JPS609184Y2 - Lid for spool case of bonding wire for semiconductors - Google Patents

Lid for spool case of bonding wire for semiconductors

Info

Publication number
JPS609184Y2
JPS609184Y2 JP7599780U JP7599780U JPS609184Y2 JP S609184 Y2 JPS609184 Y2 JP S609184Y2 JP 7599780 U JP7599780 U JP 7599780U JP 7599780 U JP7599780 U JP 7599780U JP S609184 Y2 JPS609184 Y2 JP S609184Y2
Authority
JP
Japan
Prior art keywords
lid
spool
semiconductors
container
bonding wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7599780U
Other languages
Japanese (ja)
Other versions
JPS5699850U (en
Inventor
修 佐藤
保 小泉
Original Assignee
田中電子工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 田中電子工業株式会社 filed Critical 田中電子工業株式会社
Priority to JP7599780U priority Critical patent/JPS609184Y2/en
Publication of JPS5699850U publication Critical patent/JPS5699850U/ja
Application granted granted Critical
Publication of JPS609184Y2 publication Critical patent/JPS609184Y2/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
  • Wire Bonding (AREA)

Description

【考案の詳細な説明】 本考案は半導体用ボンディングワイヤーのスプールケー
ス用蓋、詳しくは容器と蓋とで構成されるスプールケー
スの前記蓋の改良に関するもので、其の目的とする処は
開蓋時におけるスプールと蓋との離脱を容易にしてスプ
ールの抜は倒れを防ぎ、ホンディングワイヤーを保護す
る蓋を提供せんとすることにある。
[Detailed description of the invention] The present invention relates to a lid for a spool case of bonding wire for semiconductors, and more specifically, to an improvement of the lid of a spool case consisting of a container and a lid. To provide a lid that protects the honding wire by making it easy to separate the spool from the lid when the spool is removed and preventing the spool from falling down.

斯る本考案は容器に被嵌される蓋の内底中央に、筒状ス
プールを嵌合せしめる押え部を突出させるとともに該押
え部にスプールからの離脱を容易にする面取り部を形成
したことを特徴とする。
According to the present invention, a presser portion into which a cylindrical spool is fitted is protruded from the center of the inner bottom of a lid that is fitted onto a container, and a chamfered portion is formed on the presser portion to facilitate detachment from the spool. Features.

上記蓋はそれに被嵌される容器と共にスプールケースを
構成するが、該容器の形状は特に限定されるものではな
い。
The lid constitutes a spool case together with the container fitted thereon, but the shape of the container is not particularly limited.

本考案の実施例を図面により説明すれば、第1図及び第
2図は本考案の蓋1を示し、この蓋1はプラスチック材
を使用して真空成形法等により成型したものである。
An embodiment of the present invention will be described with reference to the drawings. Figs. 1 and 2 show a lid 1 of the invention, which is molded from plastic material by vacuum forming or the like.

蓋1は下面が開口する緩円錐梯形状に形成し、内底中央
部に押え部5を設けてなる。
The lid 1 is formed in the shape of a gently conical ladder with an open lower surface, and a presser portion 5 is provided at the center of the inner bottom.

押え部5は蓋1の内底面を平面形状円形に間接すること
によって内方(下方)へ突出状に形成される。
The presser portion 5 is formed to protrude inwardly (downward) by connecting the inner bottom surface of the lid 1 with a circular planar shape.

押え部5はその上縁から底壁にかけて滑らかな湾曲状に
形成して下部周縁に面取り部5′を設ける。
The holding part 5 is formed into a smooth curve from its upper edge to the bottom wall, and a chamfered part 5' is provided at the lower peripheral edge.

上記蓋1は、ホンディングワイヤーaを巻回した筒状ス
プールAに前記押え部5を嵌合い支持するものであり、
そのスプールAとの関係において蓋1はその深さく高さ
)をスプールAの長さと略同じ位に形成腰押え部5′の
径をスプールAの上部に密接しであるいはゆるく嵌合す
る大きさに形成する。
The lid 1 fits and supports the presser portion 5 on a cylindrical spool A around which a wire wire a is wound.
In relation to the spool A, the lid 1 has a depth and height approximately equal to the length of the spool A, and the diameter of the waist presser portion 5' is sized to fit closely or loosely into the upper part of the spool A. to form.

而して、断る蓋1の使用例を第3図により説明すれば、
前記スプールAは容器2の嵌合隆4に上方より挿し込ん
で嵌合い収容されるが、そうした後に蓋1を容器2の周
壁隆3外面に嵌込んで被嵌し、該蓋1の押え部5をスプ
ールAに嵌合い支持させる。
Therefore, an example of the use of the refusal lid 1 will be explained with reference to FIG.
The spool A is inserted into the fitting ridge 4 of the container 2 from above and is fitted into the spool A. After that, the lid 1 is fitted onto the outer surface of the peripheral wall ridge 3 of the container 2, and the presser part of the lid 1 is fitted. 5 is fitted onto spool A and supported.

尚、上記容器2はプラスチック材を使用して真空成形法
等により底型したものである。
Incidentally, the container 2 is made of a plastic material and has a bottom molded by a vacuum forming method or the like.

上記使用例において、スプールAを取出すべく開蓋する
際に、蓋1を真上に引上げないで蓋1の一辺をもって引
上げ開けた場合でも面取り部5′によって押え部5がス
プール上端からスムーズに離脱し、スプールAが容器2
の嵌合隆4から抜は倒れすることが防止される。
In the above usage example, when opening the lid to take out the spool A, even if one side of the lid 1 is pulled up and opened without pulling the lid 1 straight up, the holding part 5 can be smoothly removed from the upper end of the spool due to the chamfered part 5'. and spool A is container 2.
This prevents the fitting ridge 4 from falling when pulled out.

本考案は叙上の如く蓋の内底中央に押え部を突出させて
該押え部により筒状スプールを嵌合い支持するので、ス
プールをガタ付くことなく堅固に保持することができ、
又、前記押え部に面取り部を形成したので、開蓋の際に
押え部がスプール上端からスムーズに離脱腰開蓋の際の
スプールの転倒を防止することができる。
As described above, the present invention has a presser part protruding from the center of the inner bottom of the lid, and the cylindrical spool is fitted and supported by the presser part, so the spool can be firmly held without wobbling.
Furthermore, since the holding portion is formed with a chamfered portion, the holding portion can be smoothly removed from the upper end of the spool when the lid is opened, and the spool can be prevented from falling when the lid is opened.

従って、スプールの運搬途中あるいは開蓋時においてボ
ンディングワイヤーと容器との接触に伴なうワイヤーの
損傷や解きほぐれなどの従来不具合が解消されてワイヤ
ーを保護することができる。
Therefore, conventional problems such as wire damage and unraveling caused by contact between the bonding wire and the container during transportation of the spool or when opening the lid are eliminated, and the wire can be protected.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案蓋の断面図、第2図はその斜視図、第3
図は使用例を示すスプールケースの断面図である。 図中、1は蓋、2は容器、5は押え部、5′は面取り部
、Aはスプールである。
Fig. 1 is a sectional view of the lid of the present invention, Fig. 2 is a perspective view thereof, and Fig. 3 is a sectional view of the lid of the present invention.
The figure is a sectional view of a spool case showing an example of use. In the figure, 1 is a lid, 2 is a container, 5 is a holding part, 5' is a chamfered part, and A is a spool.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 容器に被嵌される蓋の内底中央に、筒状スプールを嵌合
せしめる押え部を突出させるとともに該押え部にスプー
ルからの離脱を容易にする面取り部を形成した半導体用
ホンディングワイヤーのスプールケース用蓋。
A spool of a honding wire for semiconductors, in which a holding part into which a cylindrical spool is fitted protrudes from the center of the inner bottom of a lid that is fitted into a container, and a chamfered part is formed on the holding part to facilitate detachment from the spool. Case lid.
JP7599780U 1980-05-30 1980-05-30 Lid for spool case of bonding wire for semiconductors Expired JPS609184Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7599780U JPS609184Y2 (en) 1980-05-30 1980-05-30 Lid for spool case of bonding wire for semiconductors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7599780U JPS609184Y2 (en) 1980-05-30 1980-05-30 Lid for spool case of bonding wire for semiconductors

Publications (2)

Publication Number Publication Date
JPS5699850U JPS5699850U (en) 1981-08-06
JPS609184Y2 true JPS609184Y2 (en) 1985-04-02

Family

ID=29666295

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7599780U Expired JPS609184Y2 (en) 1980-05-30 1980-05-30 Lid for spool case of bonding wire for semiconductors

Country Status (1)

Country Link
JP (1) JPS609184Y2 (en)

Also Published As

Publication number Publication date
JPS5699850U (en) 1981-08-06

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