JPS61106766A - Spatter device - Google Patents

Abstract

PURPOSE:To obtain a titled device of a simple constitution, which can reduce extremely an influence of a thermal radiation from a target or a reflection of a light from a plasma by constituting at least a part of the inside of a vacuum tank, of a base material having a surface for preventing the thermal radiation or the reflection of a light. CONSTITUTION:At least a part of the inside of a vacuum tank of a spatter device to which a thermal radiation generated from a target 4 or a light generated from a plasma at the time of a spatter vapor-deposition is irradiated directly is constituted of a base material having a surface for preventing a thermal radiation of a black base material, etc., and a reflection of a light 5, a temperature rise of a substrate 6, and a uniform and even film of a good quality can be formed easily. As for said black base material, a base material, etc., to which a black stainless steel or a black alumite has been stuck are used suitably. Also, in the side of said vacuum tank, it is effective that at least the surface of a target holder part 1, the whole or a part of a vacuum tank inner wall 2, a substrate holder 3, etc. is formed by the black base material.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention relates to a sputtering apparatus for forming a film and the like.

2. Description of the Related Art An example of a conventional sputtering apparatus will be described below with reference to FIG. For example, stainless steel has been used for the vacuum chamber wall 2 and internal parts of conventional sputtering apparatuses because of its ease of molding and the ability to achieve a high vacuum inside the vacuum chamber.

However, no structure is adopted to prevent thermal radiation or light reflection, and the thermal radiation emitted by the target 4 during sputter deposition or the light 6 generated by plasma is reflected by the stainless steel surface and irradiated onto the substrates. This leads to an increase in the substrate temperature, and therefore a substrate cooling mechanism is required.

Problems to be Solved by the Invention In such conventional sputtering equipment, the temperature of the substrate increases due to thermal radiation or reflection of light on the surface of the members of the equipment, and control becomes complicated, such as by using a substrate cooling mechanism. Moreover, this causes film unevenness, making it difficult to increase the area of the substrate or mass-produce it.

Furthermore, the film properties themselves were also adversely affected. Furthermore, when a sputtering device is used for a long time, the temperature of the substrate increases over time, making it difficult to form a uniform film.

The present invention has been made in view of the above points, and an object of the present invention is to provide a sputtering apparatus having a simple configuration and having very little influence of thermal radiation and light reflection.
There is.

Means for Solving the Problems In order to solve the above-mentioned problems, the present invention constructs a part of the interior of the vacuum chamber from a material having a surface that prevents heat radiation or light reflection. In addition, it is highly practical to use stainless steel that has been treated to have a black surface. Further, if the target holder closest to the target part is made of a material with at least a black surface, the effect is extremely large. Furthermore, the effect is even greater if the inner wall of the vacuum chamber, which has a large area, is made of a material whose surface is at least black. Furthermore, if the substrate holder closest to the substrate is made of a material with at least a black surface, the effects of thermal radiation and light on the substrate will be reduced.

Effects The present invention uses a material having a surface that prevents heat radiation or light reflection on the target portion, the inner wall of the vacuum chamber, or a part of the target holder, in particular, to reduce the effects of heat generation of several thousand degrees Celsius on the target surface. This minimizes reflection, eliminates the influence of heat on the substrate, and eliminates unevenness in a single film formed on the substrate. or,
Even if the sputtering equipment is used for a long time, the substrate temperature remains stable, so a uniform film can be created. Furthermore, uniform films can be created even on large-area substrates, making mass production possible. Also,
High vacuum can be easily reached by using stainless steel with black surface treatment to prevent heat radiation and light reflection.

Embodiment FIG. 1 is a sectional view showing an embodiment of the sputtering apparatus of the present invention. Inside the vacuum chamber, a part of the target holder is made of stainless steel with a black surface treated with sulfuric acid and sodium dichromate to suppress heat radiation and light reflection. Vacuum chamber inner wall 2. Cover the part of the substrate holder 3 on the target holder side. For example, when sputter-depositing Sl onto the glass substrate 6 using 02 gas, the thermal radiation and light 5 emitted from the Si target 4 are absorbed by the surface-treated stainless steel, and the influence of heat on the glass substrate 6 is minimized. This eliminates the need for a substrate cooling mechanism, ensures uniformity of the formed film, enables stable film formation over a long period of time, and makes it possible to increase the area of the substrate and mass-produce it.

By using stainless steel, high vacuum can be easily achieved.

In addition, for example, by forming black alumite on a stainless steel surface treatment plate and attaching it to the inner wall of a vacuum chamber or target holder, for example, thermal radiation and light reflection emitted during vapor deposition can be suppressed, and the influence of heat on the film can be reduced. can be kept to a minimum. In this way, the present invention can be applied to any material that has at least a black surface, regardless of the type of material.

Effects of the Invention As described above, according to the present invention, the influence of heat on the substrate can be easily removed, uniform films can be mass-produced, and the present invention is extremely useful in practice.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view of a sputtering apparatus according to an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional sputtering apparatus. 1...Target holder, 2...Inner wall of vacuum chamber, 3...Substrate holder, 4...
・Target, 6...Thermal radiation and light, 6...
····substrate. Fig. 1 Fig. 2 f Tarpai) Folder 2 Stinking Butcher 3 Kishu I, Ruzu°"- 4 Gu T・'nt, S Knee, Elbow Right, Call" 96 Go Stone ξ

Claims (7)

[Claims] (1) A sputtering device in which at least a part of the interior of the vacuum chamber, which is directly exposed to thermal radiation emitted by a target or light generated by plasma during sputter deposition, is made of a material having a surface that prevents thermal radiation or light reflection. (2) The sputtering apparatus according to claim 1, wherein at least a part of the interior of the vacuum chamber is made of a black material. (3) The sputtering apparatus according to claim 1, wherein at least a part of the inside of the vacuum chamber is made of black stainless steel. (4) The sputtering apparatus according to claim 1, wherein black alumite is pasted on at least a part of the inside of the vacuum chamber. (5) The sputtering apparatus according to claim 1, wherein the target holder portion is made of a material having at least a black surface. (6) The sputtering apparatus according to claim 1, wherein all or part of the inner wall of the vacuum chamber is made of a material having at least a black surface. (7) The sputtering apparatus according to claim 1, wherein the substrate holder is made of a material having at least a black surface.