JPS609183Y2 - Container for spool case of bonding wire for semiconductors - Google Patents
Container for spool case of bonding wire for semiconductorsInfo
- Publication number
- JPS609183Y2 JPS609183Y2 JP7599680U JP7599680U JPS609183Y2 JP S609183 Y2 JPS609183 Y2 JP S609183Y2 JP 7599680 U JP7599680 U JP 7599680U JP 7599680 U JP7599680 U JP 7599680U JP S609183 Y2 JPS609183 Y2 JP S609183Y2
- Authority
- JP
- Japan
- Prior art keywords
- container
- spool
- ridge
- bonding wire
- semiconductors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
Landscapes
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
- Wire Bonding (AREA)
Description
【考案の詳細な説明】
本考案は半導体用ホンディングワイヤーのスプールケー
ス用容器、詳しくは容器と蓋とで構成されるスプールケ
ースの前記容器の改良に関し、其の目的とする処はスプ
ールを堅固に係合保持した状態で収容し得て、開蓋時に
おけるボンディングワイヤーを保護できる容器を提供せ
んとすることにある。[Detailed description of the invention] The present invention relates to a container for a spool case of honding wire for semiconductors, and more specifically, to an improvement of the spool case consisting of a container and a lid. It is an object of the present invention to provide a container that can be housed in a state in which the bonding wire is engaged with the bonding wire and can protect the bonding wire when the lid is opened.
断る本考案は外周部に周壁隆を備えた容器の中央部に、
筒状スプールを嵌合せしめる嵌合隆を設け、該嵌合隆を
前記周壁隆より高く突出形成させたことを特徴とする。This invention refuses, in the center of the container with a peripheral wall ridge on the outer periphery,
A fitting ridge into which the cylindrical spool is fitted is provided, and the fitting ridge is formed to protrude higher than the surrounding wall ridge.
上記容器はそれを被嵌する蓋と共にスプールケースを構
成するが、該蓋の形状は特に限定されるものではない。The container constitutes a spool case together with a lid that fits the container, but the shape of the lid is not particularly limited.
上記嵌合隆は全高に渉り同一径の真円柱形あるいは緩円
錐梯形状の何れであってもよいが、後者形状の方がスプ
ールの着脱操作をする上で効果的である。The fitting ridge may have either a perfect cylindrical shape or a gently conical ladder shape with the same diameter over its entire height, but the latter shape is more effective in attaching and detaching the spool.
本考案の実施例を図面により説明すれば、第１図及び第
２図は本考案の容器１を示し、この容器１はプラスチッ
ク材を使用して真空成形法等により成型したものである
。An embodiment of the invention will be described with reference to the drawings. FIGS. 1 and 2 show a container 1 of the invention, which is molded from plastic material by vacuum forming or the like.
容器１はその外周縁に断面形状が略逆Ｖ字状の周壁隆３
を突出させるとともに中央部に嵌合隆４を突出状に形成
する。The container 1 has a peripheral wall ridge 3 having a substantially inverted V-shaped cross section on its outer periphery.
is made to protrude, and a fitting ridge 4 is formed in the central part in a protruding shape.
嵌合隆４は平面形状円形で且つ若干先細りのテーパを有
する緩円錐梯形状に形成する。The fitting ridge 4 is formed into a circular planar shape and a slightly tapered slightly conical ladder shape.
上記嵌合隆４の高さは周壁隆３よりも高く突出させる。The height of the fitting ridge 4 is made to protrude higher than the peripheral wall ridge 3.
而して斯る容器１の使用例を第３図により説明すれば、
容器１にはその嵌合隆４にボンディングワイヤーａを巻
回せる筒状のスプールＡを上方より挿し込んで嵌合い収
容する。An example of the use of such a container 1 will be explained with reference to FIG.
A cylindrical spool A around which a bonding wire a can be wound is inserted into the container 1 from above and fitted onto the fitting ridge 4 to accommodate the container.
このスプールＡとの関係において容器１は前記嵌合隆４
の高さをスプールＡの長さの２ｎ程度とし、嵌合隆４の
基端部外径をスプールＡの内径と略同−とする。In relation to this spool A, the container 1 is
The height of the fitting ridge 4 is approximately 2n of the length of the spool A, and the outer diameter of the proximal end of the fitting ridge 4 is approximately the same as the inner diameter of the spool A.
上記スプールＡを嵌合い収容した後に容器１には蓋２を
周壁隆３外面に嵌め込んで被嵌し、該蓋の土壁内面をス
プールＡ上縁に当接させてスプールＡを支持させる。After the spool A is fitted and housed, a lid 2 is fitted onto the outer surface of the peripheral wall ridge 3 of the container 1, and the inner surface of the clay wall of the lid is brought into contact with the upper edge of the spool A to support the spool A.
尚、上記Ｍ２はプラスチック材を使用して真空成形法等
により成型したもので、蓋２に設けた符号５はスプール
Ａの上部内に嵌合し合うよう突出させた押え部であり、
実施例ではこの押え部５によってスプールＡ上面を支持
した場合を示すが、蓋２は前記押え部５を突出させるこ
となく、すなわち平板状の内底面自体でスプールＡを支
持するようにすることも自由である。In addition, the above M2 is molded by a vacuum forming method using a plastic material, and the reference numeral 5 provided on the lid 2 is a presser part that protrudes so as to fit into the upper part of the spool A.
In the embodiment, a case is shown in which the upper surface of the spool A is supported by the presser part 5, but the lid 2 may also support the spool A with the flat inner bottom surface itself without protruding the presser part 5. Be free.
本考案は叙上の如く容器の中央部に嵌合隆を周壁隆より
も高く突出させてその全長を従来容器のそれより大きく
腰該嵌合隆にスプールを嵌め合うようにしたので、開蓋
時におけるスプールの抜は倒れが阻止できる程に堅固に
スプールが嵌合隆に係合保持される。As mentioned above, the present invention has a fitting ridge in the center of the container that protrudes higher than the surrounding wall ridge, and its total length is larger than that of conventional containers, so that the spool can be fitted into the fitting ridge, making it easy to open the lid. The spool is firmly engaged and held by the fitting protrusion so as to prevent the spool from falling when the spool is pulled out.
従って、スプールを取出すべく開蓋する際、蓋を真上に
引上げないで蓋の一辺をもって引上げ開けた場合でもス
プールは容器の嵌合隆にしっかりと保持され、スプール
の抜は倒れによるボンディングワイヤーと周壁隆とが接
触する従来不具合が解消されてワイヤーを損傷や解きほ
ぐれ等から保護することができる。Therefore, when opening the lid to take out the spool, even if you do not pull the lid straight up, but instead pull it open by holding one side of the lid, the spool will be firmly held on the fitting ridge of the container, and the spool will not be removed due to the bonding wire due to falling. The conventional problem of contact with the peripheral wall ridge is eliminated, and the wire can be protected from damage and unraveling.
第１図は本考案容器の断面図、第２図はその斜視図、第
３図は使用例を示すスプールケースの断面図である。
図中、１は容器、３は周壁隆、４は嵌合隆、Ａはスプー
ルである。FIG. 1 is a sectional view of the container of the present invention, FIG. 2 is a perspective view thereof, and FIG. 3 is a sectional view of a spool case showing an example of use. In the figure, 1 is a container, 3 is a peripheral wall protrusion, 4 is a fitting protrusion, and A is a spool.
Claims (1)
を嵌合せしめる嵌合隆を設け、該嵌合隆を前記周壁隆よ
り高く突出形成させた半導体用ボンディングワイヤーの
スプールケース用容器。A container for a spool case of bonding wire for semiconductors, wherein a fitting ridge into which a cylindrical spool is fitted is provided in the center of the container having a peripheral wall ridge on the outer periphery, and the fitting ridge is formed to protrude higher than the peripheral wall ridge. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7599680U JPS609183Y2 (en) | 1980-05-30 | 1980-05-30 | Container for spool case of bonding wire for semiconductors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7599680U JPS609183Y2 (en) | 1980-05-30 | 1980-05-30 | Container for spool case of bonding wire for semiconductors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5649142U JPS5649142U (en) | 1981-05-01 |
| JPS609183Y2 true JPS609183Y2 (en) | 1985-04-02 |
Family
ID=29309513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7599680U Expired JPS609183Y2 (en) | 1980-05-30 | 1980-05-30 | Container for spool case of bonding wire for semiconductors |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS609183Y2 (en) |
-
1980
- 1980-05-30 JP JP7599680U patent/JPS609183Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5649142U (en) | 1981-05-01 |
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