JPS6096840U - 半導体集積回路基板の鍍金治具 - Google Patents

半導体集積回路基板の鍍金治具

Info

Publication number
JPS6096840U
JPS6096840U JP18984083U JP18984083U JPS6096840U JP S6096840 U JPS6096840 U JP S6096840U JP 18984083 U JP18984083 U JP 18984083U JP 18984083 U JP18984083 U JP 18984083U JP S6096840 U JPS6096840 U JP S6096840U
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor integrated
circuit boards
plating jig
pointed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18984083U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0124934Y2 (enExample
Inventor
北村　太
継一 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP18984083U priority Critical patent/JPS6096840U/ja
Publication of JPS6096840U publication Critical patent/JPS6096840U/ja
Application granted granted Critical
Publication of JPH0124934Y2 publication Critical patent/JPH0124934Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP18984083U 1983-12-07 1983-12-07 半導体集積回路基板の鍍金治具 Granted JPS6096840U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18984083U JPS6096840U (ja) 1983-12-07 1983-12-07 半導体集積回路基板の鍍金治具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18984083U JPS6096840U (ja) 1983-12-07 1983-12-07 半導体集積回路基板の鍍金治具

Publications (2)

Publication Number Publication Date
JPS6096840U true JPS6096840U (ja) 1985-07-02
JPH0124934Y2 JPH0124934Y2 (enExample) 1989-07-27

Family

ID=30409198

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18984083U Granted JPS6096840U (ja) 1983-12-07 1983-12-07 半導体集積回路基板の鍍金治具

Country Status (1)

Country Link
JP (1) JPS6096840U (enExample)

Also Published As

Publication number Publication date
JPH0124934Y2 (enExample) 1989-07-27

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