JPS6111649A - Display device for plating film thickness - Google Patents
Display device for plating film thicknessInfo
- Publication number
- JPS6111649A JPS6111649A JP59132612A JP13261284A JPS6111649A JP S6111649 A JPS6111649 A JP S6111649A JP 59132612 A JP59132612 A JP 59132612A JP 13261284 A JP13261284 A JP 13261284A JP S6111649 A JPS6111649 A JP S6111649A
- Authority
- JP
- Japan
- Prior art keywords
- film thickness
- plating
- plated
- plating film
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 97
- 238000010586 diagram Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000001066 destructive effect Effects 0.000 description 2
- 239000008151 electrolyte solution Substances 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 238000002048 anodisation reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/14—Removing excess of molten coatings; Controlling or regulating the coating thickness
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
この発明は、めっき作業実施中に被めっき物にｒ４した
めっきの膜厚を自動的に計算２表示することのできる。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention is capable of automatically calculating and displaying the film thickness of plating applied to an object to be plated during plating work.
めっき膜厚表示装置に関するものである。This invention relates to a plating film thickness display device.
一般にめっきとは、めっき金属がイオン化しやすい電解
液中に、めっき金属の陽極と被めっき物の陰極を浸漬し
、陽極にプラス、陰極にマイナスの直流を印加し、電気
化学的な反応を利用して。Generally, plating involves immersing the anode of the plating metal and the cathode of the object to be plated in an electrolytic solution that easily ionizes the plating metal, applying positive direct current to the anode and negative direct current to the cathode, and utilizing an electrochemical reaction. do.
被めっき物の表面にめっき金属を析出させ、めっき金属
の膜を形成させる表面処理方法の１つである。前記電解
液のことを一般にめっき液と呼ぶ。This is one of the surface treatment methods in which a plating metal is deposited on the surface of an object to be plated to form a film of the plating metal. The electrolytic solution is generally called a plating solution.
そして、こめめっきの特性としては、外観、膜厚。The characteristics of rice plating include appearance and film thickness.
密着性、耐環境性などかあ−るが、特にめっきの膜厚は
他の緒特性とも深く関連しており２重要な特性の１つで
ある。There are adhesion, environmental resistance, etc., but the plating film thickness is one of the two most important properties, as it is closely related to other properties.
このめっきの膜厚け、理論的には陽極と陰極の間に流れ
た電流とその時間の積に比例し、被めっき物の面積に反
比例するが、めっき液における電流効率や電源の変動、
その他の原因で、理論値と一致はしない。−そこで、こ
のめっきの膜厚が所要の値になっているかを確認するた
め、めっき作業終了後波めっき物の作業ロフトの中よシ
数個のサンプルを抜き取シ、破壊又は非破壊試験により
。The thickness of this plating film is theoretically proportional to the product of the current flowing between the anode and cathode and its time, and inversely proportional to the area of the object to be plated.
Due to other reasons, it does not match the theoretical value. - Therefore, in order to confirm whether the film thickness of this plating has reached the required value, after the plating work was completed, several samples were taken from the middle of the working loft of the wave-plated object and subjected to destructive or non-destructive tests. .
めっき膜厚を測定し、所要の膜厚でないロフトは。Measure the plating film thickness and find the loft that is not the required film thickness.
再度めっき作業をやり直す必要がある。めっき膜厚が所
要の値にならない理由としては、電源の変動、めっき時
間またはめっき電流の作業誤りなどがあり、これらの解
決には高価な自動システムの導入などが必要であった。It is necessary to redo the plating work. Reasons why the plating film thickness does not reach the required value include fluctuations in power supply, errors in plating time or plating current, and solving these problems requires the introduction of expensive automatic systems.
この発明は、前記の問題点を改善するためになされたも
ので、めっき槽のめっき液に浸漬してある被めっき物に
印加された電力の量を検出する積算電力計と、被めっき
物の面積を入力する入力手段と、上記積算電力計の出力
と被めっき物の面積データを用いて被めっき物の膜厚を
計算する手段および表示器とを備えること罠よりめりき
膜厚をめっき作業中、逐次自動的に表示させ、めっき作
業の終了時点が確実に判断できるようにした。めりき膜
厚表示装置を提案するものである。This invention was made in order to improve the above-mentioned problems, and includes an integrating wattmeter that detects the amount of power applied to an object to be plated that is immersed in a plating solution in a plating tank, and An input means for inputting the area, a means for calculating the film thickness of the object to be plated using the output of the integrated wattmeter and the area data of the object to be plated, and a display are provided. During the plating process, it is automatically displayed one after another, making it possible to reliably determine when the plating work is complete. This paper proposes a plating film thickness display device.
第１図はこの発明による。めっき膜厚表示装置の一実施
例の全体構成図であり９図中（１）はめっき槽、（２）
はめっきＬ （３１は被めっき物、（４）はめつき金属
の陽極、（５）はめっき用電源、（６）は被めっき物（
３）Ｋ加わった電力を検出する積算電力計、 ＋７１Ｆ
ｉ被めっき物（３）の面積を入力する面積入力器、（８
）は積算電力計（６）の信号と面積入力器（７）からの
データを入力とし、被めっき物（３）に形成されだめり
き膜厚を計算する。めっき膜厚計算手段、 （９）Ｈめ
りき膜厚計算手段（８）の出力に基づき、めっき膜厚を
表示する。めっき膜厚表示器である。FIG. 1 is based on this invention. This is an overall configuration diagram of an embodiment of the plating film thickness display device, and in Figure 9, (1) is the plating tank, (2)
Plating L (31 is the object to be plated, (4) anode of the plating metal, (5) is the power source for plating, (6) is the object to be plated (
3) Integrated wattmeter that detects the power added by K, +71F
i Area input device for inputting the area of the object to be plated (3), (8
) receives the signal from the integrated wattmeter (6) and the data from the area input device (7), and calculates the thickness of the film formed on the object to be plated (3). Plating film thickness calculation means (9) Displays the plating film thickness based on the output of the H plating film thickness calculation means (8). This is a plating film thickness indicator.
第２図は第１図の実施例の、めりき膜厚計算手段を実現
するためのマイクロコンピータの構成図である。図中（
６）は積算電力計、（７）は被めっき物面種入力器、（
８）はめりき膜厚計算手段を実現するタメのマイクロコ
ンピュータであり、 ＣＰＵＱＩ、 メモＩＪ１１１１
．入力回路ＡＱ２．出力回路Ａ（１３１，入力回路Ｂ（
１４１，出力回路ＢｆＩ＆を有している。（９）はめつ
き膜厚表示器である。FIG. 2 is a block diagram of a microcomputer for realizing the plated film thickness calculation means in the embodiment of FIG. 1. In the figure (
6) is an integrated wattmeter, (7) is a plating object surface type input device, (
8) This is a microcomputer that realizes a means for calculating the thickness of a plating film, CPUQI, Memo IJ1111.
．． Input circuit AQ2. Output circuit A (131, input circuit B (
141, and has an output circuit BfI&. (9) It is a plating film thickness indicator.
第３図は第１図、第２図の実施例の、めっき膜厚計算手
段（８）の動作を示すフローチャートであり。FIG. 3 is a flowchart showing the operation of the plating film thickness calculation means (8) in the embodiment shown in FIGS. 1 and 2. FIG.
第１図、第２図および第３図を用いて２本件の実施例の
動作を以下に説明する。The operations of the two embodiments will be explained below using FIGS. 1, 2, and 3.
まず、めっき作業にあたり第３図に示す、めつき膜厚計
算手段（８）の被めっき物面積大力（イ）がスタートす
る。このステップ■では、被めっき物面種入力器（７）
よシ被めっき物（３）の面積を入力することにより、そ
の面積値が、入力回路ＢＣＩ４１を経てＣＰＵ０Ｑに取
り込まれ、ステップＱυにより、メモリ「１Ｂに記憶す
る。続いてステップ■て積算電力計（６）の積算電力を
リセットするために、 ＣＰＵ（ｉｆ）から出力回路
ＡＱ３を通して積算電力計（６）にリセット信号が送ら
れ、積算電力がリセットされる。First, in the plating operation, the plating film thickness calculation means (8) starts measuring the area to be plated (a), as shown in FIG. In this step ■, input device for type of surface to be plated (7)
By inputting the area of the object to be plated (3), the area value is taken into the CPU0Q via the input circuit BCI41, and stored in the memory "1B" in step Qυ.Subsequently, in step In order to reset the integrated power in (6), a reset signal is sent from the CPU (if) to the integrated power meter (6) through the output circuit AQ3, and the integrated power is reset.
面積の入力が終了したなら９作業員は被めっき物（３）
を、めっき槽（１）にセットし、電源（５）のスイッチ
を入れ被めっき物（３）に応じた電流をセットする。After entering the area, worker 9 selects the object to be plated (3)
is set in the plating tank (1), the power supply (5) is turned on, and the current is set according to the object to be plated (3).
なお、ステップ（２）は９作業員が被めっき物（３）を
。In addition, in step (2), nine workers plated the object (3).
めりき槽（１）にセットしている間に実行されることに
なる。This will be executed while it is being set in the glazing tank (1).
一方、めりき膜厚計算手段（８）は積算電力計にリセッ
ト信号を送ると、電力量を読み込むステップ（至）およ
び（財）に進む。ここでは、めっき作業が開始されてか
らその時点までの、めっき回路に流れた電力量を積算電
力計（６）よＵ読み取る処理をする。On the other hand, when the plated film thickness calculation means (8) sends a reset signal to the integrated wattmeter, the process proceeds to steps (to) and (t) of reading the electric energy. Here, a process is performed in which the amount of electric power that has flowed through the plating circuit from the start of the plating work to that point is read by the integrated wattmeter (6).
読み取りは、入力回路Ａ（１２を経てＣＰＵ（１１に取
り込まれ、その後ステップ暢において、読み取った電力
量をメモリＩに記憶する。続いて、めりき膜厚を計算す
るために、ステップ例において、メモリ１１１１よシ被
めっき物（３）の面積値と電力量およびあらかじめ設定
されている計算パラメータＫを取り出し、ステップ翰に
おいて、その時点での被めっき物（３）に析出している
。めっきの膜厚を計算する。The reading is taken into the CPU (11) via the input circuit A (12), and then in a step, the read power amount is stored in the memory I.Subsequently, in order to calculate the plating film thickness, in the step example, The area value, electric energy, and preset calculation parameter K of the object to be plated (3) are retrieved from the memory 1111, and deposited on the object to be plated (3) at that point in the step. Calculate the film thickness.
この膜厚の計算式は次のようになる。The calculation formula for this film thickness is as follows.
〔めっき膜厚）＝（Ｋ）Ｘ（電力量〕÷〔面積値〕ここ
で計算パラメータには、めっきの種類や、めっき液の種
類等によシ定まる定数で、電力量の単位を（アンペア・
分）９面積の単位を（ｄｒｎ’）、めっき膜厚の単位を
〔紬〕とすると、一般的な銅めりきの場合では、にの値
は０．ト→、２となる。[Plating film thickness] = (K)・
9) If the unit of area is (drn') and the unit of plating film thickness is [tsumugi], then in the case of general copper plating, the value of is 0. →, becomes 2.
めっき膜厚の１算終了後、めりき膜厚計算手段（８）は
、ステップ弼および（イ）に進みステップ翰で計算した
結果のデータを出力回路ＢＱ５１を経由して、めっき膜
厚表示器（９）へ送り出す。めっき膜厚表示器（９）は
、めりき膜厚計算手段（８）より送られたデータを表示
し２次のデータが送られてくるまでその表示を保持しな
がら待機する。After completing the first calculation of the plating film thickness, the plating film thickness calculation means (8) proceeds to steps 2 and (a), and outputs the data calculated in step 2 via the output circuit BQ51 to the plating film thickness display. Send to (9). The plating film thickness display (9) displays the data sent from the plating film thickness calculation means (8) and waits while holding the display until the secondary data is sent.
ステップ弼および（イ）で、めっき膜厚表示器（９）Ｋ
データを送った後、めっき膜厚計算手段（８）は、ステ
ップ■で１秒間待機したのち再度ステップ＠に戻シ、ス
テップ（至）からステップ（イ）までを繰返し実行する
。At step 2 and (a), plating film thickness indicator (9)K
After sending the data, the plating film thickness calculation means (8) waits for one second in step (2), returns to step @ again, and repeats steps from step (to) to step (a).
このような動作を続けていると、めっき回路に流れた電
力量は次第に増加し、その結果めつき膜厚表示器（９）
に表示される膜厚値も増えてゆく。従って、めっき作業
員は被めっき物（３）の面積を入力し、めっき槽忙セッ
トした後、めりき膜厚表示器（９）の表示を適時見なが
ら、その表示が規定された膜厚値になったら１作業を終
了することになる。As this operation continues, the amount of power flowing into the plating circuit gradually increases, and as a result, the plating film thickness indicator (9)
The film thickness value displayed also increases. Therefore, the plating operator enters the area of the object to be plated (3), sets the plating tank, and then watches the display on the plating film thickness indicator (9) at the appropriate time to see if the display indicates the specified film thickness. When this happens, one task will be completed.
なお、前記実施例は、めっき金！Ｒｔ−被めっき物（３
）に析出させる電着めりきの例であるが、電着めっきば
かりでなく、陽極処理等に応用することも可能である。In addition, in the above example, plating gold! Rt-Plated object (3
), but it is also possible to apply not only electrodeposition plating but also anodic treatment, etc.
例えば陽極処理では被めっき物（３）が陽極に変シ、交
流を用いた処理では電源（５）が交流電源に変ル、陽極
（４）の代りくもう１つの被めっき物を装着するように
変えられる。また計算パラメータにの値は、一般的な銅
めっきの場合の例を示したが他のめっきにおいては、そ
の値は様々に変化するものである。加えて第３図のステ
ップ（イ）における待機時間を１秒としたが、これは特
に１秒である必要はない。For example, in anodization, the object to be plated (3) is changed to an anode, and in processing using alternating current, the power source (5) is changed to an AC power source, and another object to be plated is attached in place of the anode (4). can be changed to Further, although the values of the calculation parameters are shown as examples for general copper plating, the values may vary in other platings. In addition, although the waiting time in step (a) of FIG. 3 was set to 1 second, it does not need to be 1 second.
以上のように、この発明は積算電力計、被めっき物面積
入力器、めっき膜厚計算手段及び表示器を有し、めりき
作業中に被めっき物に加わった電流と時間の積である電
力量と被めっき物の面積をもとにして、逐次その時点で
のめっき膜厚が表示されるため、電源の変動、めっき時
間またはめっき電流の作業誤りなどＫよる。めっき膜厚
外れを未然に防止でき、さらにめっき時間のカウントの
必要がなくなるため省力化にも効果があるほか。As described above, the present invention has an integrated wattmeter, a plating object area input device, a plating film thickness calculation means, and a display, and the electric power is the product of the current applied to the plating object during plating work and time. Since the plating film thickness at that point in time is displayed sequentially based on the amount and the area of the object to be plated, it may depend on changes in power supply, plating time or plating current errors, etc. It is possible to prevent the plating film thickness from changing, and it is also effective in saving labor as there is no need to count the plating time.
従来の設備がそのまま利用できしかも本件の装置は構成
がシンプルであるために安価忙めっき膜厚の管理が可能
となる。Conventional equipment can be used as is, and the device of the present invention has a simple configuration, making it possible to control the plating film thickness at low cost.
第１図は、この発明による。めっき膜厚表示装置の一実
施例の全体構成図、第２図は、めりき膜厚計算手段を実
現するためのマイクロコンピュータの構成図＋ＳＳ図は
、その動作を示すフローチャートを示す図である。
図中（１）はめつき槽、 ＋２＋Ｆｉめっき液、（３）
は被めっき物、（４）は陽極、（５）はめっき用電源、
（６）は積算電力計、（７）は面積入力器、（８）はめ
っき膜厚計算手段。
（９）はめっき膜厚表示器である。
なお図中同一符号は同一わるいは相当部分を示す。FIG. 1 is according to the invention. FIG. 2 is a diagram showing the overall configuration of an embodiment of a plating film thickness display device. FIG. 2 is a diagram showing the configuration of a microcomputer for realizing a plating film thickness calculation means, and FIG. 2 is a diagram showing a flowchart showing its operation. In the figure (1) plating tank, +2+Fi plating solution, (3)
is the object to be plated, (4) is the anode, (5) is the power source for plating,
(6) is an integrated power meter, (7) is an area input device, and (8) is a plating film thickness calculation means. (9) is a plating film thickness indicator. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (2)
印加された電力の量を検出する積算電力計と、被めっき
物の面積を入力する面積入力器と、上記積算電力計の出
力信号と、上記面積入力器からのデータを入力とし、被
めっき物のめっき膜厚を計算するめっき膜厚計算手段と
、このめっき膜厚計算手段の出力に基づきめっき膜厚を
表示するめっき膜厚表示器とを備えた、めっき膜厚表示
装置。(1) An integrated wattmeter that detects the amount of power applied to the object to be plated immersed in the plating solution in the plating tank, an area input device that inputs the area of the object to be plated, and the output of the above integrated wattmeter. A plating film thickness calculation means that calculates the plating film thickness of the object to be plated by inputting the signal and data from the area input device, and a plating film thickness that displays the plating film thickness based on the output of this plating film thickness calculation means. Plating film thickness display device equipped with an indicator.
現されている、特許請求範囲第１項記載のめっき膜厚表
示装置。(2) The plating film thickness display device according to claim 1, wherein the plating film thickness calculation means is realized by a microcomputer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59132612A JPS6111649A (en) | 1984-06-27 | 1984-06-27 | Display device for plating film thickness |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59132612A JPS6111649A (en) | 1984-06-27 | 1984-06-27 | Display device for plating film thickness |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6111649A true JPS6111649A (en) | 1986-01-20 |
Family
ID=15085396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59132612A Pending JPS6111649A (en) | 1984-06-27 | 1984-06-27 | Display device for plating film thickness |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6111649A (en) |
-
1984
- 1984-06-27 JP JP59132612A patent/JPS6111649A/en active Pending
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