JPS61111157U - - Google Patents
Info
- Publication number
- JPS61111157U JPS61111157U JP19588084U JP19588084U JPS61111157U JP S61111157 U JPS61111157 U JP S61111157U JP 19588084 U JP19588084 U JP 19588084U JP 19588084 U JP19588084 U JP 19588084U JP S61111157 U JPS61111157 U JP S61111157U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit package
- heat dissipation
- conductive sheets
- heat conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 3
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19588084U JPS61111157U (fr) | 1984-12-26 | 1984-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19588084U JPS61111157U (fr) | 1984-12-26 | 1984-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61111157U true JPS61111157U (fr) | 1986-07-14 |
Family
ID=30753496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19588084U Pending JPS61111157U (fr) | 1984-12-26 | 1984-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61111157U (fr) |
-
1984
- 1984-12-26 JP JP19588084U patent/JPS61111157U/ja active Pending