JPS61104648A - 基板の冷却装置 - Google Patents

基板の冷却装置

Info

Publication number
JPS61104648A
JPS61104648A JP59225942A JP22594284A JPS61104648A JP S61104648 A JPS61104648 A JP S61104648A JP 59225942 A JP59225942 A JP 59225942A JP 22594284 A JP22594284 A JP 22594284A JP S61104648 A JPS61104648 A JP S61104648A
Authority
JP
Japan
Prior art keywords
substrate
film
cushion member
thin film
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59225942A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0228248B2 (enExample
Inventor
Muneharu Komiya
小宮　宗治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Priority to JP59225942A priority Critical patent/JPS61104648A/ja
Publication of JPS61104648A publication Critical patent/JPS61104648A/ja
Publication of JPH0228248B2 publication Critical patent/JPH0228248B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP59225942A 1984-10-29 1984-10-29 基板の冷却装置 Granted JPS61104648A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59225942A JPS61104648A (ja) 1984-10-29 1984-10-29 基板の冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59225942A JPS61104648A (ja) 1984-10-29 1984-10-29 基板の冷却装置

Publications (2)

Publication Number Publication Date
JPS61104648A true JPS61104648A (ja) 1986-05-22
JPH0228248B2 JPH0228248B2 (enExample) 1990-06-22

Family

ID=16837308

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59225942A Granted JPS61104648A (ja) 1984-10-29 1984-10-29 基板の冷却装置

Country Status (1)

Country Link
JP (1) JPS61104648A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6471050A (en) * 1987-05-04 1989-03-16 Varian Associates Wafer holder
US5132873A (en) * 1988-09-30 1992-07-21 Microelectronics And Computer Technology Corporation Diaphragm sealing apparatus
US7384270B2 (en) 2000-10-18 2008-06-10 Fujikura Ltd. Electrical connector
JP2010535969A (ja) * 2007-08-10 2010-11-25 オーリコン レイボルド バキューム ゲーエムベーハー ポンプ軸受配置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6471050A (en) * 1987-05-04 1989-03-16 Varian Associates Wafer holder
US5132873A (en) * 1988-09-30 1992-07-21 Microelectronics And Computer Technology Corporation Diaphragm sealing apparatus
US7384270B2 (en) 2000-10-18 2008-06-10 Fujikura Ltd. Electrical connector
JP2010535969A (ja) * 2007-08-10 2010-11-25 オーリコン レイボルド バキューム ゲーエムベーハー ポンプ軸受配置

Also Published As

Publication number Publication date
JPH0228248B2 (enExample) 1990-06-22

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