JPS6111523B2 - - Google Patents
Info
- Publication number
- JPS6111523B2 JPS6111523B2 JP54133742A JP13374279A JPS6111523B2 JP S6111523 B2 JPS6111523 B2 JP S6111523B2 JP 54133742 A JP54133742 A JP 54133742A JP 13374279 A JP13374279 A JP 13374279A JP S6111523 B2 JPS6111523 B2 JP S6111523B2
- Authority
- JP
- Japan
- Prior art keywords
- recess
- semiconducting layer
- mold
- outer semiconducting
- insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012212 insulator Substances 0.000 claims description 8
- 238000000465 moulding Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Processing Of Terminals (AREA)
Description
【発明の詳細な説明】
この発明は、ゴム・プラスチツクケーブルの絶
縁接続部の形成方法に関し、特に外部半導電層
(外部しやへい層)の縁切り部の形成方法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of forming an insulated connection portion of a rubber-plastic cable, and more particularly to a method of forming an edge cut portion of an outer semiconducting layer (outer insulation layer).
従来技術(第1、第2図)
接続部絶縁体10を加熱加圧モールドによつて
形成した後、一方のテーパ面12に凹み14を設
ける。それはナイフなどで削つて作る。その中に
半導電テープを巻き、加熱加圧モールドによつて
外部半導電層16を形成する。それを一方のケー
ブル18の外部半導電層20に、電気的に接続す
る。Prior Art (FIGS. 1 and 2) After the connecting portion insulator 10 is formed by heating and pressurizing molding, a recess 14 is provided in one tapered surface 12. It is made by carving it with a knife. A semiconductive tape is wound therein, and an external semiconductive layer 16 is formed by heating and press molding. It is electrically connected to the outer semiconducting layer 20 of one cable 18.
それからその上に絶縁層22と外部半導電層2
4を設ける。外部半導電層24をもう一方のケー
ブル26の外部半導電層28に、電気的に接続す
る。 Then on top of that an insulating layer 22 and an outer semiconducting layer 2
4 will be provided. The outer semiconducting layer 24 is electrically connected to the outer semiconducting layer 28 of the other cable 26 .
この場合、凹み14を作るのが非常にむずかし
い。熟練者でも4〜5時間位かかる。 In this case, it is very difficult to make the recess 14. Even for an experienced person, it takes about 4 to 5 hours.
発明の目的
上記の問題を解消し、容易に凹み14を形成出
来るようにする。OBJECT OF THE INVENTION To solve the above problems and to easily form a recess 14.
実施例
(第3、第4図)
まず、「第3図」に示す型30を用意する。こ
れは、凹み14と大きさ、形ともに同じに作る。
材質は、金属または耐熱性のプラスチツク(フツ
化エチレンなど)である。Example (FIGS. 3 and 4) First, a mold 30 shown in "FIG. 3" is prepared. This is made to have the same size and shape as the recess 14.
The material is metal or heat-resistant plastic (fluorinated ethylene, etc.).
たとえば、架橋剤入りテープなどで接続部絶縁
体の母体100を作つた後、そのテーパ面12
に、型30を当てる。その上に押えテープ32を
巻く。そして、金型34をかぶせ、シール36を
し、ボンベ38から高圧の窒素ガスを送り込みな
がら、加熱加圧モールドを行なう。 For example, after making the connection portion insulator base 100 using tape containing a crosslinking agent, the tapered surface 12
Apply mold 30 to. Wrap the presser tape 32 over it. Then, a mold 34 is placed on the mold 34, a seal 36 is applied, and heating and pressure molding is carried out while feeding high-pressure nitrogen gas from a cylinder 38.
接続部絶縁体の母体100が溶融すると、型3
0はその中にのめり込む。冷却してから型30を
取りはずすと、その後が、凹み14になる。 When the base body 100 of the connecting portion insulator melts, the mold 3
0 gets absorbed into it. When the mold 30 is removed after cooling, the recess 14 is left behind.
発明の効果
(1) 作業が技術的に容易になり、作業時間が大幅
に短縮できる。Effects of the invention (1) Work becomes technically easier and work time can be significantly shortened.
(2) 作業者による個人差がなく、品質が安定す
る。(2) There are no individual differences among workers, and quality is stable.
第1図と第2図は従来技術の説明図、第3図は
この発明において使用する型30の一部縦断側面
図、第4図はそれを使つて加熱加圧モールドを行
なつている状態の説明図である。
10……接続部絶縁体、12……テーパ面、1
4……凹み、16と24……外部半導電層、30
……型、100……接続部絶縁体の母体。
Figures 1 and 2 are explanatory diagrams of the prior art, Figure 3 is a partial vertical sectional side view of the mold 30 used in the present invention, and Figure 4 is a state in which the mold is used for hot press molding. FIG. 10... Connection insulator, 12... Tapered surface, 1
4... Recess, 16 and 24... Outer semiconducting layer, 30
...Type, 100...Main body of the connecting part insulator.
Claims (1)
を作り、その一方のテーパ面12に凹み14を作
り、その中に半導電体を充てんして、一方のケー
ブル18の外部半導電層20に電気的に接続する
外部半導電層16を形成し、その上に絶縁層22
を設け、その上に、他方のケーブル26の外部半
導電層28に電気的に接続する外部半導電層24
を形成して、外部半導電層の縁切りを行なうにさ
いして、 接続部絶縁体の母体100の前記テーパ面12
に、前記凹み14と同形同大の型30を当ててお
いて、加熱加圧モールドし、その後前記型30を
取り除くことにより前記凹み14を形成すること
を特徴とするゴム・プラスチツクケーブルの絶縁
接続部の形成方法。[Claims] 1. Connection portion insulator 10 formed by heating and pressurizing molding.
A recess 14 is formed in one tapered surface 12, and a semiconductor is filled in the recess 14 to form an outer semiconducting layer 16 electrically connected to the outer semiconducting layer 20 of one cable 18. , an insulating layer 22 thereon
and an outer semiconducting layer 24 electrically connected to the outer semiconducting layer 28 of the other cable 26 thereon.
When forming and cutting the edge of the external semiconducting layer, the tapered surface 12 of the base body 100 of the connection portion insulator
A mold 30 of the same shape and size as the recess 14 is applied to the insulator, molded under heat and pressure, and then the recess 14 is formed by removing the mold 30. How to form connections.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13374279A JPS5657273A (en) | 1979-10-17 | 1979-10-17 | Method of forming insulated connecting portion of rubber plastic cable |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13374279A JPS5657273A (en) | 1979-10-17 | 1979-10-17 | Method of forming insulated connecting portion of rubber plastic cable |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5657273A JPS5657273A (en) | 1981-05-19 |
JPS6111523B2 true JPS6111523B2 (en) | 1986-04-03 |
Family
ID=15111852
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13374279A Granted JPS5657273A (en) | 1979-10-17 | 1979-10-17 | Method of forming insulated connecting portion of rubber plastic cable |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5657273A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0338728U (en) * | 1989-08-24 | 1991-04-15 | ||
JPH0575129U (en) * | 1992-03-24 | 1993-10-12 | 三菱樹脂株式会社 | Semi-transparent to transparent folding container |
-
1979
- 1979-10-17 JP JP13374279A patent/JPS5657273A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0338728U (en) * | 1989-08-24 | 1991-04-15 | ||
JPH0575129U (en) * | 1992-03-24 | 1993-10-12 | 三菱樹脂株式会社 | Semi-transparent to transparent folding container |
Also Published As
Publication number | Publication date |
---|---|
JPS5657273A (en) | 1981-05-19 |
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