JP3245366B2 - Load condition monitoring device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power supply for plating which forms a metal coating layer on a metal substrate, detects a voltage or a current under the optimum electrolysis conditions output from the power supply, and averages the detected values. The absolute value of the absolute value, the set value of the upper limit and the lower limit of the absolute value are compared with the present detection value, and a warning is output when the set value is out of the set value.

[0002]

2. Description of the Related Art A load condition monitoring device is a device that detects a change in a load condition as a change in a voltage or current value and monitors an initial load condition so as to be maintained within a predetermined range. Although there are various uses of this apparatus, a load state monitoring apparatus used for a power supply apparatus for electrolytic plating will be described here.

In recent years, power supply devices controlled by electrolytic conditions used for electroplating, electrolytic degreasing, electrolytic stripping, and the like have been required in accordance with demands for rationalization of production, reduction of cost, uniform stability of quality, and efficiency of work. In addition to the original functions of the power supply such as the waveform, power effect, and voltage fluctuation rate, the stepless voltage and current adjustment function, miniaturization of the voltage and current adjustment device, remote operability, automation of the device, etc. There is a tendency that a power supply device with conditions is strongly demanded.

[0004] In electroplating, as Faraday's law indicates, the amount of a substance reacting at an electrode is proportional to the amount of electricity. Therefore, in electroplating, current × time is controlled in principle. However, it is necessary to set and maintain conditions so that electroplating can be performed under optimal conditions that meet product quality requirements. However, 1).
Plating solution flow, shortage of plating solution, no plating solution,
2). Changes in plating solution concentration, 3). Poor wire contact (high resistance), 4). Short circuit due to foreign matter in plating jig; 5).
There is a problem that the plating quality in the initial state cannot be maintained due to a change in the load state such as disconnection.

In order to solve this problem, in a power supply device equipped with an output ammeter or a voltmeter, the output ammeter or the output voltmeter is provided with an upper limit indicator and a lower limit indicator, and the upper limit indicator and the lower limit indicator are provided. Setting means for setting the position of the upper or lower limit value of the voltage or current, and a switch circuit that operates when the pointer of the output ammeter or the output voltmeter deviates from the upper or lower pointer. A load condition monitoring device (commonly known as a meter relay) for monitoring a change in voltage or current, that is, a change in load condition, is generally provided (see Japanese Utility Model Application Laid-Open No. 61-65522). .

[0006]

However, in this type of load condition monitoring device, when a plating film layer is formed on the surface of a product substrate, the plating area and the plating thickness are often changed. After completion, the upper and lower limit values of the voltage or current were transcribed and recorded on another recording ledger or the like. Also, when re-forming the metal coating layer of a product performed in the past, search for the enormous upper and lower limits of voltage or current from the transcribed ledger or manually set it from the experience value of the operator. By operating the knob, the upper and lower limits were set. As a result, it takes time to set the upper and lower limits of the voltage or current, which lowers the work efficiency and lowers the productivity. Therefore, there is a problem that the uniformity of the plating film thickness, the reproducibility of the quality and the stability are lacking.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and improves the efficiency of setting the load condition of an object to a range of an upper-limit monitoring value and a lower-limit monitoring value of a voltage or a current. It is an object of the present invention to provide a load state monitoring device capable of preventing the setting errors and forgetting to change the upper limit value and the lower limit value, and improving the reproducibility and stability of the quality of the metal film layer.

[0008]

A load condition monitoring device according to the first aspect of the present invention is used in a power supply device for electroplating for producing a good metal film layer on a substrate of a product. A monitoring condition setting value input unit for monitoring a load condition, a measuring amplifier for detecting an output value of the optimum load condition set by the power supply device, and a detection value (analog value) detected by the measuring amplifier converted to a digital value. An A / D converter, a detection processing means for supplying the digital value to a central processing unit (CPU) of a microcomputer, and an upper limit monitoring value and a detection value of a voltage or a current in an optimum load state of the power supply device. Upper and lower monitoring value setting means for setting a lower monitoring value, comparing a current detection value of a voltage or current value of the power supply device with the upper monitoring value and the lower monitoring value, and monitoring the upper monitoring value and the lower monitoring value. And an upper limit and lower limit monitoring value setting means for performing detection processing of a required number (n times) of optimum load state detection values X. , The average value of the sum XS (= X1 +
X2 +... + Xn / n), the average value Xs and the upper and lower limit percentages Y of the preset monitoring width coefficient.
An upper limit and lower limit monitor value setting program for calculating an upper limit monitor value XH (= XS + XS × Y1%) and a lower limit monitor value XL (= XS−XS × Y2%) from 1 and Y2; Has a load state monitoring program for comparing the current detected value M of voltage or current with the set upper limit monitoring value XH and lower limit monitoring value XL, and the current voltage or current of the current output from the power supply device is provided. When the detection value M deviates from the upper monitoring value XH and the lower monitoring value HL (XH <M, M <X
This is achieved by a configuration including an alarm / display output unit that outputs a warning in L) and displays a load state. As a result, the upper-limit monitoring value and the lower-limit monitoring value of the voltage or the current are automatically set, so that the setting operation of the upper-limit and the lower-limit monitoring values of the voltage or the current becomes easy, and the setting operation can be made more efficient. At the same time, it is possible to prevent the setting error of the upper limit monitoring value and the lower limit monitoring value and omission of the setting change, and to remarkably improve the reproducibility and stability of the load state of the object.

According to a second aspect of the present invention, there is provided the load state monitoring apparatus according to the first aspect, wherein the set coefficient used for setting the upper limit monitor value and the lower limit monitor value of the voltage or the current is ± 1%. Achieved by an arrangement that selects between upper and lower percentages of ~ 99%. by this,
The setting corresponding to the required accuracy of the upper limit monitoring value and the lower limit monitoring value can be performed.

According to a third aspect of the present invention, there is provided a load state monitoring apparatus according to the first aspect, wherein the warning and the display of the load state are such that the detection value M is an upper limit monitoring value XH and a lower limit monitoring value XL. This is achieved by a configuration in which the number of glitches and the waveform of the glitches within a predetermined time or a deviated duration are detected and performed. As a result, the monitoring of the load state is stabilized, and the target load state can be displayed by a waveform.

According to a fourth aspect of the present invention, there is provided the load state monitoring apparatus according to the first aspect, wherein the measurement value M of the load state monitoring and monitoring means performs n samplings of the measurement value. Average value of the sum MS (= MS1 + MS2 + ... +
(MSn / n). Thereby, the error of the measured value due to the disturbance is reduced, and the accuracy of the comparison object is improved.

According to a fifth aspect of the present invention, there is provided the load state monitoring device according to the first aspect, wherein the detection value X of the detection processing means performs a detection process of the detection value X a predetermined number of times. The average value XS of the sum is calculated a required number of times (n times), and the average detected value XSS of the average detected value XS (= XS1 +
XS2 +... + XSn / n). As a result, an error due to disturbance is removed, and more accurate upper and lower limit monitoring values of the average detection value XSS can be set.

[0013]

Next, an example of an embodiment of the present invention will be described. FIG. 1 is a block diagram showing a configuration of a load state monitoring apparatus according to an embodiment of the present invention.
FIG. 3 is a flowchart showing the operation of the load state monitoring apparatus according to one embodiment of the present invention, FIG. 3 is a flowchart showing the operation of setting the monitoring conditions of the load state monitoring apparatus according to one embodiment of the present invention, and FIG. FIG. 5 is a flowchart showing an operation of setting an upper limit and a lower limit monitoring value of the load state monitoring apparatus according to one embodiment of the present invention. FIG. 5 is a flowchart showing an operation of load state monitoring of the load state monitoring apparatus according to one embodiment of the present invention. It is.

FIG. 1 is a block diagram of a control system for controlling the entire load state monitoring apparatus according to the embodiment of the present invention.

In FIG. 1, reference numeral 200 denotes a microcomputer. The microcomputer 200 includes a commercially available CUP (central processing unit) 201 having storage, calculation, and control for controlling the entire load condition monitoring device. , CP
ROM 202 which is connected to U201 and stores an upper limit and lower limit monitoring value setting program, a load state monitoring program, and various (monitoring condition) setting value input programs, furthermore, monitoring conditions that have been set and changed, and upper limit and lower limit monitoring that have been set. A RAM 203 for temporarily storing values and the like is provided.

The CUP 201 is connected to a measurement amplifier 101 and a detection processing unit 100 including an A / D converter 102 for converting an analog value to a digital value. Further, a monitoring condition setting input unit 208 including an operation switch 206 and an input circuit 207 is connected. Further, a liquid crystal display unit 204 for displaying the monitoring condition upper and lower monitoring values and the load state is connected. Further, an output circuit 301 for sounding the alarm buzzer 300 is connected. The CPU (Central Processing Unit) 201 has an interface (RS-232C) 205 as an external connection terminal, and sets and changes monitoring conditions from a personal computer (PC) (not shown) installed outside. You can do input etc.

Next, the basic operation of the load condition monitoring device of the present invention will be described with reference to FIGS.

In the present invention, as shown in FIGS. 2 and 3, when there is a start / stop button signal or a plating start signal from the line sequencer, the execution program described in the CPU 201 is executed, and the monitoring condition is monitored. Configuration·
Initial settings for change are made (step 401). It is determined whether the initial setting input is performed or not. When performing the initial setting input, the program reads various (monitoring condition) setting value input programs stored in the ROM 202 and executes various (monitoring condition) setting value input (step A). Here, the setting / change is performed by the operation (setting) switch 206 in the monitoring mode.
The monitoring condition values such as the monitoring width, the monitoring value, the duration, and the number of times of glitch detection are set and changed. The result is stored in the RAM 203.

If no initial setting input is performed, it is determined whether to perform automatic sampling (upper and lower monitoring value setting) or not. If automatic sampling (upper and lower monitoring value setting) is to be performed, Then, the upper limit and lower limit monitoring value setting program described in the ROM 202 is called and executed to perform automatic sampling (upper and lower limit monitoring value setting) (step B). The result is stored in the RAM 203.

If automatic sampling (upper and lower limit monitoring value setting) B is not performed, automatic monitoring (load state monitoring)
When performing automatic monitoring (load status monitoring) by determining whether or not to perform the automatic monitoring (load status monitoring), the load status monitoring program described in the ROM 202 is called and executed to execute the automatic monitoring (load status monitoring). Perform (Step C). further,
The power supply check program written in the ROM 202 is called up and executed to perform a power supply check (step D). Then, the result is displayed on the liquid crystal display 204 and the alarm buzzer 300 is sounded.

When the automatic monitoring (load condition monitoring) is not performed, the process returns to the input of the monitoring condition setting (step 401), and the respective steps are sequentially executed.

The steps B, C, and D of setting the upper and lower monitoring values (automatic sampling), monitoring the load condition, and checking the power supply, which are executed in the above basic operations, are shown in FIGS.
This will be described in detail based on FIG.

The upper and lower limit monitoring value setting (automatic sampling) B is performed by executing an upper and lower limit monitoring value setting program.

As shown in FIG. 4, the output value (detection value) X under the optimum load condition of the plating power supply device is detected a predetermined number of times (step B1). It is determined whether the detection condition is continuous processing or intermittent processing. If the detection process is an intermittent process, a detection process of the output value (detection value) X of the power supply device is performed at specified time intervals (step B2). If the detection process is a continuous process, the output value (detection value) X of the power supply device is detected a predetermined number of times by the start signal of the power supply (step B3). And
In steps B2 and B3, it is determined whether the specified number of detection processes has been completed. If the detection process is not completed, R
In ETUN, the process returns to step B1 to continue the detection process. If the detection process has been completed, a predetermined number of times (n times)
Average detection value XS (= X1 + X2 +...)
+ Xn / n) (step B4). Step B4
The average detection value XS calculated in the above is defined as an absolute value, and the upper limit and lower limit percentage Y1, of a preset monitoring width setting coefficient,
A calculation process is performed to set an upper limit monitoring value XH (= XS + XS × Y1%) and a lower limit monitoring value XL (= XS−XS × Y2%) from Y2 (step B5). The upper limit monitoring value XH of the calculation result,
The lower limit monitoring value XL is stored in the RAM 203 (see FIG. 1).

The load state monitoring value (automatic monitoring) C is performed by executing a load state monitoring program.

As shown in FIG. 5, a process of detecting the current output value (detected value) M of the plating power supply device is performed (step C).
1). The detected value is set in step B5, and it is determined whether the detected value is within the range of the upper limit monitoring value XH and the lower limit monitoring value XL stored in the RAM 203 or not. When the output value (detection value) M is within the range (upper limit monitoring value XH> detection value M> lower limit monitoring value XL), the duration measuring timer is reset and the plating process is continued (step C2). If the output value (detection value) M is out of the range (upper limit monitoring value XH <detection value M or lower limit monitoring value XL> detection value M), the detection value M has been out of the range for a predetermined time or has not continued. To determine When the detected value M is out of the range and continues for a predetermined time or more, an alarm is output to sound the alarm buzzer and the load state is displayed on the liquid crystal display (step C3). If the detected value M has not been out of the range for a predetermined time or more, it is determined whether a glitch has been detected for a predetermined number of times or not. If a glitch is detected a predetermined number of times or more, an alarm is output to sound an alarm buzzer and the load state is displayed on the liquid crystal display (step C4). If no glitch has been detected a predetermined number of times or more, the plating process is continued.

[0027]

According to the first aspect of the present invention, a voltage or current value in an optimal load state is detected a predetermined number of times, and an average value of the sum of the detected values is defined as an absolute value. Since the lower limit monitoring value is calculated automatically using the upper limit monitoring percentage and the lower limit monitoring percentage set in the monitoring condition, the upper limit and the lower limit monitoring values of the average detection value are automatically set. In comparison with the above, there is no need for manual calculation setting, and the setting work of the upper and lower monitoring values is significantly improved.Also, setting errors of the upper and lower monitoring values and omission of setting are eliminated, and the initial load state is maintained. Can be.

[Brief description of the drawings]

FIG. 1 is a block diagram of a load state monitoring device according to one embodiment of the present invention.

FIG. 2 is a flowchart showing an operation of the load state monitoring device according to one embodiment of the present invention.

FIG. 3 is a diagram illustrating a monitoring condition setting of the load state monitoring apparatus according to the embodiment of the present invention;

FIG. 4 is a flowchart showing an operation of automatic sampling of the load state monitoring device according to one embodiment of the present invention.

FIG. 5 is a flowchart showing an operation of automatic monitoring of the load state monitoring device according to one embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 100 detection processing unit 101 measurement amplifier 102 A / D converter 200 microcomputer 201 CUP (central processing unit) 202 ROM 203 RAM 204 liquid crystal display unit 205 interface (RS-232C) 206 operation switch 207 input circuit 208 monitoring condition setting input unit 300 Alarm buzzer 301 Output circuit

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) C25D 21/12 G05F 1/10 304

Claims (5)

(57) [Claims] 1. A power supply device for electroplating for producing a good metal film layer on a substrate of a product, wherein a monitoring condition set value input means for monitoring a load condition, and an optimum condition set by the power supply device. And a A / D converter for converting a detection value (analog value) detected by the measurement amplifier into a digital value, and a central processing unit (MPU) of the microcomputer. C
PU), upper and lower monitoring value setting means for setting an upper monitoring value and a lower monitoring value based on a voltage or current detection value of an optimum load state of the power supply, and a voltage of the power supply. Or a load state monitoring means for comparing the current detection value of the current value with the upper limit monitoring value and the lower limit monitoring value, and determining whether the current value is within the range of the upper limit monitoring value and the lower limit monitoring value or outside the range. The upper limit and lower limit monitoring value setting means performs detection processing of the required number (n times) of the optimum load state detection values X, and averages the sum X S (= X 1 + X 2 +... +
Xn / n) is calculated, and the upper limit monitoring value XH (= XS + XS × Y1%) and the lower limit monitoring value XL (= XS−) are calculated from the average value XS and the preset upper and lower percentages Y1 and Y2 of the monitoring width coefficient. XS × Y2%), and the load condition monitoring means further includes a current detection value M of the voltage or current and the set upper limit monitoring value XH and lower limit monitoring value. XL and a load state monitoring program for comparing the current voltage or current detected value M output from the power supply with the upper limit monitoring value XH and the lower limit monitoring value HL (XH <M, M <XL). ) Is provided with an alarm / display output means for outputting an alarm and displaying a load state. 2. The apparatus according to claim 1, wherein the setting coefficient used for setting the upper monitoring value and the lower monitoring value of the voltage or the current is selected within a range of an upper limit and a lower limit percentage of ± 1% to 99%. The load state monitoring device according to claim 1. 3. The warning and display of the load state is performed by detecting a continuous time in which the detection value M deviates from the upper monitoring value XH and the lower monitoring value XL or the number of glitches within a predetermined time and its waveform. The load state monitoring device according to claim 1, wherein 4. The measured value M of said load condition monitoring means.
2. The load state monitoring apparatus according to claim 1, wherein the sampling of the measured values is performed n times, and an average value MS (= MS1 + MS2 +... + MSn / n) is used. 5. The detection value X of the detection processing means is subjected to a detection process of the detection value X a predetermined number of times, an average value XS of the sum is calculated a required number of times (n times), and the average detection value XS sum is calculated. 2. The load state monitoring device according to claim 1, wherein the average detection value XSS (= XS1 + XS2 +... + XSn / n) is used.