JPS6098612A - Electrode material - Google Patents
Electrode materialInfo
- Publication number
- JPS6098612A JPS6098612A JP58206708A JP20670883A JPS6098612A JP S6098612 A JPS6098612 A JP S6098612A JP 58206708 A JP58206708 A JP 58206708A JP 20670883 A JP20670883 A JP 20670883A JP S6098612 A JPS6098612 A JP S6098612A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- thickness
- electrode material
- electrode
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007772 electrode material Substances 0.000 title claims description 13
- 239000010410 layer Substances 0.000 claims description 41
- 239000000919 ceramic Substances 0.000 claims description 16
- 239000002344 surface layer Substances 0.000 claims description 9
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 description 11
- 238000005260 corrosion Methods 0.000 description 10
- 230000007797 corrosion Effects 0.000 description 10
- 230000003628 erosive effect Effects 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 229910052573 porcelain Inorganic materials 0.000 description 3
- 238000007738 vacuum evaporation Methods 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical class O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000008672 Persea borbonia Nutrition 0.000 description 1
- 240000000189 Persea borbonia Species 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- -1 thickness 1200 Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Non-Insulated Conductors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
この発明は、コンデンサー用セラミックス、圧電振動子
用セラミックス等の表面に設ける電極材料に係り、Ａｕ
表面層の厚みを署しり簿りできる電極材料に関する。Detailed Description of the Invention The present invention relates to an electrode material provided on the surface of ceramics for capacitors, ceramics for piezoelectric vibrators, etc.
This invention relates to an electrode material whose surface layer thickness can be recorded.
一般に、コンデンサ或いは圧電振動子等の電気部品とし
て用いられるセラミックス材料には、外部からの電気信
号を入力するための電極が表面に付設されて使用される
が、例えば、セラミックスフィルターやセラミックスコ
ンデンサーの場合は、表裏の電極にはんだでリード線が
接続され、また、超音波振動子の場合は一方の電極にリ
ード線を接続し、他方のＮ極は別の電気部品には／ｖだ
で接着して使用している。Generally, ceramic materials used as electrical components such as capacitors or piezoelectric vibrators are used with electrodes attached to their surfaces for inputting electrical signals from the outside.For example, in the case of ceramic filters and ceramic capacitors, The lead wire is connected to the front and back electrodes with solder, and in the case of an ultrasonic transducer, the lead wire is connected to one electrode, and the other N pole is attached to another electrical component with /v solder. I am using it.
かかる電極材料は、■電気伝導度がよいこと、■耐食性
がＪζいこと、■はｌυだとのぬれ性がよくはんだ付け
が容易なこと、■セラミックスどの密着性がよいこと等
の特性が要求されており、上記セラミックスとして、チ
タン酸系のセラミックスを使用した場合、電極材料とし
ては、金属Ｃｒの下地層と表面のＡｕ層の複層材料が多
用されている。Such electrode materials are required to have the following characteristics: ■ Good electrical conductivity, ■ Good corrosion resistance, ■ Good wettability with Lυ, and easy soldering, ■ Good adhesion to ceramics, etc. When a titanate-based ceramic is used as the ceramic, a multilayer material consisting of a metallic Cr underlayer and a surface Au layer is often used as the electrode material.
りなわら、従来は、接着強度及び耐食性の点から金属Ｃ
ｒが電極の下地層材料に用いられ、しかしＣｒがはｌυ
だイ」（〕づるのが困難なため、はんだ付は性と耐食性
を考慮して表面にＡｕを被着づるが、Ｃｒを真空蒸着あ
るいはスパッタリングでセラミックス表面に被着したの
ち、真空を維持してＡｕを被着する際に、Ａｕのはんだ
への溶解度が高く、急速に拡散しで、いわゆるはんだ食
われ現象を呈するため、Ａｕ７ＦＪを３０００Å以上の
厚みで被着する必要があり、電極の価格を高騰さける問
題があった。However, conventionally, metal C was used from the viewpoint of adhesive strength and corrosion resistance.
r is used as the underlayer material of the electrode, but Cr is lυ
Because it is difficult to solder, Au is applied to the surface in consideration of properties and corrosion resistance, but after Cr is applied to the ceramic surface by vacuum evaporation or sputtering, the vacuum is maintained. When depositing Au, it is necessary to deposit Au7FJ to a thickness of 3000 Å or more because the solubility of Au in solder is high and it diffuses rapidly, causing the so-called solder erosion phenomenon. There was a problem with the price rising.
この発明は、セラミックス表面に下地層としてＣｒ層を
被着する電極材料において、そのＡ■表面層の厚みを著
しく低減して安価に提供できるセラミックス用電極材料
を目的としている。The object of the present invention is to provide an electrode material for ceramics in which a Cr layer is deposited as an underlayer on the surface of a ceramic material, which can be provided at low cost by significantly reducing the thickness of the A.sub.surface layer.
づなわら、この発明は、セラミックス表面に下地層とし
てＣｒ層を被着する電極材料において、Ｑｒ下地層上に
、Ｎｉ１Ｏ〜３０ｗｔ％またはＳｎ ３〜２０ｗｔ％含
右のＣｕ合金層を介在させて、１００１〜１０００人ノ
９みのＡＵ表面層を被着したことを特徴とする電極材料
である。Specifically, in an electrode material in which a Cr layer is deposited as an underlayer on a ceramic surface, a Cu alloy layer containing 10 to 30 wt% Ni or 3 to 20 wt% Sn is interposed on the Qr underlayer. This is an electrode material characterized by having an AU surface layer of 1001 to 1000 AU surface layers.
この発明は、セラミックス表面に形成されるＣｒ下地層
と表面層のＡｕ層間に、特定間のＮ、またはＳｎ含有の
Ｃｕ合金層を介在させることにより、はんだ付【プ性が
改善され、耐食性ならびに紅湾性が著しく向−１−シ、
また、該伍合金層が高硬度であるため、組立時の電極面
での摺動等により表面に疵が発生したり、Ｎ１！ｉの剥
離が防止できる利点がある。This invention improves solderability, improves corrosion resistance and Red Bay characteristics are significantly affected.
In addition, since the 5th grade alloy layer is highly hard, scratches may occur on the surface due to sliding on the electrode surface during assembly, and N1! This has the advantage that peeling of i can be prevented.
この発明の対象とづるセラミックスとしく、コンデンザ
ー用のチタン酸バリウム磁器、圧電据動子用のチタン酸
ジルコン酸鉛磁器等がある。Examples of ceramics to which this invention is applied include barium titanate porcelain for capacitors and lead zirconate titanate porcelain for piezoelectric standers.
この発明の中間層のＮＬ−仮合金において、ＮＬＩは多
くなると耐食性は向上するが、強磁性相が発生し、はｌ
υだ付１ノ性が劣化し、電気伝導度も低下づるため、そ
の」７限を３０ｗｔ％とし、また、１０ｖｔ％未満では
、理想的電極材料で【よあるが耐食性の悪い純銅と比較
して耐蝕性の向上がなくなるため、ＮＬは１０ｗｔ％〜
３０ｗｔ％とする。In the NL-temporary alloy of the intermediate layer of this invention, the corrosion resistance improves as the NLI increases, but a ferromagnetic phase occurs and the l
Since the υ resistance deteriorates and the electrical conductivity also decreases, the limit is set at 30wt%, and if it is less than 10vt%, the ideal electrode material [compared to pure copper, which has poor corrosion resistance]. Since there is no improvement in corrosion resistance, NL is 10wt%~
It is set to 30wt%.
また、Ｓｎ −Ｃｕ合金において、Ｓｎ渚は、２０ｗｔ
％を越えると電気伝導度が劣化し、３ｗｔ％未満では耐
食性に何等の改善がないため、３ｗｔ％〜２０ｗｔ％と
する。In addition, in the Sn-Cu alloy, the Sn layer is 20wt
If it exceeds 3% by weight, the electrical conductivity deteriorates, and if it is less than 3% by weight, there is no improvement in corrosion resistance.
この発明の電極にｄ３いて、下地層のＣｒ層は、セラミ
ックスに対して接義強度がすぐれているが、その厚みが
２００人未満では十分な接養強度が得られず、５０００
八を越える厚みでは、セラミックスとＣｒとの熱膨張係
数の相違からＣｒが剥離しやすくなるため、２００人〜
５０００人厚みが好ましい。In the electrode of this invention, the Cr layer as the base layer has superior bonding strength to ceramics, but if the thickness is less than 200 mm, sufficient bonding strength cannot be obtained;
If the thickness exceeds 8, Cr will easily peel off due to the difference in thermal expansion coefficient between ceramics and Cr.
A thickness of 5,000 people is preferred.
また、この発明の特徴たる中間層のＮＬ −Ｃｕ 、
５ｎ−Ｃｕ合金は、５００人未満の厚みでは、はんだ食
われ現象がおこりやすくなり、はんだ何番プに耐えられ
ｆｌまた、５０００八を越える厚みでは、Ｃｒとの熱膨
張係数の相違により、中間層が剥離する恐れがあるため
、５００Ａ □〜５００〇への厚みが好ましい。In addition, NL-Cu of the intermediate layer, which is a feature of this invention,
5n-Cu alloy is susceptible to solder erosion when the thickness is less than 500mm, and cannot withstand many solder cycles.At thicknesses exceeding 5000mm, it has an intermediate coefficient of thermal expansion due to the difference in thermal expansion coefficient from Cr. Since there is a risk that the layers may peel off, a thickness of 500A to 5000 is preferred.
さらに、表面層のＡｕ層は、上述したように、はんだ食
われ現象を防止するため、３０００人以上の厚みに被着
する必要があり、これを蒸着にて行なうとＡｕの損失が
多いなどコスト上界の問題があっｌ〔が、この発明では
上記の中間層を介在させるため、３０００Å以下の厚み
にしても、はんだ食われ現象が起こりＣｒ層が露出する
ことが全くなく、耐食性が十分であるので、好演性を考
慮して厚みを１０００八以下どづるが、１００人未満で
はＡｕによる耐蝕性の向上が期待できないので、１００
人〜１０００人の厚みとする。Furthermore, as mentioned above, the surface Au layer needs to be deposited to a thickness of 3,000 or more to prevent solder erosion, and if this is done by vapor deposition, there will be a large loss of Au, resulting in high costs. However, in this invention, since the above-mentioned intermediate layer is interposed, even if the thickness is less than 3000 Å, the solder erosion phenomenon will not occur and the Cr layer will not be exposed, and the corrosion resistance will be sufficient. Therefore, the thickness is set at 1000 mm or less in consideration of good performance. However, if the thickness is less than 100, it cannot be expected to improve the corrosion resistance due to Au.
The thickness should be between 1,000 and 1,000 people.
以下に、この発明を実施例により説明する。This invention will be explained below with reference to Examples.
実施例１
酸化チタンと酸化バリウムを主成分とするセラミックス
の表面を粗度１ｓに仕上げたのら、下記の３層からなる
この発明による電極を真空蒸着方法により形成した。Example 1 After finishing the surface of a ceramic material mainly composed of titanium oxide and barium oxide to a roughness of 1 s, an electrode according to the present invention consisting of the following three layers was formed by a vacuum evaporation method.
下地層：Ｃｒ層、厚み１０００人、
中間層： ２５ｗｔ％Ｎｊ−Ｃｕｌ、厚ミ１ｏｏｏ人、
表面層；Ａｕ層、ＰｉＴみ３００人。Base layer: Cr layer, thickness 1000 people, middle layer: 25wt% Nj-Cul, thickness 100 people,
Surface layer: Au layer, PiT layer: 300 people.
電極形成の真空蒸着条件は、真空度２Ｘ１０−５ｔｏｒ
ｒの真空を維持しながら、上記セラミックス基板を１５
０℃に保持して、電子ビーム加熱により、下地層から順
次、３〜５人／ Ｓｅｃの蒸着速度で積層蒸着した。The vacuum evaporation conditions for electrode formation are vacuum degree 2 x 10-5 tor.
While maintaining a vacuum of r, the ceramic substrate was heated for 15 minutes.
While maintaining the temperature at 0° C., layers were deposited sequentially from the base layer by electron beam heating at a deposition rate of 3 to 5 persons/sec.
得られた電極の性質は、
電気抵抗； Ｉ Ｃ’） ４ ／ ｕｎ以下、はんだ付
ｇ性：良好、
耐湿性：４０℃、飽和水蒸気圧の条件下Ｃ−週間放置し
たが、上記電気抵抗及びは／υだイ旧ノ性に変化なし、
の結果を確認でさた。The properties of the obtained electrode were as follows: Electrical resistance: I C') 4/un or less, Solderability: Good, Moisture resistance: After being left for C weeks under conditions of 40°C and saturated water vapor pressure, the above electrical resistance and There is no change in the old property of /υ, confirming the results of .
実施例２
ヂタン酸ジルコン酸鉛磁器の表面を＃ ２０００の研摩
材にて平面に仕上げたのち、下記の３層からなるこの発
明による電極を真空蒸着方法により形成した。Example 2 After the surface of lead ditanate zirconate porcelain was polished to a flat surface with #2000 abrasive, an electrode according to the present invention consisting of the following three layers was formed by a vacuum evaporation method.
下地層；Ｃｒ層、厚み８０〇八、
中間層； １０ｗｔ％５ｎ−Ｃａ層、厚み１２００人、
表面層：Ａｕ層、厚み３００人、
電極形成の真空蒸着条件は、真空度２Ｘ１０−５ｔｏｒ
ｒの真空を維持しながら、上記セラミックス基板を１３
０°Ｃに保持して、電子ビーム加熱により、下地層から
順次、３・〜５人／ ｓｅｃの蒸着速度で積層蒸着した
。Base layer: Cr layer, thickness 8008, Middle layer: 10wt%5n-Ca layer, thickness 1200,
Surface layer: Au layer, thickness 300, vacuum evaporation conditions for electrode formation: degree of vacuum 2X10-5 torr
While maintaining a vacuum of r, the ceramic substrate was
While the temperature was maintained at 0°C, layers were deposited sequentially from the base layer by electron beam heating at a deposition rate of 3 to 5 persons/sec.
得られた電極の性質は、
電気抵抗：０．５Ω４／側以Ｆ、
は／Ｖだイ」り性：良好、
耐湿性＝４０℃、飽和水蒸気圧の条件下で一週間放隋し
たが、上記電気抵抗及びはんだイ旧ノ性に変化なし、
の結果を確認できた。The properties of the obtained electrode were as follows: Electrical resistance: 0.5Ω4/F, High resistance: Good, Humidity resistance: 40°C, saturated water vapor pressure for one week. It was confirmed that there was no change in the electrical resistance and solder properties mentioned above.
比較のため、Ｊ−記中間層を右しない電極を、下地層；
Ｃｒ層、厚み８００人、
表面層：Ａｕ層、厚み３００人で、
同一条件ぐ形成したところ、は／υだイ」（）時に、は
んだ食われ減少が甚しく、上地のＣｒ岡が露出した、。For comparison, an electrode that does not correspond to the intermediate layer in J- is used as the base layer;
Cr layer, thickness 800 layers, surface layer: Au layer, thickness 300 layers, when formed under the same conditions, the solder was severely eaten away and the Cr ridges on the upper layer were exposed. did,.
Claims (1)
Ｎ極材料において、 （、ｒ下地層上に、Ｎ１１０〜３
０ｗｔ％、残部実質的にＣｕからなる合金層を介在させ
て、１００人〜１０００人厚みのＡｌ１表面層を被着し
たことを特徴とする電極材料。 ２ セラミックス表面に下地層としてＣｒ層を被着する
電極材料において、 Ｏｒ下地層上に、３ｎ ３−〜２
０Ｗ［％、残部実質的にＣｕからなる合金層を介在させ
て、１００人〜１０００人厚みのＡｕ表面層を被着した
ことを特徴とする電極材料[Claims] 1. In an N-electrode material in which a Cr layer is deposited as an underlayer on a ceramic surface, (,r on the underlayer, N110-3
An electrode material characterized in that an Al1 surface layer having a thickness of 100 to 1000 layers is deposited with an alloy layer consisting of 0 wt % and the remainder substantially Cu. 2 In an electrode material in which a Cr layer is deposited as an underlayer on a ceramic surface, 3n 3- to 2
0W[%, the balance being substantially Cu, and an electrode material having an Au surface layer of 100 to 1000 mm thick interposed therebetween.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58206708A JPS6098612A (en) | 1983-11-02 | 1983-11-02 | Electrode material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58206708A JPS6098612A (en) | 1983-11-02 | 1983-11-02 | Electrode material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6098612A true JPS6098612A (en) | 1985-06-01 |
| JPS6260805B2 JPS6260805B2 (en) | 1987-12-18 |
Family
ID=16527796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58206708A Granted JPS6098612A (en) | 1983-11-02 | 1983-11-02 | Electrode material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6098612A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62165381A (en) * | 1986-01-16 | 1987-07-21 | Nippon Denso Co Ltd | Laminated piezoelectric device |
| JPS63219181A (en) * | 1987-03-09 | 1988-09-12 | Tokin Corp | Piezoelectric ceramic electrode and formation thereof |
-
1983
- 1983-11-02 JP JP58206708A patent/JPS6098612A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62165381A (en) * | 1986-01-16 | 1987-07-21 | Nippon Denso Co Ltd | Laminated piezoelectric device |
| JPS63219181A (en) * | 1987-03-09 | 1988-09-12 | Tokin Corp | Piezoelectric ceramic electrode and formation thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6260805B2 (en) | 1987-12-18 |
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