JPS61102078U - - Google Patents
Info
- Publication number
- JPS61102078U JPS61102078U JP18798784U JP18798784U JPS61102078U JP S61102078 U JPS61102078 U JP S61102078U JP 18798784 U JP18798784 U JP 18798784U JP 18798784 U JP18798784 U JP 18798784U JP S61102078 U JPS61102078 U JP S61102078U
- Authority
- JP
- Japan
- Prior art keywords
- substrates
- connection structure
- electrical connection
- structure according
- anisotropic conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 13
- 230000002265 prevention Effects 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 239000002390 adhesive tape Substances 0.000 claims 2
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
Description
第1図は本考案の第1実施例を示す縦断面図、
第2図は同上実施例の分解斜視図、第3図は第1
図の要部拡大断面図、第4図は同上実施例の要部
平面図、第5図は第4図の横断面図、第6図は同
上実施例の要部側面図、第7図は上記第1実施例
の変形例を示す分解斜視図、第8図は同上変形例
の要部平面図、第9図は第8図の横断面図、第1
0図は同上変形例の要部背面図、第11図は第1
0図の要部縦断面図、第12図は同上変形例の要
部側面図、第13図は本考案の第2実施例を示す
断面図、第14図は同上実施例の平面図、第15
図は同上実施例の分解斜視図、第16図は本考案
の第3実施例を示す断面図、第17図は同上実施
例の平面図、第18図は本考案の第4実施例を示
す断面図、第19図は同上実施例の分解斜視図、
第20図は本考案の第5実施例を示す断面図、第
21図は同上実施例の平面図、第22図は本考案
の第6実施例を示す断面図、第23図は同上実施
例の斜視図である。
16a,40a,52a,54a,56c,5
8c,70a,72a…電気接点、12,16,
40,42,48,50,52,54,56,5
8,70,72…基板、17,44,47,56
,60,74…異方性導電部材、18,19,3
2,34,36,45,50,52b,54b,
57,62,64,66,76…剥離防止手段。
FIG. 1 is a longitudinal sectional view showing a first embodiment of the present invention;
Fig. 2 is an exploded perspective view of the same embodiment as above, and Fig. 3 is an exploded perspective view of the same embodiment.
Fig. 4 is a plan view of the main part of the same embodiment as above, Fig. 5 is a cross-sectional view of Fig. 4, Fig. 6 is a side view of the main part of the above embodiment, and Fig. 7 is An exploded perspective view showing a modification of the first embodiment, FIG. 8 is a plan view of essential parts of the modification, FIG. 9 is a cross-sectional view of FIG.
Figure 0 is a rear view of the main parts of the same modification, and Figure 11 is the first part.
FIG. 12 is a side view of the main part of the modified example of the above, FIG. 13 is a sectional view showing the second embodiment of the present invention, and FIG. 14 is a plan view of the same embodiment. 15
The figure is an exploded perspective view of the same embodiment, FIG. 16 is a sectional view showing a third embodiment of the present invention, FIG. 17 is a plan view of the same embodiment, and FIG. 18 is a fourth embodiment of the present invention. A sectional view, FIG. 19 is an exploded perspective view of the same embodiment,
Fig. 20 is a sectional view showing the fifth embodiment of the present invention, Fig. 21 is a plan view of the same embodiment, Fig. 22 is a sectional view showing the sixth embodiment of the invention, and Fig. 23 is the same embodiment. FIG. 16a, 40a, 52a, 54a, 56c, 5
8c, 70a, 72a...electrical contact, 12, 16,
40, 42, 48, 50, 52, 54, 56, 5
8, 70, 72...Substrate, 17, 44, 47, 56
, 60, 74...Anisotropic conductive member, 18, 19, 3
2, 34, 36, 45, 50, 52b, 54b,
57, 62, 64, 66, 76...Peeling prevention means.
Claims (1)
の間に異方性導電部材を挾持することにより、該
異方性導電部材を介して前記各基板の前記電気接
点を互いに電気接続する構造において、 前記各基板上に配列された前記電気接点の配列
の少なくとも両端部に、前記各基板と前記異方性
導電部材との間における相互剥離を防ぐための剥
離防止手段を有してなることを特徴とする電気接
続構造。 2 剥離防止手段は、複数の基板の電気接点を有
する部分を異方性導電部材を介して挾持する挾持
機構からなることを特徴とする実用新案登録請求
の範囲第1項記載の電気接続構造。 3 挾持機構は、複数の基板と異方性導電部材と
を弾性的に挾持すべくばね部材を有してなること
を特徴とする実用新案登録請求の範囲第2項記載
の電気接続構造。 4 挾持機構は、基板同士を異方性導電部材を挾
んで互いに締結するねじ結合機構を有してなるこ
とを特徴とする実用新案登録請求の範囲第2項記
載の電気接続構造。 5 剥離防止手段は、各基板を互いに装着する接
着剤を有してなることを特徴とする実用新案登録
請求の範囲第1項記載の電気接続構造。 6 剥離防止手段は、各基板を互いに接着する両
面接着テープを有してなることを特徴とする実用
新案登録請求の範囲第1項記載の電気接続構造。 7 剥離防止手段は、各基板に夫々配線された導
電パターンが互いに半田付けされてなることを特
徴とする実用新案登録請求の範囲第1項記載の電
気接続構造。 8 両面接着テープは基板上複数の電気接点の全
周を囲むよう貼着され各基板と協働して異方性導
電部材を略密封するよう形成されたことを特徴と
する実用新案登録請求の範囲第6項記載の電気接
続構造。 9 接着剤は基板上複数の電気接点の全周を囲む
よう塗布され、各基板と協働して異方性導電部材
を略密封するよう形成されたことを特徴とする実
用新案登録請求の範囲第5項記載の電気接続構造
。[Claims for Utility Model Registration] 1. By sandwiching an anisotropic conductive member between substrates each having a plurality of electrical contacts arranged thereon, the electricity of each of the substrates is transmitted through the anisotropic conductive member. In a structure in which contacts are electrically connected to each other, at least both ends of the array of electrical contacts arranged on each of the substrates are provided with a peel-off prevention layer for preventing mutual peeling between each of the substrates and the anisotropic conductive member. An electrical connection structure characterized by comprising means. 2. The electrical connection structure according to claim 1, wherein the peeling prevention means comprises a clamping mechanism that clamps parts of the plurality of substrates having electrical contacts via an anisotropic conductive member. 3. The electrical connection structure according to claim 2, wherein the clamping mechanism includes a spring member to elastically clamp the plurality of substrates and the anisotropic conductive member. 4. The electrical connection structure according to claim 2, wherein the clamping mechanism includes a screw coupling mechanism for fastening the substrates to each other by sandwiching the anisotropic conductive member. 5. The electrical connection structure according to claim 1, wherein the peeling prevention means comprises an adhesive for attaching the substrates to each other. 6. The electrical connection structure according to claim 1, wherein the peeling prevention means comprises a double-sided adhesive tape that adheres the respective substrates to each other. 7. The electrical connection structure according to claim 1, wherein the peeling prevention means is formed by soldering conductive patterns wired to each substrate to each other. 8. A request for registration of a utility model characterized in that the double-sided adhesive tape is adhered to the entire circumference of a plurality of electrical contacts on a board and is formed so as to cooperate with each board to substantially seal the anisotropic conductive member. Electrical connection structure according to scope item 6. 9. Claims for registration of a utility model characterized in that the adhesive is applied to the entire circumference of a plurality of electrical contacts on a substrate, and is formed so as to cooperate with each substrate to substantially seal the anisotropic conductive member. The electrical connection structure according to item 5.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18798784U JPS61102078U (en) | 1984-12-10 | 1984-12-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18798784U JPS61102078U (en) | 1984-12-10 | 1984-12-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61102078U true JPS61102078U (en) | 1986-06-28 |
Family
ID=30745459
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18798784U Pending JPS61102078U (en) | 1984-12-10 | 1984-12-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61102078U (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61218196A (en) * | 1985-03-24 | 1986-09-27 | ソニー株式会社 | Electrode leader construction |
JPS6373971U (en) * | 1986-10-31 | 1988-05-17 | ||
WO2004002203A1 (en) * | 2002-06-25 | 2003-12-31 | Nec Corporation | Circuit board device and method for board-to-board connection |
WO2012102091A1 (en) * | 2011-01-27 | 2012-08-02 | 住友電工プリントサーキット株式会社 | Printed-circuit-board connection structure, head stack assembly provided with printed-circuit-board connection structure, magnetic disk provided with head stack assembly, and method of manufacturing printed-circuit-board connection structure |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5517467A (en) * | 1978-07-25 | 1980-02-06 | Mitsubishi Electric Corp | Dust concentration meter |
JPS5517503A (en) * | 1978-06-21 | 1980-02-07 | Fujitsu Ltd | Paper jam detection method |
JPS55163897A (en) * | 1979-06-08 | 1980-12-20 | Hitachi Ltd | Logic element high density mounting structure |
JPS5616971B1 (en) * | 1970-12-28 | 1981-04-20 | ||
JPS5743585B2 (en) * | 1974-06-08 | 1982-09-16 |
-
1984
- 1984-12-10 JP JP18798784U patent/JPS61102078U/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5616971B1 (en) * | 1970-12-28 | 1981-04-20 | ||
JPS5743585B2 (en) * | 1974-06-08 | 1982-09-16 | ||
JPS5517503A (en) * | 1978-06-21 | 1980-02-07 | Fujitsu Ltd | Paper jam detection method |
JPS5517467A (en) * | 1978-07-25 | 1980-02-06 | Mitsubishi Electric Corp | Dust concentration meter |
JPS55163897A (en) * | 1979-06-08 | 1980-12-20 | Hitachi Ltd | Logic element high density mounting structure |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61218196A (en) * | 1985-03-24 | 1986-09-27 | ソニー株式会社 | Electrode leader construction |
JPS6373971U (en) * | 1986-10-31 | 1988-05-17 | ||
JPH0534134Y2 (en) * | 1986-10-31 | 1993-08-30 | ||
WO2004002203A1 (en) * | 2002-06-25 | 2003-12-31 | Nec Corporation | Circuit board device and method for board-to-board connection |
CN1327746C (en) * | 2002-06-25 | 2007-07-18 | 日本电气株式会社 | Circuit board device and method for board-to-board connection |
US7501584B2 (en) | 2002-06-25 | 2009-03-10 | Nec Corporation | Circuit board device and method for board-to-board connection |
WO2012102091A1 (en) * | 2011-01-27 | 2012-08-02 | 住友電工プリントサーキット株式会社 | Printed-circuit-board connection structure, head stack assembly provided with printed-circuit-board connection structure, magnetic disk provided with head stack assembly, and method of manufacturing printed-circuit-board connection structure |
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