JPS61102363U - - Google Patents
Info
- Publication number
- JPS61102363U JPS61102363U JP18547084U JP18547084U JPS61102363U JP S61102363 U JPS61102363 U JP S61102363U JP 18547084 U JP18547084 U JP 18547084U JP 18547084 U JP18547084 U JP 18547084U JP S61102363 U JPS61102363 U JP S61102363U
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- chamber
- tip
- solder
- nozzle tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 239000011261 inert gas Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18547084U JPS61102363U (US06650917-20031118-M00005.png) | 1984-12-05 | 1984-12-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18547084U JPS61102363U (US06650917-20031118-M00005.png) | 1984-12-05 | 1984-12-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61102363U true JPS61102363U (US06650917-20031118-M00005.png) | 1986-06-30 |
Family
ID=30742941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18547084U Pending JPS61102363U (US06650917-20031118-M00005.png) | 1984-12-05 | 1984-12-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61102363U (US06650917-20031118-M00005.png) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5874276A (ja) * | 1981-10-28 | 1983-05-04 | Toshiba Corp | 液状体の吐出装置 |
JPS5930370B2 (ja) * | 1978-09-26 | 1984-07-26 | 株式会社クボタ | 刈取機用強制分草装置 |
-
1984
- 1984-12-05 JP JP18547084U patent/JPS61102363U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5930370B2 (ja) * | 1978-09-26 | 1984-07-26 | 株式会社クボタ | 刈取機用強制分草装置 |
JPS5874276A (ja) * | 1981-10-28 | 1983-05-04 | Toshiba Corp | 液状体の吐出装置 |