JPS61115342A - 半導体封止用樹脂タブレツト - Google Patents

半導体封止用樹脂タブレツト

Info

Publication number
JPS61115342A
JPS61115342A JP59237219A JP23721984A JPS61115342A JP S61115342 A JPS61115342 A JP S61115342A JP 59237219 A JP59237219 A JP 59237219A JP 23721984 A JP23721984 A JP 23721984A JP S61115342 A JPS61115342 A JP S61115342A
Authority
JP
Japan
Prior art keywords
resin
tablet
cavity
mold
pot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59237219A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0348654B2 (enrdf_load_stackoverflow
Inventor
Ryoichi Yamashita
良一 山下
Hideto Suzuki
秀人 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP59237219A priority Critical patent/JPS61115342A/ja
Publication of JPS61115342A publication Critical patent/JPS61115342A/ja
Publication of JPH0348654B2 publication Critical patent/JPH0348654B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • H01L23/295Organic, e.g. plastic containing a filler
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59237219A 1984-11-10 1984-11-10 半導体封止用樹脂タブレツト Granted JPS61115342A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59237219A JPS61115342A (ja) 1984-11-10 1984-11-10 半導体封止用樹脂タブレツト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59237219A JPS61115342A (ja) 1984-11-10 1984-11-10 半導体封止用樹脂タブレツト

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP5168581A Division JP2576018B2 (ja) 1993-06-14 1993-06-14 半導体封止用樹脂タブレツト

Publications (2)

Publication Number Publication Date
JPS61115342A true JPS61115342A (ja) 1986-06-02
JPH0348654B2 JPH0348654B2 (enrdf_load_stackoverflow) 1991-07-25

Family

ID=17012142

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59237219A Granted JPS61115342A (ja) 1984-11-10 1984-11-10 半導体封止用樹脂タブレツト

Country Status (1)

Country Link
JP (1) JPS61115342A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS637638A (ja) * 1986-06-27 1988-01-13 Mitsubishi Electric Corp 樹脂封止形半導体の製造方法
US5336650A (en) * 1990-12-11 1994-08-09 Sharp Kabushiki Kaisha Method of making tape carrier semiconductor device
US5506444A (en) * 1990-12-11 1996-04-09 Sharp Kabushiki Kaisha Tape carrier semiconductor device
US6410615B1 (en) * 1998-06-09 2002-06-25 Nitto Denko Corporation Semiconductor sealing epoxy resin composition and semiconductor device using the same
WO2018179438A1 (ja) * 2017-03-31 2018-10-04 日立化成株式会社 エポキシ樹脂組成物、エポキシ樹脂硬化物及び電子部品装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS637638A (ja) * 1986-06-27 1988-01-13 Mitsubishi Electric Corp 樹脂封止形半導体の製造方法
US5336650A (en) * 1990-12-11 1994-08-09 Sharp Kabushiki Kaisha Method of making tape carrier semiconductor device
US5506444A (en) * 1990-12-11 1996-04-09 Sharp Kabushiki Kaisha Tape carrier semiconductor device
US6410615B1 (en) * 1998-06-09 2002-06-25 Nitto Denko Corporation Semiconductor sealing epoxy resin composition and semiconductor device using the same
WO2018179438A1 (ja) * 2017-03-31 2018-10-04 日立化成株式会社 エポキシ樹脂組成物、エポキシ樹脂硬化物及び電子部品装置
JPWO2018179438A1 (ja) * 2017-03-31 2020-02-27 日立化成株式会社 エポキシ樹脂組成物、エポキシ樹脂硬化物及び電子部品装置

Also Published As

Publication number Publication date
JPH0348654B2 (enrdf_load_stackoverflow) 1991-07-25

Similar Documents

Publication Publication Date Title
US5331205A (en) Molded plastic package with wire protection
KR20140043878A (ko) 반도체 장치의 제조 방법 및 반도체 장치
JPH0575565B2 (enrdf_load_stackoverflow)
JPS61115342A (ja) 半導体封止用樹脂タブレツト
JP2825332B2 (ja) 樹脂封止型半導体装置、該装置の製法および半導体封止用樹脂組成物
JP2576018B2 (ja) 半導体封止用樹脂タブレツト
EP0539109A1 (en) Transfer mold having balanced runners
EP0607949B1 (en) Method and resin composition for molding an optical connector ferrule
US5932160A (en) Process and mold for encapsulating semiconductor chips having radial runners
JPH0376779B2 (enrdf_load_stackoverflow)
JP2771838B2 (ja) 電子部品の樹脂封止方法、樹脂封止用成形金型及び電子部品封止成形品
JP2827115B2 (ja) 樹脂封止型半導体装置
JPH05267371A (ja) 樹脂封止型半導体装置
JPH04276414A (ja) Icカード用基板及びその樹脂封止用金型
KR100202499B1 (ko) 수지-캡슐화 반도체 장치
JPH06177189A (ja) 傾斜するゲートを有する半導体モールド装置
EP0539108A1 (en) Viscosity control channel for a transfer mold having a plurality of mold cavities
JPS60224234A (ja) 半導体装置の製造方法
JPS5827326A (ja) Icチツプの樹脂封止方法
JPH03116939A (ja) 半導体素子の樹脂封止方法
KR102766962B1 (ko) 광반도체 밀봉용 수지 성형물 및 그 제조 방법
KR100228776B1 (ko) 반도체 칩 패키지 몰딩 장치
JPH11176853A (ja) 半導体封止成形方法及び半導体封止成形金型
JPS626587B2 (enrdf_load_stackoverflow)
JPS5988854A (ja) 半導体装置