JPS6111523B2 - - Google Patents
Info
- Publication number
- JPS6111523B2 JPS6111523B2 JP54133742A JP13374279A JPS6111523B2 JP S6111523 B2 JPS6111523 B2 JP S6111523B2 JP 54133742 A JP54133742 A JP 54133742A JP 13374279 A JP13374279 A JP 13374279A JP S6111523 B2 JPS6111523 B2 JP S6111523B2
- Authority
- JP
- Japan
- Prior art keywords
- recess
- semiconducting layer
- mold
- outer semiconducting
- insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012212 insulator Substances 0.000 claims description 8
- 238000000465 moulding Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Processing Of Terminals (AREA)
Description
【発明の詳細な説明】
この発明は、ゴム・プラスチツクケーブルの絶
縁接続部の形成方法に関し、特に外部半導電層
（外部しやへい層）の縁切り部の形成方法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of forming an insulated connection portion of a rubber-plastic cable, and more particularly to a method of forming an edge cut portion of an outer semiconducting layer (outer insulation layer).
従来技術（第１、第２図）
接続部絶縁体１０を加熱加圧モールドによつて
形成した後、一方のテーパ面１２に凹み１４を設
ける。それはナイフなどで削つて作る。その中に
半導電テープを巻き、加熱加圧モールドによつて
外部半導電層１６を形成する。それを一方のケー
ブル１８の外部半導電層２０に、電気的に接続す
る。Prior Art (FIGS. 1 and 2) After the connecting portion insulator 10 is formed by heating and pressurizing molding, a recess 14 is provided in one tapered surface 12. It is made by carving it with a knife. A semiconductive tape is wound therein, and an external semiconductive layer 16 is formed by heating and press molding. It is electrically connected to the outer semiconducting layer 20 of one cable 18.
それからその上に絶縁層２２と外部半導電層２
４を設ける。外部半導電層２４をもう一方のケー
ブル２６の外部半導電層２８に、電気的に接続す
る。 Then on top of that an insulating layer 22 and an outer semiconducting layer 2
4 will be provided. The outer semiconducting layer 24 is electrically connected to the outer semiconducting layer 28 of the other cable 26 .
この場合、凹み１４を作るのが非常にむずかし
い。熟練者でも４〜５時間位かかる。 In this case, it is very difficult to make the recess 14. Even for an experienced person, it takes about 4 to 5 hours.
発明の目的
上記の問題を解消し、容易に凹み１４を形成出
来るようにする。OBJECT OF THE INVENTION To solve the above problems and to easily form a recess 14.
実施例
（第３、第４図）
まず、「第３図」に示す型３０を用意する。こ
れは、凹み１４と大きさ、形ともに同じに作る。
材質は、金属または耐熱性のプラスチツク（フツ
化エチレンなど）である。Example (FIGS. 3 and 4) First, a mold 30 shown in "FIG. 3" is prepared. This is made to have the same size and shape as the recess 14.
The material is metal or heat-resistant plastic (fluorinated ethylene, etc.).
たとえば、架橋剤入りテープなどで接続部絶縁
体の母体１００を作つた後、そのテーパ面１２
に、型３０を当てる。その上に押えテープ３２を
巻く。そして、金型３４をかぶせ、シール３６を
し、ボンベ３８から高圧の窒素ガスを送り込みな
がら、加熱加圧モールドを行なう。 For example, after making the connection portion insulator base 100 using tape containing a crosslinking agent, the tapered surface 12
Apply mold 30 to. Wrap the presser tape 32 over it. Then, a mold 34 is placed on the mold 34, a seal 36 is applied, and heating and pressure molding is carried out while feeding high-pressure nitrogen gas from a cylinder 38.
接続部絶縁体の母体１００が溶融すると、型３
０はその中にのめり込む。冷却してから型３０を
取りはずすと、その後が、凹み１４になる。 When the base body 100 of the connecting portion insulator melts, the mold 3
0 gets absorbed into it. When the mold 30 is removed after cooling, the recess 14 is left behind.
発明の効果
(1) 作業が技術的に容易になり、作業時間が大幅
に短縮できる。Effects of the invention (1) Work becomes technically easier and work time can be significantly shortened.
(2) 作業者による個人差がなく、品質が安定す
る。(2) There are no individual differences among workers, and quality is stable.
第１図と第２図は従来技術の説明図、第３図は
この発明において使用する型３０の一部縦断側面
図、第４図はそれを使つて加熱加圧モールドを行
なつている状態の説明図である。
１０……接続部絶縁体、１２……テーパ面、１
４……凹み、１６と２４……外部半導電層、３０
……型、１００……接続部絶縁体の母体。
Figures 1 and 2 are explanatory diagrams of the prior art, Figure 3 is a partial vertical sectional side view of the mold 30 used in the present invention, and Figure 4 is a state in which the mold is used for hot press molding. FIG. 10... Connection insulator, 12... Tapered surface, 1
4... Recess, 16 and 24... Outer semiconducting layer, 30
...Type, 100...Main body of the connecting part insulator.
Claims (1)
を作り、その一方のテーパ面１２に凹み１４を作
り、その中に半導電体を充てんして、一方のケー
ブル１８の外部半導電層２０に電気的に接続する
外部半導電層１６を形成し、その上に絶縁層２２
を設け、その上に、他方のケーブル２６の外部半
導電層２８に電気的に接続する外部半導電層２４
を形成して、外部半導電層の縁切りを行なうにさ
いして、 接続部絶縁体の母体１００の前記テーパ面１２
に、前記凹み１４と同形同大の型３０を当ててお
いて、加熱加圧モールドし、その後前記型３０を
取り除くことにより前記凹み１４を形成すること
を特徴とするゴム・プラスチツクケーブルの絶縁
接続部の形成方法。[Claims] 1. Connection portion insulator 10 formed by heating and pressurizing molding.
A recess 14 is formed in one tapered surface 12, and a semiconductor is filled in the recess 14 to form an outer semiconducting layer 16 electrically connected to the outer semiconducting layer 20 of one cable 18. , an insulating layer 22 thereon
and an outer semiconducting layer 24 electrically connected to the outer semiconducting layer 28 of the other cable 26 thereon.
When forming and cutting the edge of the external semiconducting layer, the tapered surface 12 of the base body 100 of the connection portion insulator
A mold 30 of the same shape and size as the recess 14 is applied to the insulator, molded under heat and pressure, and then the recess 14 is formed by removing the mold 30. How to form connections.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13374279A JPS5657273A (en) | 1979-10-17 | 1979-10-17 | Method of forming insulated connecting portion of rubber plastic cable |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13374279A JPS5657273A (en) | 1979-10-17 | 1979-10-17 | Method of forming insulated connecting portion of rubber plastic cable |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5657273A JPS5657273A (en) | 1981-05-19 |
| JPS6111523B2 true JPS6111523B2 (en) | 1986-04-03 |
Family
ID=15111852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13374279A Granted JPS5657273A (en) | 1979-10-17 | 1979-10-17 | Method of forming insulated connecting portion of rubber plastic cable |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5657273A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0338728U (en) * | 1989-08-24 | 1991-04-15 | ||
| JPH0575129U (en) * | 1992-03-24 | 1993-10-12 | 三菱樹脂株式会社 | Semi-transparent to transparent folding container |
-
1979
- 1979-10-17 JP JP13374279A patent/JPS5657273A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0338728U (en) * | 1989-08-24 | 1991-04-15 | ||
| JPH0575129U (en) * | 1992-03-24 | 1993-10-12 | 三菱樹脂株式会社 | Semi-transparent to transparent folding container |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5657273A (en) | 1981-05-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6111523B2 (en) | ||
| JPS56165217A (en) | Insulating layer cutting machine for cutting insulating layer of wires of wire pair | |
| DE3275145D1 (en) | Tape winding process for primary insulation of conductors | |
| JPS5533689A (en) | Formation method of thermal contact end portion of thermocouple wire | |
| JPH01186112A (en) | Formation of cable insulation and connection part | |
| JPH0441733Y2 (en) | ||
| JP2789583B2 (en) | Forming method of cable connection | |
| US2204994A (en) | Electric blasting initiator | |
| JPS6328557Y2 (en) | ||
| JPS59198817A (en) | Crosslinked rubber and plastic insulated cable connector | |
| JPS6116754Y2 (en) | ||
| JPH05211B2 (en) | ||
| JPS5436502A (en) | Insulation structure for winding end in electric machine | |
| KR200175380Y1 (en) | Spark gap | |
| JPS58188125A (en) | Method of producing solid electrolytic condenser | |
| JPS5256380A (en) | Manufacturing method for covered wire | |
| JPS6016714B2 (en) | Method for forming insulated joints in cross-linked polyethylene power cables | |
| SU1003257A1 (en) | Method of manufacturing standard windings of electric machines | |
| JPH036108Y2 (en) | ||
| JPH067536Y2 (en) | Light electric branch cable | |
| JP2598207B2 (en) | Manufacturing method of electric heating nozzle for sheet casting | |
| JPS6328558Y2 (en) | ||
| JPH0465082A (en) | Manufacture of joint for cv cable | |
| JPS60151026A (en) | Manufacture of thermally shrinkable tube | |
| JPS6144386B2 (en) |