JPS61100134U - - Google Patents

Info

Publication number
JPS61100134U
JPS61100134U JP1984185637U JP18563784U JPS61100134U JP S61100134 U JPS61100134 U JP S61100134U JP 1984185637 U JP1984185637 U JP 1984185637U JP 18563784 U JP18563784 U JP 18563784U JP S61100134 U JPS61100134 U JP S61100134U
Authority
JP
Japan
Prior art keywords
printed circuit
flexible printed
circuit board
copper
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984185637U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984185637U priority Critical patent/JPS61100134U/ja
Publication of JPS61100134U publication Critical patent/JPS61100134U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Die Bonding (AREA)
JP1984185637U 1984-12-07 1984-12-07 Pending JPS61100134U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984185637U JPS61100134U (enExample) 1984-12-07 1984-12-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984185637U JPS61100134U (enExample) 1984-12-07 1984-12-07

Publications (1)

Publication Number Publication Date
JPS61100134U true JPS61100134U (enExample) 1986-06-26

Family

ID=30743103

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984185637U Pending JPS61100134U (enExample) 1984-12-07 1984-12-07

Country Status (1)

Country Link
JP (1) JPS61100134U (enExample)

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