JPS61108153A - Electronic parts and manufacture thereof - Google Patents

Abstract

PURPOSE:To miniaturize an electronic part and to curb the scattering of products by a method wherein a package is constituted of a lamination of ceramic sheets, the main body of the electronic part is accommodated in a recess formed inside the lamination, and external electrodes are provided to be connected to the electrodes of the electronic part accommodated in the recess. CONSTITUTION:On a first lamination 6 of ceramic sheets 6a-6c, a second lamination 8 of ceramic sheets 8a-83 is deposited, provided with a through-hole 9. An electronic part (diode pellet) with electrodes 10a, 10b installed on its both sides is accommodated in a recess that is the through-hole 9 so that the electrode 10a may be in contact with a first conductive film 7. Thereon, a ceramic sheet 8' provided with a smaller through-hole 9' is deposited, an conductive material 11 is injected into the through hole 9' to electrically contact the electrode 10b, and then a second conductive film 12 is formed to be in electrical contact with an end of the conductive material 11. On the second conductive film 12, a 3-layer ceramic lamination 13 is deposited to occlude the smaller through-hole 9'. Interlayer conductive films 14a, 14b formed between layers at both ends of the ceramic laminations 6, 8, 13 are connected to external electrodes 15a, 15b.

Description

[Detailed description of the invention] Industrial applications The present invention relates to an ultra-small electronic component and a method for manufacturing the same.

BACKGROUND OF THE INVENTION Recently, in order to downsize electronic circuit devices, smaller electronic components have been used to improve packaging density. Second
Figure 1 shows an example of a small electronic component.
is an electronic component body, for example, a diode Pellerit, 2 is a 2
This set of leads is arranged in a straight line with one end close to each other, and the beret soto 1 is mounted on one lead 2a, and the electrode on the beret 1 and the other lead 2b are connected by a thin metal wire 8.
It is connected at. Reference numeral 4 indicates an exterior part in which the main parts including the pellet 1 are coated with resin.

This electronic component generally uses a lead frame 5 shown in FIG. 22, and includes a mounting process in which the pellet 1 is mounted on the lead 2a, a beret, and an electrode holder 2b on the bottom 1 is connected with a thin metal wire 8. Wire bonding process, resin molding process, process of cutting and removing unnecessary parts of lead frame 5 to make leads 2a and 2b independent and separating them into individual electronic components, lead 2. A, 2b are manufactured all at once through a process of shaping and so on.

Problems to be Solved by the Invention However, in this type of electronic component, it is necessary to make the thin metal wire 8 sufficiently thick, which limits miniaturization.

In addition, the manufacturing equipment used in each process is unique to each process and requires high precision, making it impossible to work on multiple electronic components at the same time, resulting in a time-consuming manufacturing process.

The present invention has been proposed in view of the above-mentioned problems, and includes an envelope made of a laminate of cefmic sheets, and a recess formed in the laminate to house an electronic component body and form external electrodes. It is something.

Example The present invention will be explained in detail below with reference to FIGS. 1 to 20.

In FIG. 1, reference numeral 6 denotes a first ceramic, J comb 1-, in which eight ceramic sheets 612.6b and 6C are laminated. 7 is the first cerami.

A first conductive film 1 to 8 is formed from the center of the upper surface of the K.76t toward one side edge, and 8 is a through hole 9 in the center.
In the illustrated example, there are five ceramic sheets 8a, 8b, 8C1 having through holes of the same diameter.
Bd and Be are laminated.

Reference numeral 10 denotes an electronic component main body having electrodes 1'Oa and 10b at both ends, which is a diode pellet in the illustrated example, and one electrode (electrode 10a in the illustrated example) is inserted into the recess formed by the through hole 9 of the second ceramic sheet 8. It is accommodated so as to be in contact with the first conductive film 7.

8' is a second cefmic sheet, which is a second ceramic sheet 1. It has a through hole 9' having a smaller diameter than the through hole 9 of the ceramic sheet, and is laminated on the second ceramic sheet 8. 1
1 is a conductive member injected into the recess formed by the through hole 9' and electrically connected to the electrode 10b of the electronic component body 10;
is a second conductive film whose one end is electrically connected to the conductive member 11, that is, the electrode 10b, and which extends in the opposite direction to the first conductive film 7;
13 is a third conductive film formed between the laminated surfaces at both ends of the third sheet 8' to close the through hole 9' of the second ceramic sheet 8'; External electrodes formed on the outer surface of the sheet laminate are shown.

2 to 14 show a method of manufacturing the electronic component shown in FIG. 1. First, as shown in FIG. 2, the third conductive film 14 (14a, 14b) for forming external electrodes is formed on the substrate 16+ and pre-baked. Formation of the conductive film 14 (for example, a screen printing method can be used).

Then, as shown in FIG. 2, the third conductive film 1 on the substrate 16 is
A first ceramic layer 6 (Z) layer is formed on the 4 layers and pre-fired. This layer 6a may be formed by a screen printing method, or a ceramic or ref green sheet of a predetermined thickness may be used. Then, the formation of the conductive film 14 and the formation of the ceramic sheet 6 are repeated in the manner shown in FIGS.
The laminate shown in the figure is obtained. Although the thickness of the conductive film is sufficiently thin compared to the thickness of the ceramic sheet, the illustrated example emphasizes the thickness of the conductive film.

Then, as shown in FIG. 5, a first conductive film 7 is formed on the uppermost sheet 6C and pre-baked. Then, a second ceramic sheet 8a having through holes 9 is laminated and pre-fired (see FIG. 6). The process of forming the conductive film 14 (14a, 14b) and the bonding process of the Cebu Mimic sheet were repeated for the second ceramic "J-1 and 8", and the through holes 9 were formed as shown in FIG.
A ceramic sheet laminate having a plurality of bottomed recesses is obtained.

As shown in FIG. 9, an electronic component body (diode pellet) 10 is supplied into the recessed portion of the ceramic sheet laminate. Beret 10 can easily fit into the recessed part (like the counterfeit, Beret 10
Because it is formed with a slightly larger diameter, the pellet inside the recess,
) The position and orientation will vary.

In addition, for supplying Pellet (S) 10, holes with the same pattern as the arrangement pattern of the concave portions are drilled, and a plurality of pellets are prepared in advance using a Pellet and Soto arrangement jig (not shown) having a shaft and a lid on the bottom surface. A plurality of pellets can be supplied at once by arranging them on a pellet arranging jig.

After that, as shown in FIG. 10, a ceramic sheet 8' having a through hole 9' with a diameter smaller than that of the through hole 9 of the second ceramic sheet 8 is laminated to form a recess where the electric current m1ob of the electronic component body 10 is exposed. Form. As shown in the illustrated example, the diameter of the through hole 9' is formed to be large enough to cover the upper surface -10- of the beret 10 no matter where the beret 10 is located within the recess.

In the illustrated example, the second ceramic 1. The plate portion 9a' protruding into the through hole 9 of the seat 8' is flat, but in reality, the plate portion 9a' hangs down into the recess and comes into close contact with the top surface of the beret/l-10. be in close proximity.

Therefore, the thickness of each second ceramic sheet 8 and the number of laminated layers are determined by the thickness of the second ceramic sheet 8, and the laminated thickness σ of the ceramic sheet 8 is set to be approximately equal to the thickness of the second ceramic sheet 8, which is 1°. By doing so, the holes 9 in the sheet
The deformation of the plate portion near ′ can be reduced.

Next, as shown in FIG. 11, a brazing material (conductive member) 11' is supplied to the through hole 9'. This supply can also be carried out at the same time using an arrangement jig in the same manner as the Bere-Soto IO. Then, the brazing material 11' is melted by heating means such as an infrared heating device.

Thereafter, as shown in FIG. 12, a second conductive film connected to the conductive member 11 and extending in the opposite direction to the first conductive film 7 is formed.

Then, on this second Sebuminoku sheet 8', a third ceramic 1. A conductive film for forming external electrodes is formed on the upper surface of the laminate to obtain a laminate 17 containing a plurality of electronic component bodies. (See FIG. 13) Furthermore, the conductive film exposed on the outer surface is not shown in the same figure.

Then, this laminate is cut from the position where the third conductive film is divided into two (the position shown by the dashed line in Fig. 13) to obtain individual electronic component structures 17' (see Fig. 14), which are sintered. do.

Then, external electrodes are formed by soldering on the conductive parts E~1fH4a, 14/) exposed on the outer surface to obtain the electronic component shown in FIG.

The second end extends alternately from one end to the other end for each layer.
As shown in Figure 0, an electronic component (diode) Di is obtained in which a capacitor C is connected in parallel.

It should be noted that the present invention is not limited to the above-mentioned embodiments; for example, the electronic component main body 10 can be applied not only to a diode but also to anything that has electrodes on both sides.

In addition to forming the bump electrode 10b as the electronic component main body 10, it is also possible to use a flat electrode.

- In addition, the conductive member 11 can be made of not only solder, but also a conductive resin, and can also be supplied by using a metal wire or by a screen printing method.

-Also, the second conductive film 12 can be formed before supplying the conductive member 11, or the second conductive film 12 can be formed before supplying the conductive member 11.

Furthermore, the ceramic layer is not only formed by sequentially laminating ceramic sheets, but also by forming first, second, and third ceramic sheets (an intermediate ceramic layer and a pair of ceramic layers) into a plate shape in advance. They may be integrated using a frit that can be joined at a temperature lower than the heat resistance temperature of the electronic component body.

Effects According to the present invention, since the electrodes of the component body are directly led out to the outer surface of the exterior part, and the external electrodes are also formed directly on the outer surface of the exterior part, it is possible to realize a small electronic component.

Screen printing equipment and heating equipment are required as manufacturing equipment, but it is a simple process that involves repeating the same operation multiple times, and by aligning the jig, hundreds to tens of thousands of electronic components can be produced. However, since alignment can be performed all at once, manufacturing is easy and product variations can be suppressed.

By connecting capacitors in parallel, small electronic components can be realized.

[Brief explanation of the drawing]

FIG. 1 is a side sectional view showing an example of an electronic component according to the present invention;
Figures 2 to 14 are preliminary drawings for explaining the manufacturing method of the first mouth part, and Figures 2 to 3 and Figures 10 to 12 are partial side sectional views, and Figure 9. is a partial plan view, the first
3 shows a partial view of the portion 11111, and FIG. 14 shows a perspective view. -1 Figure 15 is a side sectional view showing another embodiment of the present invention;
16 to 19 are cross-sectional views showing the pattern of the conductive film of the electronic component shown in FIG. 15, FIG. 20 is a cross-sectional view showing the circuit of the electronic component shown in FIG. figure,
FIG. 22 shows a partial perspective view of a lead frame used for manufacturing the electronic component shown in FIG. 21. 6・・・・・・・・・・・・・・・・・・First ceramic sheet, 7・・・・・・・・・・・・・・・・・・
...First conductive film, 8...
・ ・Second ceramic sheet, 9・・・・・・・・・
......Through hole, lO...
. . . Electronic component body, 10a, 10b . . . Electrode, 12 . . . Second conductive film, 13
・Listen・Second Section @ Present N K＞Madashi
Amendment to the procedure for plagiarism (formality) (To the Japan Patent Office Examiner) 1. Indication of the case Patent Application No. 231656 of 1982 2. Name of the invention Electronic parts and method for manufacturing the same 3. Related to the arrestee case Patent Applicant: 2-9-1 Seiran, Otsu City, Shiga Prefecture 520 Kansai NEC Corporation 4 Date of amendment order February 26, 1985 5 Specification and drawings submitted at the time of filing subject to amendment 7 Reasons ( +) Correct "Figure 21" in the fourth line from the bottom of page 5 to "Figure 20." (2) Correct "Figure 22" on page 6, line 5 to "Figure 21." (3) Correct "Figure 20" on page 7, line 10 to "Figure 19." (4) Insert "ceramic sheet for thickness adjustment forming a part of" after "ceramic sheet" on page 3, line 4. (5) Correct "Figure 14" in the second line from the bottom of page 3 to "Figure 13." (6) Correct “Figure 2” on page 9, line 4 to “Figure 3.” (7) Correct "ceramimic" in the second line from the bottom of page 9 to "ceramic". (8) Correct "Figure 9" in line 3 of page 10 to "Figure 3." (9) Correct "Figure 10" in the 6th line from the bottom of page 10 to "Figure 9." (10) Change “Figure 11” in the third line from the bottom of page 11 to “1
Corrected to ``Figure 0''. (II) Change “Figure 12” in the third line from the bottom of page 11 to “1
Corrected to ``Figure 1''. (+2) “1” after “conductive film” in the first line from the bottom of page 11
Insert "2". (13) Change “Figure 13” from line 4 to line 5 on page 12 to “
Figure 12 has been corrected. (+4) Change “Figure 13” on page 12, line 3 to “Figure 12”
Correct. (15) On page 12, line 3, after “…cut,” “
Insert "as shown in FIG. (16) Change “Figure 15” in line 7 from the bottom of page 12 to “1
Corrected to ``Figure 4''. (17) "Figures 16 to 19" in lines 6 to 5 from the bottom of page 12 are corrected to "Figures 15 to 18." (18) Change “Figure 20” in the first line of page 13 to “Figure 19”
Correct. (19) In lines 2 to 12 of page 15, "Figure 2 shows..." was changed to "Figure 2 to 13 are drawings for explaining the method of manufacturing the electronic component shown in Figure 1. 2 to 7 and 9 to 11 are partial side sectional views, FIG. 3 is a partial plan view, FIG. 12 is a partial side view, and FIG. 13 is a perspective view. Side sectional view showing another embodiment of the present invention, first
5 to 18 are cross-sectional views showing conductive patterns of the electronic component shown in FIG. 14, FIG. 19 is an equivalent circuit of the electronic component shown in FIG. 14,
FIG. 20 is a side sectional view showing a conventional example of an electronic component, and FIG. 21 is a partial perspective view of an IJ-hard frame used for manufacturing the electronic component shown in FIG. ” is corrected. (20) Figure 5 of the drawings will be corrected as attached. (2I) Figures 3 to 22 in the drawings are corrected as indicated in red on the attached drawings. ~Urban Ka-Ho Eye () (to 952)-a4i Mouth 1 School Ho

Claims (11)

[Claims] (1) A pair of ceramics in which an electronic component body having electrodes at both ends is accommodated in the hole of an intermediate ceramic layer having a hole in the center, and a conductive film is formed at the ends in opposite directions from the center. An electronic device characterized in that the layer closes the open end of the intermediate ceramic layer and electrically connects the electrode of the electronic component body to the conductive film, forming an external electrode electrically connected to each conductive film. parts. (2) The electronic component according to claim 1, wherein the ceramic layer is constituted by a laminate of ceramic sheets. (3) The electronic component according to claim 2, characterized in that a conductive film for forming an external electrode is formed between the end laminations of the ceramic sheet laminate and connected to the external electrode. (4) The conductive film for forming the external electrode extends alternately from near one end of the laminated surface of the ceramic sheet to the other end for each layer, and the free ends or intermediate portions face each other with the ceramic sheet interposed therebetween to form a capacitor. The electronic component according to claim 3, characterized in that the electronic component is configured to cause (5) The electronic component according to claim 1, wherein the ceramic layers are connected by a frit. (6) A method for manufacturing an electronic component, characterized by including the following steps (a) to (k). (A) Step of laminating one or more square or rectangular first ceramic sheets on a substrate, (B) Step of forming a first conductive film on the upper surface of the first ceramic sheet, (C) First laminating a plurality of layers of a second ceramic sheet in which a plurality of through holes are formed on the ceramic sheet; (d) placing an electronic component body in a recess formed by the through holes in the second ceramic sheet; (e) a step of forming a second conductive film on the top layer of the second ceramic sheet and electrically connecting the second conductive film to an electrode of an electronic component; (f) a second ceramic sheet; a step of laminating one or more layers of a third ceramic sheet on the sheet; (g) a step of dividing the first to third ceramic sheet laminates into small ceramic laminates by cutting between the holes; A process of sintering the small ceramic laminate; (e) A process of forming external electrodes on the small ceramic laminate. (7) The method of manufacturing an electronic component according to claim 6, wherein the ceramic sheet is formed by a screen printing method. (8) Claim 6, characterized in that the ceramic sheet is a sheet formed in advance into a sheet shape.
2. Method for manufacturing electronic components described in Section 1. (9) Claim 6, characterized in that the electrode of the electronic component body and the conductive film are connected by a conductive adhesive.
2. Method for manufacturing electronic components described in Section 1. (10) A method for manufacturing an electronic component, characterized by including the following steps (a) to (g). (a) forming a plurality of first conductive films in a desired pattern at predetermined positions on the first ceramic plate; (b) forming a transparent film at a position corresponding to one end of the first conductive film on the first ceramic plate; A second ceramic plate with holes is inserted into the first ceramic plate.
(c) housing an electronic component main body having electrodes at both ends in the recess formed by the first and second ceramic plates, and stacking the electronic component on the first conductive film of the first ceramic plate and the electronic component body; A step of electrically connecting one electrode of the component body; (d) forming a plurality of second conductive films in a desired pattern extending in a direction opposite to the first conductive film from a position facing the through hole of the second ceramic plate; a step of closing the open end of the second ceramic plate with the formed third ceramic plate and electrically connecting the second conductive film to another electrode of the electronic component body; (e) each ceramic plate; (f) Step of cutting between the through holes of each ceramic plate laminate to divide it into small ceramic laminates; (g) Forming external electrodes on the small ceramic laminates. Process. (11) Claim 10, characterized in that a frit is used for airtight connection of the joining surfaces of each of the ceramic plates.
2. Method for manufacturing electronic components described in Section 1.