱させ上記当接面をはんだ付け部材に
押圧してはんだ付けするはんだ付け装置において、上記
当接面に電気的絶縁性および耐熱性を有する粉状部材ま
たは粒状部材を密集して固着させたことを特徴とするは
んだ付け装置。(1) In a soldering device that has a heating chip with a contact surface, the heating chip is directly energized to generate heat, and the contact surface is pressed against a soldering member for soldering. 1. A soldering device characterized by closely bonding powder or granular materials having electrical insulation and heat resistance.
とを特徴とする特許請求の範囲第１項記載のはんだ付け
装置。(2) The soldering device according to claim 1, wherein the powdery member or the granular member is diamond.
特徴とする特許請求の範囲第１項記載のはんだ付け装置
。(3) The soldering device according to claim 1, wherein the powdery member or granular member is borazone.
０ミクロンメータであることを特徴とする特許請求の範
囲第１項ないし第３項のいずれかに記載のはんだ付け装
置。(4) The granular material has a particle size of 400 microns to 1
The soldering device according to any one of claims 1 to 3, characterized in that it is a 0 micron meter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24050384A JPS61119374A (en) | 1984-11-16 | 1984-11-16 | Soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24050384A JPS61119374A (en) | 1984-11-16 | 1984-11-16 | Soldering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61119374A true JPS61119374A (en) | 1986-06-06 |
Family
ID=17060483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24050384A Pending JPS61119374A (en) | 1984-11-16 | 1984-11-16 | Soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61119374A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2641439A1 (en) * | 1988-12-30 | 1990-07-06 | R M Electronique | Improvements to the electrodes of soldering machines |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5877769A (en) * | 1981-10-30 | 1983-05-11 | Hitachi Ltd | Method and device for soldering |
-
1984
- 1984-11-16 JP JP24050384A patent/JPS61119374A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5877769A (en) * | 1981-10-30 | 1983-05-11 | Hitachi Ltd | Method and device for soldering |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2641439A1 (en) * | 1988-12-30 | 1990-07-06 | R M Electronique | Improvements to the electrodes of soldering machines |
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