JPS61100155U - - Google Patents
Info
- Publication number
- JPS61100155U JPS61100155U JP1984185268U JP18526884U JPS61100155U JP S61100155 U JPS61100155 U JP S61100155U JP 1984185268 U JP1984185268 U JP 1984185268U JP 18526884 U JP18526884 U JP 18526884U JP S61100155 U JPS61100155 U JP S61100155U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- light
- emitting element
- receiving element
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984185268U JPS61100155U (enExample) | 1984-12-06 | 1984-12-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984185268U JPS61100155U (enExample) | 1984-12-06 | 1984-12-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61100155U true JPS61100155U (enExample) | 1986-06-26 |
Family
ID=30742745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984185268U Pending JPS61100155U (enExample) | 1984-12-06 | 1984-12-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61100155U (enExample) |
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1984
- 1984-12-06 JP JP1984185268U patent/JPS61100155U/ja active Pending