JPS6085841U - submount - Google Patents

submount

Info

Publication number
JPS6085841U
JPS6085841U JP17842283U JP17842283U JPS6085841U JP S6085841 U JPS6085841 U JP S6085841U JP 17842283 U JP17842283 U JP 17842283U JP 17842283 U JP17842283 U JP 17842283U JP S6085841 U JPS6085841 U JP S6085841U
Authority
JP
Japan
Prior art keywords
submount
metal layers
base
tin layer
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17842283U
Other languages
Japanese (ja)
Inventor
幸裕 笹谷
Original Assignee
住友電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友電気工業株式会社 filed Critical 住友電気工業株式会社
Priority to JP17842283U priority Critical patent/JPS6085841U/en
Publication of JPS6085841U publication Critical patent/JPS6085841U/en
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来のサブマウントの構造を示す断面図、第２
図は本考案のサブマウントの構造を示す断面図である。 １０．２０・・・・・・サブマウント基体、１１，２１
・・・・・・第１の金属層、１２，２２・・・・・・第
２の金属層、２３・・・・・・第１の錫層、２４・・・
・・・第２の錫層。Figure 1 is a sectional view showing the structure of a conventional submount;
The figure is a sectional view showing the structure of the submount of the present invention. 10.20...Submount base, 11,21
...First metal layer, 12, 22... Second metal layer, 23... First tin layer, 24...
...Second tin layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] サブマウント基体、該サブマウント基体の第１、第２の
主面上の小なくとも一部にそれぞれ形成された第１、第
２の金属層及び該第１、第２の金属層上の小なくとも一
部にそれぞれ形成された２μｍ以上１０μｍ以下の厚さ
を有する錫層を備えたことを特徴とするサブマウント。a submount base, first and second metal layers formed on at least a portion of the first and second main surfaces of the submount base, and small portions on the first and second metal layers; A submount comprising a tin layer having a thickness of 2 μm or more and 10 μm or less, each formed at least in a part of the submount.
JP17842283U 1983-11-18 1983-11-18 submount Pending JPS6085841U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17842283U JPS6085841U (en) 1983-11-18 1983-11-18 submount

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17842283U JPS6085841U (en) 1983-11-18 1983-11-18 submount

Publications (1)

Publication Number Publication Date
JPS6085841U true JPS6085841U (en) 1985-06-13

Family

ID=30387374

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17842283U Pending JPS6085841U (en) 1983-11-18 1983-11-18 submount

Country Status (1)

Country Link
JP (1) JPS6085841U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11896105B2 (en) 2020-05-12 2024-02-13 Lg Electronics Inc. Hair dryer
US12004623B2 (en) 2020-05-12 2024-06-11 Lg Electronics Inc. Hair dryer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11896105B2 (en) 2020-05-12 2024-02-13 Lg Electronics Inc. Hair dryer
US12004623B2 (en) 2020-05-12 2024-06-11 Lg Electronics Inc. Hair dryer

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