JPS61102039U - - Google Patents

Info

Publication number
JPS61102039U
JPS61102039U JP18608084U JP18608084U JPS61102039U JP S61102039 U JPS61102039 U JP S61102039U JP 18608084 U JP18608084 U JP 18608084U JP 18608084 U JP18608084 U JP 18608084U JP S61102039 U JPS61102039 U JP S61102039U
Authority
JP
Japan
Prior art keywords
main surface
fixed
semiconductor element
metal piece
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18608084U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18608084U priority Critical patent/JPS61102039U/ja
Publication of JPS61102039U publication Critical patent/JPS61102039U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3201—Structure
    • H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
    • H01L2224/32013—Structure relative to the bonding area, e.g. bond pad the layer connector being larger than the bonding area, e.g. bond pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP18608084U 1984-12-10 1984-12-10 Pending JPS61102039U (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18608084U JPS61102039U (de) 1984-12-10 1984-12-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18608084U JPS61102039U (de) 1984-12-10 1984-12-10

Publications (1)

Publication Number Publication Date
JPS61102039U true JPS61102039U (de) 1986-06-28

Family

ID=30743542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18608084U Pending JPS61102039U (de) 1984-12-10 1984-12-10

Country Status (1)

Country Link
JP (1) JPS61102039U (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015005664A (ja) * 2013-06-21 2015-01-08 株式会社東芝 電子部品およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015005664A (ja) * 2013-06-21 2015-01-08 株式会社東芝 電子部品およびその製造方法

Similar Documents

Publication Publication Date Title
JPS61102039U (de)
JPS61171247U (de)
JPS628641U (de)
JPS60163738U (ja) 半導体装置
JPS61207038U (de)
JPS62103252U (de)
JPH0187547U (de)
JPS60163740U (ja) 半導体装置
JPS60174244U (ja) 混成集積回路
JPS5889946U (ja) 半導体装置
JPS6130252U (ja) 半導体装置
JPS61174775U (de)
JPS6292644U (de)
JPH0179846U (de)
JPS61102074U (de)
JPS6194356U (de)
JPS62145337U (de)
JPS62204327U (de)
JPS59192850U (ja) 半導体装置
JPS60118932U (ja) 端子付端子板
JPS6294631U (de)
JPH0173935U (de)
JPS60129141U (ja) 半導体装置
JPS6194358U (de)
JPS6188248U (de)