JPS61112644U - - Google Patents
Info
- Publication number
- JPS61112644U JPS61112644U JP1984196392U JP19639284U JPS61112644U JP S61112644 U JPS61112644 U JP S61112644U JP 1984196392 U JP1984196392 U JP 1984196392U JP 19639284 U JP19639284 U JP 19639284U JP S61112644 U JPS61112644 U JP S61112644U
- Authority
- JP
- Japan
- Prior art keywords
- header
- semiconductor chip
- semiconductor device
- lead
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 229910001128 Sn alloy Inorganic materials 0.000 claims 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical group [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 230000007613 environmental effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984196392U JPS61112644U (US07321065-20080122-C00160.png) | 1984-12-27 | 1984-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984196392U JPS61112644U (US07321065-20080122-C00160.png) | 1984-12-27 | 1984-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61112644U true JPS61112644U (US07321065-20080122-C00160.png) | 1986-07-16 |
Family
ID=30754145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984196392U Pending JPS61112644U (US07321065-20080122-C00160.png) | 1984-12-27 | 1984-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61112644U (US07321065-20080122-C00160.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5829842B2 (ja) * | 1977-03-22 | 1983-06-25 | ドクトル・ヨハネス・ハイデンハイン・ゲゼルシヤフト・ミト・ベシユレンクテル・ハフツング | 測定装置 |
-
1984
- 1984-12-27 JP JP1984196392U patent/JPS61112644U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5829842B2 (ja) * | 1977-03-22 | 1983-06-25 | ドクトル・ヨハネス・ハイデンハイン・ゲゼルシヤフト・ミト・ベシユレンクテル・ハフツング | 測定装置 |
